1. ECE 477 Final Presentation Group 9  Fall 2004 Paste a photo of team members with completed project here. Annotate this photo with names of team members. PranavMohnishSumit Brandon

2. Outline Project overviewProject overview Block diagramBlock diagram Professional componentsProfessional components Design componentsDesign components Success criteria demonstrationsSuccess criteria demonstrations Individual contributionsIndividual contributions Project summaryProject summary Questions / discussionQuestions / discussion

3. Project Overview Stand-alone device which will receive mp3 songs and play them on any stereo system.Stand-alone device which will receive mp3 songs and play them on any stereo system. The processor hosts the web-page to upload a file.The processor hosts the web-page to upload a file. Multiple users can upload files within the same network.Multiple users can upload files within the same network. Songs are received wirelessly and stored on the xD Card.Songs are received wirelessly and stored on the xD Card. Songs retrieved from the xD CardSongs retrieved from the xD Card and played on any stereo system via and played on any stereo system via the mp3 decoder. the mp3 decoder.

4. Project Motivation CRU Radiation UniverseCRU Radiation Universe Many PCs, One StereoMany PCs, One Stereo Reduce wiring and transportReduce wiring and transport HKN Lounge – social congregationHKN Lounge – social congregation

5. Project Specific Success Criteria 1.Ability to transfer MP3 files via wireless 802.11b link (from a remote host) 2.Ability to save/load MP3 file to/from xD card 3.Ability to decode/play an MP3 file 4.Ability to display song information on LCD 5.Ability to control mode of operation via a keypad

6. Block Diagram

7. Professional Components Constraint analysis and component selection rationaleConstraint analysis and component selection rationale Patent liability analysisPatent liability analysis Reliability and safety analysisReliability and safety analysis Ethical and environmental impact analysisEthical and environmental impact analysis

8. Constraint Analysis Rabbit RCM3360 Core ModuleRabbit RCM3360 Core Module STA013 MP3 Decoder ChipSTA013 MP3 Decoder Chip Power and Current ConstraintsPower and Current Constraints

9. Rabbit RCM3360 Core Module Readily available TCP/IP libraries for network transferReadily available TCP/IP libraries for network transfer 7 parallel, 6 serial I/O ports7 parallel, 6 serial I/O ports Dynamic C written for Rabbit microcontrollersDynamic C written for Rabbit microcontrollers Integrated xD storage CardIntegrated xD storage Card

10. STA013 MP3 Decoder Easy SPI Interface for sending dataEasy SPI Interface for sending data Commands sent separately on I2C busCommands sent separately on I2C bus providing more bandwidth for music stream.

11. Patent Liability Analysis Patent #6,728,585Patent #6,728,585 –On-Demand Audio Entertainment System InfringementsInfringements –Wireless technology –Solid state memory storage SolutionsSolutions –Strictly IEEE 802.11b –Removable xD card

12. Patent Liability Analysis Patent #6,684,060Patent #6,684,060 –Digital Wireless premises audio system InfringementsInfringements –Wireless transmission of data –Dolby Surround 5.1 standards SolutionsSolutions –Strictly IEEE 802.11b –Stereo level line output

13. Reliability/Safety Analysis Analysis for 10^6 operational hoursAnalysis for 10^6 operational hours Failure rate of 10^-5Failure rate of 10^-5 MTTFMTTF –Rabbit Micro controller 110,781 hours110,781 hours –STA013 Mp3 Chip 144,000 hours144,000 hours –Capacitors 166,000 – 6,250,000 hours166,000 – 6,250,000 hours –Voltage Regulator 280,000 hours280,000 hours

14. Reliability/Safety Analysis

16. Ethical Analysis Ethical ChallengesEthical Challenges –Testing –Warning Labels –Cautions in Manual –Copyright Issues

17. Environmental Analysis Environmental ImpactEnvironmental Impact –Minimize power consumption –No harmful radiations –Lead free, non ozone-depleting chemicals –EPA guidelines for parts disposal

18. Design Components Packaging design considerationsPackaging design considerations Schematic design considerationsSchematic design considerations PCB layout design considerationsPCB layout design considerations Software design considerationsSoftware design considerations

19. Packaging Design

21. Commercial Products Motorola SimplefiMotorola Simplefi Netgear MP101Netgear MP101

22. Schematic Design Schematic Design

23. MP3 Chip Schematic

24. Keypad and LCD Schematic

25. Power Supply Schematic Power Supply Schematic

26. PCB Layout Design PCB Layout Design

27. PCB Layout PCB Layout

28. Top Layer

29. Bottom Layer

30. PCB Design Considerations Place crystals close to their respective chipsPlace crystals close to their respective chips Avoid 90 o angle traces to reduce capacitanceAvoid 90 o angle traces to reduce capacitance Use 40 mil traces for power and groundUse 40 mil traces for power and ground Use copper pour for heat dissipation and noise reductionUse copper pour for heat dissipation and noise reduction Well defined ground system to minimize noiseWell defined ground system to minimize noise

31. Overall Software Design Overall Software Design

32. Software Design Considerations Modular Software DesignModular Software Design –Each module as a separate library –Ease of debugging Correct Initialization sequenceCorrect Initialization sequence –sock_init() must be the first to be initialized –Otherwise resets the I/O ports Short Interrupt Service RoutinesShort Interrupt Service Routines –Problems with executing bigger code chunks in ISR –Otherwise, results in unexpected code execution MP3 InterfaceMP3 Interface –Maintaining continuous bit stream –Co-exist with the http handler

33. Software Design Considerations FAT File systemFAT File system –Formatted xD Card with FAT file system –Ease of storing and retrieving Mp3 files

34. Video Demonstration Video Demonstration

35. Individual Contributions Team Member 1 – Mohnish RathiTeam Member 1 – Mohnish Rathi Team Member 2 – Sumit MehraTeam Member 2 – Sumit Mehra Team Member 3 – Brandon FaneTeam Member 3 – Brandon Fane Team Member 4 – Pranav KabraTeam Member 4 – Pranav Kabra

36. Mohnish Rathi DocumentationDocumentation –Schematic –Patent Liability Analysis HardwareHardware –Power Supply –Packaging “Ekshun!”“Ekshun!”

37. Sumit Mehra DocumentationDocumentation –PCB layout –Reliability & Safety Analysis Chief Software ArchitectChief Software Architect –Code Author “Play Pause!”“Play Pause!”

38. Brandon Fane DocumentationDocumentation –Packaging Specifications –Design Constraint Analysis HardwareHardware –PCB populator –Power supply –Packaging “Somewhere Over The Rainbow”“Somewhere Over The Rainbow”

39. Pranav Kabra DocumentationDocumentation –Software Design Narrative –Ethical/Environmental Analysis –User Manual Packaging DesignPackaging Design Schematic DesignSchematic Design

40. Project Summary Important lessons learnedImportant lessons learned –Match your footprints before sending for layout –Use pull-up resistors with open drain inputs –Sleeping bags must be mandatory for students enrolled in ECE 477 (Bunk beds would be awesome)

41. c|r|u 2.0 Serial communication in assemblySerial communication in assembly Improvements on PCB LayoutImprovements on PCB Layout Parallel to Serial shift register to send data to MP3 chipParallel to Serial shift register to send data to MP3 chip Better packagingBetter packaging Additional control featuresAdditional control features

42. Questions / Discussion Questions Anyone???