1. NeSSI*: Shiftin’ Gears “Moving to the Project Stage” CPAC - Seattle, WA - May 6, 2002 Rob Dubois - Peter van Vuuren - Jim Tatera. “the best way to predict the future is to create it” Tatera and Associates *New Sampling/Sensor Initiative

2. 2 Presentation Outline zSummary of NeSSI Objectives & Drivers zActivities Update z[Quick] Gen I, II, III Comparison zProject Plans zProgress Rating of Gen II Elements zInstalls & Late Breaking Developments zSummary and Acknowledgements

3. Courtesy of Owen Beattie, University of Alberta, Canada Question: Is Process Analytical frozen in time? Answer: No! A renaissance is in progress. John Torrington Chief Petty Officer on the HMS Terror - preserved in the permafrost. Victim of lead poisoning. ”The Franklin Expedition” d. 1846 (age 20)

4. 4 NeSSI Structure zAn ad hoc global industry initiative, formed in June, 2000 to drive permanent change in how we do Process Analysis. yNeSSI mail-out has now grown to 300+ subscribers xRepresents over 31 End Users from Oil and Petrochemical as wells as Manufacturing Companies, Academia, National Labs, etc. zCenter for Process Analytical Chemistry (CPAC) is our sponsor and legal umbrella

5. 5 NeSSI Objectives zFacilitate the acceptance/implementation of... ymodular, miniature & smart process analytical technology zPromote the concept of... yat the pipe/field-mounted (“byline”) analytical systems zLay the groundwork for... yopen connectivity communication architecture zProvide a technology bridge to the process for... y“sensor/lab-on-a-chip” microanalytical devices

6. 6 * Posted on CPAC website Activities Update zActivities since Fall CPAC, 2001 yTutorial - INTERMAC November, 2001 [Tokyo] yPlenary Paper, Session & Roundtable - IFPAC Jan2002 [San Diego]* yTalk - IEC SC65D Maintenance Mtg, Feb. 2002 [Frankfurt] y“UMIX” & Workshop Pittcon March, 2002 [New Orleans]* yTalk: IEC SC65D Full Committee Mtg, April, 2002 [Beijing] yTutorial & Session - ISA Analytical Div. April, 2002 [Denver] yX-team (hazardous area focus group) activities completed yNeSSI Marketing Survey - Included in AD newsletter

7. 7 NeSSI Generation Segmentation Pyramid Gen III Gen II Gen I Mechanical (mostly) Electrical/Smart (Diagnostic) MicroAnalytical & Wireless Value

8. 8 Gen I - Mechanical miniature, modular footprint z Adapted from the semicon industry z LEGO ® like design z ISA SP76 Standard Courtesy of Swagelok

9. 9 Gen II System Plug and Play Electrical Programmable Substrate Heater V P A F Ethernet LAN Analyzer Controller or PC SAM CANbus PDA Auxiliary Heating/Cooling Substrate T T

10. 10 Gen III System Plug & Play  Analytical SAM Fiber Optic AT One sensor per component “lab on a chip” One Sensor and Multiple Analytes Ethernet LAN Enabling Technology for  Analytical V T A A

11. 11 Gen III Plug & Play Wireless Signal Ethernet LAN V T P A zBluetooth , 802.11 Wi-Fi zPower Supplied by... yX-proof MINI bus y...or IS miniature power bus P.S. SAM

12. 12 Gen I Installs & Tests in progress... Coutesy of a gulf coast petrochemical facility Courtesy of an east coast petrochemical facility and Parker-Hannifin

13. 13 Gen II Development Campaign Lead - Honeywell Labs/Ulrich Bonne 1. Finalize NeSSI Gen II spec 2. Fabricate an alpha unit. Lab evaluate. 3. Fabricate 10-20 beta units. Field tests years 2004 4. 2005 Commercial Product available

14. 14 Gen II Development Involvement and Funding z$1-2M funding request to DoE-OIT ySubmit White Paper (June 2002) z50% of funding to be borne by “prototype testers” as “work in kind” ycommitment of $50K/participant yExxonMobil Chemical, Air Products, ChevronTexaco, Honeywell, Dow yWe would like 10-20 participants! zPossibly other funding sources (eg ATP)

15. 15 Generation II Dimensions Progress to Date... 1. Programmable Substrate 2. mini-Sensors 3. “Combi” Valve 4. SAM - Sensor/Actuator Manager 5. PC/PDA with HMI* [Wireless] 6. Multi-Drop IS Bus 7. Micro Climate Enclosure * HMI = Human Machine Interface

16. 16 1. Programmable substrate temp. IEC Ex d Div/Zone 1 Haz. Locations AC Power Purpose Maintain the substrate/sample at the appropriate temperature to maintain dewpoint and optimize & simplify sample heating. Improve reliability, minimize utility load and reduce LTCO. Strengths Available from certain “solid block” substrate mfgs. Commercial technology avail. Weaknesses Difficult to implement in substrate suspended designs No IS version of control portion 4/10

17. 17 2. mini-Sensors IEC Ex ia (low power) Haz. Location FLOW PRESSURE TEMP Substrate A/D Comm. µP Memory A 4/10 Purpose Provides measurements for validation and control. Simplify and standardize. Lower cost implementation. Increase reliability by increased vigilance of the system and reduce maintenance by predictive as opposed to preventive maintenance. Strengths Excellent results from Honeywell - this appears to be the genesis of process ready mini instrumentation suitable for use in hazardous locations. Suspect wide applicability in industry as well as analytical. Enables plug and play with extremely low power. Weaknesses Currently untried in industry. We need to know the operating characteristics such as range, accuracy, robustness, etc.

18. 18 Smart T-Comp. TC Sensor Smart T-Comp Flow Sensor 17 mm Smart T-Comp Flow Sensor

19. 19 3. “COMBI” Valve IEC Ex ia Low Power Haz. Location A Actuator Instrument Air Valve Vent Comm. D/A Solenoid Pneumatic valve 3/10 Purpose On/off and/or modulation of sample and validation fluids. Combining a pneumatic valve and solenoid in one package simplifies design. Low power gives plug and play & multi- drop capabilities. Safe design reduces maintenance. Strengths Some commercial products for the pilot valve are available. C/w haz. certifications and very low (1.45 mA) power drain. Weaknesses No one has integrated this product into a 1.5” substrate. No modulation product.

20. 20 4. Sensor/Actuator Manager Ex d microPC c/w CE operating system Gateway to an Ethernet LAN Host to a Sensor/Actuator Bus Wireless Field Interface to HMI Software Applets “Open” Development Space 3/10 Purpose Standardizes repetitive operating tasks and provides networking hardware. Strengths Simplify maintenance across all platforms. Reduces design engineering. Weaknesses - Competes with some product offerings of existing analytical mfgs. - No standards for applets - foundation like organization req. for over-sight. - Cost and size must be minimized. Remains to be seen if this can be accomplished.

21. 21 5. Graphical HMI* Intrinsically Safe Field PC/PDA PDA/PC HMI V T P A * HMI = Human Machine Interface Purpose Allows field adjustment and interrogation of an analytical system. (mimics remote PC) Simplifies and uncomplicates maintenance by standardizing interface. Strengths Commercial Intrinsically Safe PC’s, PDA’s available. One unit may service many field devices. Weaknesses Haven’t set whether IrDA, Bluetooth or Wi-Fi wireless. Need standard way to do HMI software. Oversight needed. SAM 5/10

22. 22 6. Serial Multi-drop Bus Ex ia Intrinsically Safe V T P A CANbus Purpose Simplify maintenance. Vendors can sell their product with “value added” software applets on board their devices. Plug and Play with no gas test. Strengths Many existing multi-drop buses and software. DeviceNet has critical mass in the industry for a bit bus. Low cost. Weaknesses Confusion and lack of thrust on identifying an IS product (and cost) to do this properly. 2/10

23. 23 7. MicroClimate Enclosure Div/Zone 1 GP. A-D, T4 Purpose Provides a practical temperature controlled microenvironment to handle sampling and analytical equipment in varied climatic conditions “in the field”. Simplifies design. Strengths All technology available to implement. Simplifies design by standardizing on an area classification inside the enclosure which accounts for any hazardous fluid leakage. Weaknesses Cooling not addressed at this time. 6/10

24. 24 Announced at Pittcon... Courtesy of Applied Analytics (also Wilks) MIR ATR

25. 25 The Race to the Pipe What will it be? An In-ey or Out-ey? Suggest both... “Like a thermocouple” [in situ - inline] In-ey “Like a pressure transmitter” [ex situ - byline] Out-ey Analytical sensor (typ.) tx SS

26. 26 Acknowledgements End Users zDow yDanny Quevillon yReg Hartwig yBac Vu (SP76) yCraig Snook yWalter Henslee zAir Products yFrank Schweighardt zChevronTexaco yD. Nettles/D. Young z ExxonMobil Chemical yDan Podkulski (SP76) yJeff Gunnell yJohn Cumbus yRajko Puzic yKelley Bell z Honeywell yKenneth Creasy yJohn Mosher yUlrich Bonne yBob Nickels

27. 27 Summary... zGen I products achieving traction in industry zRapidly moving from the definition stage to the project stage on Gen II zSome technical opportunities... zWhite Paper to be submitted to DoE zLooking for (more) “beta” Partners