1. Report of Technical Vice President Rolf Aschenbrenner IEEE CPMT BOG

2. Technical Committees Currently 17 „active“ Technical Committees TC-Opto Fiber Optics and Photonics Resignation of Prof. Frank G. Shi as TC Chair Probable Succesor: Dr. Sue Law, Australian Photonics /OFTC TC-Assy IC and Package Assembly Vacant 12 TC web pages are up to date

3. Technical CommitteeRemarksLast Update EvaluationNext Meeting TC-M Materials TC Chair: Rajen Chanchani r.chanchani@ieee.org conferences only until 11/01, Future plans only until 2001 Link web assets: does not work 11/12/2003good structure, but too few links, has to be updated (activities, plans etc.) ECTC 2004 TC-ASTR Accelerated Stress Testing and Reliability TC Chair: Mark Gibbel mark.gibbel@jpl.nasa.gov in comparison with other web pages relatively little information, past workshop presentations, e-mail forum 01/22/2004clearly structured and topical, there could be more information about the work of the committee and future activities TC-Opto Fiber Optics & Photonics probable future TC Chair: Sue Law s.law@oftc.usyd.edu.au little information04/11/2003more detailed information would be desirable ECTC 2004 TC Test Electrical Tests TC Chair: Bruce Kim Bruce.Kim@asu.edu hardly any information (maybe because they are looking for a webmaster) 04/01/2004more detailed Information would be desirable TC EDMS Electrical Design, Modeling and Simulation TC Chair: Madhavan Swaminathan madhavan.swaminathan@ee.gatec h.edu very clearly structured, informative, optically appealing, minutes only until March 2001, not all links work (e. g. conferences), links to CPMT’s homepage and journal 11/07/2003the best web page concerning structure, richness of information and links, has to be updated TC Therm Thermal Management and Thermo-Mechanical Design TC Chair: Tony Mak t.mak@ieee.org little information, links function11/07/2003more detailed information would be desirable ECTC 2004

4. Technical CommitteeRemarksLast Update EvaluationNext Meeting TC-Ed Education TC-Chair: Rao Tummala rao.tummala@ee.gatech.edu very short, no links, little information03/24/2004not very imaginative, more detailed information would be desirable TC-ECCC Electrical Contacts, Connectors and Cables TC Chair: Jerry Witter g.witter@ieee.org links work, a lot of information about past and future activities 07/24/2003In comparison with the previous web pages relatively informative TC-DIP Discrete and Integral Passives TC Chair: Leonard W. Schaper schaper@uark.edu short and clearly structured, links work03/24/2004there could be more information TC-Assy IC and Packaging Assembly TC Chair: Vacant completely out-of-date, little informative06/12/1998has to be updated urgently TC-HDSB High Density Substrates and Boards TC Chair: Yoshitaka Fukuoka weisti.fukuoka@rose.zero.ad.jp newsletter informs about activities, besides not very informative 04/01/2004Could be more informativeECTC 2004 TC-MEMS MEMS and Sensor Packaging TC Chair: Erik Jung erju@izm.fhg.de very good structure, the category links does not work 01/26/2003has to be updatedECTC 2004

5. Technical CommitteeRemarksLast Update EvaluationNext Meeting TC-NANO Nano Packaging TC Chair: Rao Tummala rao.tummala@ee.gatech.edu very well structured and informative web page, little information about past activities and publications 03/24/2004the second-best web page, completely up-to-date ECTC 2004 TC-PEP Power Electronics Packaging TC Chair: Douglas Hopkins d.hopkins@ieee.org little informative and out-of-date06/09/2000has to be updated urgently, more detailed information would be desirable TC-RF+W RF and Wireless TC Chair: Craig A. Gaw c.a.gaw@ieee.org not very informative, a little bit confusing because of the little font, out-of-date 03/21/2001has to be updated, more detailed information would be desirable ECTC 2004 TC-SP Systems Packaging TC Chair: Erich Klink eklink@de.ibm.com very short, information about past and future events 01/07/2004could be more informative, completely up-to-date TC-WLP Wafer Level Packaging TC Chair: Michael Töpper michael.toepper@izm.fhg.de out-of-date, link to ECTC 2004 (despite of the date of the last update) 09/28/2000not very informativeECTC 2004 TC-EM Electronics Manufacturing TC Chair: Walter J. Trybula w.trybula@ieee.org short outline, only one link to submit papers old TC chair listed 06/12/1998could be created in a more imaginative way, has to be updated urgently TC-GEMP Green Electronics, Manufacturing and Packaging TC Chair: Hansjörg Griese griese@izm.fhg.de good structure, all main information about upcoming conferences and meetings 03/24/2004well-structured and informative web page

6. Discussion of the Technical Committees within CPMT 17 TCs at various levels of activities Idea from Paul (similar to Computer Society): first level: „Task Force“ during the start up phase (for several years) second level:Technical Committee (when the „Task Force“ becomes active, has a core of members and is of importance for the community)

7. NEMI Roadmap Committees 2002 and 2004

8. NEMI Roadmap Committee Name NEMI Roadmap Committee 2002 Chair / Co-chair NEMI Roadmap Committee 2004 CPMT Members Board AssemblyKirk Van Dreel (Plexus Corp.), Dennis Krizman (Celestica) - Chairs Dr. Dongkai Shangguan, Flextronics Dongkai.Shangguan@flextronics.com Digital SiliconPaolo Gargini (Intel) – Chair Alan Allan (Intel) – Co-Chair Walter J. Trybula, International Sematech, Manufacturing TC Chair w.trybula@ieee.org DisplayM. Robert Pinnel (U. S. Display Consortium) – Chair J. Norman Bardsley (U. S. Display Consortium) – Co-Chair Dr. Ephraim Suhir suhirE@aol.com Electronic ConnectorsJohn L. MacWilliams (Bishop & Assoc.) - ChairGerry Witter, Chugai USA Inc., Electrical Contacts TC Chair, g.witter@ieee.org Energy Storage SystemsDaniel H. Doughty (Sandia National Laboratories) – Chair Ralph J. Brodd (Broddarp of Nevada, Inc.) –Co-Chair Douglas Hopkins, State University of New York at Buffalo, Power Electronics Packaging TC Chair d.hopkins@ieee.org Environmentally Conscious Electronics Mark Newton (Apple) –ChairHansjörg Griese, Fraunhofer Institute for Reliability and Microintegration, Green Electronics TC Chair griese@izm.fraunhofer.de Final AssemblyMike Reagin (Delphi Delco Electronics) – Chair Reijo Tuokko (Tampere University of Technology) – Co-Chair Interconnect Substrates – Ceramic Howard Imhof (Metalor, Inc.) –Chair Interconnect Substrates – OrganicJohn T. “Jack” Fisher (NEMI) – Chair Dieter Bergman (IPC) – Co-Chair Mass Data StorageT. M. Coughlin (Coughlin Assoc.) – Chair R. F. Hoyt (IBM) – Co-Chair

9. NEMI Roadmap Committee Name NEMI Roadmap Committee 2002 Chair /Co-Chair NEMI Roadmap Committee 2004 CPMT Members Modeling, Simulation and Design Tools Sanjeev Sathe (EIT) – Chair Koneru Ramakrishna (Motorola) – Co-Chair Walter J. Trybula, International Sematech, Manufacturing TC Chair w.trybula@ieee.org OptoelectronicsJohn W. Stafford - Chair Dr. Laura Turbini - Co-Chair PackagingJoe Adam (Skyworks) - ChairErik Jung, Fraunhofer Institute for Reliability and Microintegration, MEMS and Sensor Packaging TC Chair erju@izm.fraunhofer.de Passive ComponentsTBD – Chair Joseph Dougherty (Penn State University) – Co-Chair Leonard W. Schaper, University of Arkansas, Discrete and Integral Passives TC Chair schaper@uark.edu Product Lifecycle Information Management TDB – Chair Barbara Goldstein (National Institute of Standards and Technology) –Co- Chair Walter J. Trybula, International Sematech, Manufacturing TC Chair w.trybula@ieee.org RF-ComponentsVijay Nair (Intel) – Chair Steve Kenney (Georgia Institute of Technology) – Co-Chair Eric Strid (Cascade Microtech) – Co-Chair Craig A. Gaw, Motorola Inc., RF and Wireless TC Chair c.a.gaw@ieee.org Test, Inspection and MeasurementMichael J. Smith (Teradyne) – ChairBruce Kim, Center for Solid State Electronics Research, Electrical Test TC Chair Bruce.Kim@asu.edu Thermal ManagementTom Roth, Cam Murray 3M – ChairsTony Mak, Dallas Semiconductor, Thermal/Thermomechanical TC Chair t.mak@ieee.org

10. Involvement in the NEMI Roadmap Committee

11. 1.Time 40-50 man-hours from March until October at least one hour per week for telecons time for researching issues and preparing write-ups time for reviewing the overall chapter

12. 2.Personal Benefit Chance to work with peers in other companies and gain insight in what they are doing overview of industry direction set industry direction and define future research needs

13. 3.Benifits for CPMT insight into „hot topics“ in industry better ability to define workshops and conferences 4.Company Support Company support is necessary because of the time involved and the nature of the work