1. FEE + ROC cooling S. Popescu CERN, U. Frankenfeld, H.R. Schmidt GSI

2. 12.2.2004TPC meeting2 IROC in Thermal Box + 4 FEC (3.1) Lauda System PUMP IROC Lauda System T8 T9 T10 T12 T13 T11 T7T6T5 Inside: Sensors on pad plane T8 FEC T14 T15 Separate cool. circuits for chamber + FEC Sensors on FEC cool. plates ~10cm

3. 12.2.2004TPC meeting3 FEC IN Thermal Box T=21 ˚C Chamber cool. T=21˚C Cooling In Temp sensors PS Cooling Out

4. 12.2.2004TPC meeting4 Input Cooling circuit Output Cooling circuit Chamber Cooling circuit 4 FEC (3.1) ~10.5 W/card (3.2: ~6.9 W/card) T11 T9T10 T12 IROC

5. 12.2.2004TPC meeting5 ELMB PT1000 two wire sensors connected Can Bus port

6. 12.2.2004TPC meeting6 Cooling plate Inner screws T14

7. 12.2.2004TPC meeting7 Single card w/o inner screws LV OFF LV ON ΔT ~5.5 ˚C ΔT cooling plates

8. 12.2.2004TPC meeting8 Card w/o inner screws in set-up LV ON LV OFF ΔT ~4 ˚C ΔT cooling plates

9. 12.2.2004TPC meeting9 Single card with all screws All screws in ΔT ~1 ˚C ΔT cooling plates

10. 12.2.2004TPC meeting10 Chamber cooling ~ 50 minutes Cc off Cooling circuit on chamber Pad

11. 12.2.2004TPC meeting11 Chamber cooling All circuits 21˚C Chamber 21 -> 19.5 ˚C ΔT ~1.5 ˚C chamber cooling chamber pads

12. 12.2.2004TPC meeting12 Chamber cooling All circuits 21˚C Gradients on the pad plane ΔT ~0.08 ˚C pad under FEC pad

13. 12.2.2004TPC meeting13 ΔT ~0.18˚C Δt ~ 30 min LV OFF LV ON Heat transfer to pad plane Pad under FEC

14. 12.2.2004TPC meeting14 Heat transfer with cable Chamber 21˚C FEE cooling 19˚C Thermal box 21˚C Heat transfer: ~0.19˚C pad under FEC pad LV ON | LV OFF

15. 12.2.2004TPC meeting15 Heat transfer without cable Chamber 21˚C FEE cooling 19˚C Thermal box 21˚C Heat transfer: ~0.15˚C pad under FEC pad LV ON | LV OFF

16. 12.2.2004TPC meeting16 Compensation 19-24 ˚C LV OFF LV ON LV OFF FEC cool:T=19 ˚C T=24 ˚C T=19 ˚C T=24 ˚C

17. 12.2.2004TPC meeting17 Temperature cooling FEE 19->24 ˚C ΔT ~ 0.14˚C pad under FEC pad

18. 12.2.2004TPC meeting18 Compensate: Switching ON ΔT ~ 0.05˚C pad under FEC pad

19. 12.2.2004TPC meeting19 Compensate: Switching OFF pad under FEC pad FEC cool. temperature (scaled)

20. 12.2.2004TPC meeting20 Compensate: Switching OFF ΔT ~ 0.06˚C pad under FEC pad

21. 12.2.2004TPC meeting21 Compensation (16-21˚C) LV OFF LV ON LV OFF FEC cool: T=21˚C T=16˚C T=21 ˚C

22. 12.2.2004TPC meeting22 Compensation (16-21˚C) ΔT ~ 0.05˚Cpad under FEC pad LV ON LV OFF

23. 12.2.2004TPC meeting23 Summary + Conclusion Setup with 4 FEC (Ver. 3.1) 10.5 W per Card Heat transfer between both sides of cooling plates thru screws: Single sided cooling? Chamber circuit for stabilization not compensation –Time constant Δt ~ 50 min Heat transfer FEC -> pads –Time constant Δt ~ 30 min –~0.19 ˚C with cable –~0.14 ˚C without cable Compensation with Cooling temperature per sector –Test setup: Compensation on pads with ΔT ~ 0.05 ˚C