1. Hsinchu, Taiwan December 6, 2000 1 International Technology Roadmap for Semiconductors (ITRS 2000) Assembly & Packaging International Technical Working Group December 6, 2000

2. Hsinchu, Taiwan December 6, 2000 2 2000 Changes Cost/pin –Hand Held, Cost Performance upper range costs were lowered – Hand Held, Cost Performance, Harsh, Memory cost labeled as “No Known Solution” due to increases which will be driven by new environmental materials –Memory for 2001 determine how to address memory categories for 2001 update –deal with increasing complexity –incorporate performance memory

3. Hsinchu, Taiwan December 6, 2000 3 2000 Changes Chip Size –incorporated ORTC data cost-performance have minor changes high performance decreases 20-30% memory increases 20-30% –determine how to address small chip issues that are highly cost sensitive (RF/mixed signal) in 2001 Power –High Performance-minor increases Core Voltage –Harsh- more rapid migration to 1.8V

4. Hsinchu, Taiwan December 6, 2000 4

5. 5 2000 Changes Pincount –Harsh- verify high end of range starting in 2000- check Europe, Japan, U.S. –High Performance- reconcile w/ Jisso Package Profile –determine how to address stacked chips and thin/flexible packaging in 2001

6. Hsinchu, Taiwan December 6, 2000 6 2000 Changes Performance on chip –Cost Performance, High Performance- matched to Design ITWG values –Memory- accelerated 166 and 200Mhz introductions for system memory and peripheral bus speed –review all other categories/ reconcile w/ Jisso

7. Hsinchu, Taiwan December 6, 2000 7 2000 Changes Performance chip to board –Cost Performance- accelerated 166 and 200 Mhz introductions consistent w/ Memory changes –High performance- numbers look to be in error- should be 50% of on chip numbers ?!?! –need a new way to deal with game products (consider making it the high end of Low Cost) in 2001

8. Hsinchu, Taiwan December 6, 2000 8 2000 Changes Junction Temperature –determine how to address need for 150 C junction for in cabin automotive application (add to Harsh or change another category in 2001 update) –Hand Held- determine how to reconcile w/ Jisso roadmap which shows 100C for 2000 Operating Temperature –High Performance- need to reconcile w/Jisso –Hand Held- need to reconcile w/Jisso

9. Hsinchu, Taiwan December 6, 2000 9

10. 10 Key Issues for 2001 Market sector redefinition cost of new environmentally friendly materials MEMS sensors (eg. Pressure and acceleration) relays (eg. Cell phone transmit/receive switch) Optical interconnect SCP, SIP, MCP,MCM, substrate distinctions Performance memory Gaming products- where do they fit? Stacked/ultra thin chip packaging Small chip issues (RF/mixed signal)

11. Hsinchu, Taiwan December 6, 2000 11 Assembly & Packaging Potential Solutions

12. Hsinchu, Taiwan December 6, 2000 12 2000 Changes Chip to Next Level Interconnect –aggressive acceleration of wire bond pitch 20012002200320042005 ball bond (um)4535302520 wedge (um)4035302520 – some acceleration of area array flip chip pitches area array (um)175175150150130 peripheral (um)150130120110100 –removed TAB –add Flip Chip on Tape/Chip on Flex category

13. Hsinchu, Taiwan December 6, 2000 13 Chip Interconnect Solutions