1. 1 C osmic dust R eflectron for I sotopic A nalysis (CRIA) Critical Design Review September 26, 2007 Laura Brower: Project Manager Drew Turner: Systems Engineer Loren Chang Dongwon Lee Weichao Tu

2. 2 Agenda Organization System Design & Requirements Subsystem Design Test Plan Project Management Plan

3. 3 Professional B. Lamprecht (LASP) Professional S. Steg (LASP) Professional M. Rhode (CU) Organizational Structure Customer Z. Sternovsky Administration System Engineer Electronics Thermal Structures Project Manager L. Brower CU Advisors X. Li S. Palo Student Lead D. Turner Student Lead L. Brower Student Lead W. Tu Professional V. Hoxie (LASP) Student Lead D. Turner Professional M. Lankton (LASP) P. Graf Student Lead B. Hodgkinson N. Little Student Lead D. Lee Professional G. Drake (LASP) Materials Student Lead L. Chang Experienced Graduate K. Amyx (CU) Ion Optics Student Lead D. Turner Detector Manufacturing Professional G. Drake (LASP)

4. 4 Agenda Organization System Design & Requirements Subsystem Design Test Plan Project Management Plan

5. 5 System Level Diagram Supporting Electronics Instrument Electronics Structure Thermal Control Mass Analyzer DetectorAnalyzerIonizer High voltage supply Oscilloscopes Computer Power source Charge Sensitive Amplifier Voltage dividers Heaters Thermocouples (Gray area) (Target)Annular electrodes Ring electrodes Grounded grids Line Key Power High Voltage Heat Data

6. 6 Minimum Success Criteria Achieve working instrument with mass resolution of at least 100 m/Δm (Req: 1.TR2) Achieve TRL-5: Working prototype tested in relevant environments (Req: 1.TR4) 2. Hardware budget < $30k 3. Cleanliness reqs for Vac chambers 1. Meet assembly tolerances 4. Electronics accuracy Key Build/Test Phase Requirements Flowdown?

7. 7 Agenda Organization Background System Design & Requirements Subsystem Design Project Management Plan

8. 8 IonizerDetector Analyzer Structures Structural Design Fabrication Plan Thermal Electronics/ CDH Structures Subsystem Lead: Drew Turner Speakers: Drew Turner, Dongwon Lee Assembly Plan

9. 9 Structure: Requirements Overview Req No.DescriptionReq Met?Verification Method 3.4DC1Scaling of Ion optics by 5/8 th of LAMA ion optics YesCAD design 3.4DC6, 3.4DC7, 3.4DC8 Electrically isolate high voltagesCAD design, electronics potting, functional test 3.4DC5Structure mass < 15 kgYesCAD estimate 11.7 kg 3.4DC10, 3.4DC11 Light cannot enter instrument except at aperture YesCAD design 2.DC2Minimize outgassing Vac test with Noryl insulators

10. 10 Hexagonal Structure: Overall Characteristics Unique Parts29 Total No. of Mnf. Parts 96 Mass11.64 kg Fasteners<300* *Not including instrument-spacecraft interface *All blind fasteners will be vented

11. 11 Structure: Parts Summary

12. 12 Structure: Parts Summary

13. 13 Assemblies Annular Electrode Assembly Target Assembly Main Housing Assembly Detector Assembly

14. 14 Main Housing Assembly

15. 15 Main Housing Assembly

16. 16 Main Assembly

17. 17 Structure Materials NorylDelrin Dielectric strength500 V/mil380 V/mil Density0.039 lb/in 3 0.051 lb/in 3 H 2 O absorption (in 24 hours)0.07 %0.25 % H 2 O saturation0.20 %0.90 % Total material cost~$150~$110 Al T-6061 used for all metal parts Noryl used for all insulator parts Stainless steel fastners used with helicoils for small holes

18. 18 Annular Electrode Assembly Annular Electrodes (BeCu 17200) Annular Electrode Mount Wiring Channel (Noryl) Annular Electrode Standoff (Noryl)

19. 19 Annular Electrode Assembly

20. 20 Target Assembly Grounded Grid Inner/Outer Target Electrode Standoffs (Noryl) Inner/Outer Target ElectrodesHexagonal Base Silver Coated Target

21. 21 Target Assembly

22. 22 Detector Assembly Top/Bottom Detector Grid Clamp Detector GridDetector Housing Cylinder Detector Detector Lid (Insulation) Del Mar

23. 23 Main Assembly Detector Assembly Target Assembly Main Housing Assembly Annular Electrode Assembly

24. 24 Cable Layout Heater/CSA High Voltage – Ion Optics

25. 25 Cable Layout: Target Electrodes

26. 26 Mechanical Ground Support Equipment Interfaces Remove-before-flight cover Thermal Vacuum/Vibration Adapter Plate Put CRIA on its side in TVAC

27. 27 Integration &Testing Features Removal of Detector Assembly for Storage Electrical / Soldering Access Reconnecting the CSA Panel removal for internal access

28. 28 Fabrication/Assembly Schedule Assembly Built In-House Outsourced

29. 29 In-House Manufacturing Schedule 5 new undergraduates recently recruited 2 new undergraduate machinists hired (UROP funding) Working with DANDE to avoid conflicts in ASEN shop

30. 30 Status of Outsourced Parts PartVendorCostExpect to ReceiveStatus Hex BaseLASP~ $2700--Received Annular Electrode Mount LASP~$2700Mid-OctCurrently being built Annular Electrode Grid FotoFab$800Mid-OctOrder processing with vendor Grounded Grid FotoFab~$1300Mid-OctOrder processing with vendor Target Substrate AnoPlate$250Early-OctCurrently being silver plated

31. 31 Assembly Plan

32. 32 IonizerDetector Analyzer Structures Voltage Divider Design Thermal Electronics/ CDH Analyzer Subsystem Lead: Loren Chang Speakers: Loren Chang

33. 33 Analyzer: Requirements RequirementDescription 3.4.DC1 Scaling of Ion optics by 5/8 th of LAMA ion optics 3.2.PR2 - PR4 Electrode voltages shall be within +/- 10 V of the specified values from SIMION simulation. 3.5.IR2 A voltage divider box shall provide the necessary voltages to the various subsystems. 3.5.PR2 All electronics shall maintain a voltage accuracy of 0.5% on the electrodes. Updates?

34. 34 Voltage Dividers (VD) Converts 6 kV input ( µA) to voltages required for each electrode, as well as the target. Precise values assembled from discrete resistors. Electrodes must be held at 0.5% prescribed values. Design leaves space for additional corrector resistors.

35. 35 VD PCB Design Dimensions: 6.8 x 5.55”. 2 layer FR4 board with 20 mil traces. 93 mil thickness (no breakdown issues). Total power draw: 0.78 W. Minimum component separation of 100 mils (larger for most components). Wires to resistors to be connected via terminal posts. PCB to be outsourced for etching. Soldering will be performed by team. Entire board will be potted once assembly is complete. Pot with EN-4 and EN-11, potentially get from LASP?

36. 36 VD Enclosure Design VD system uses DC. Shielding is not necessary. Dimensions approx.: 7 x 5.75”. Will be manufactured in house. Aluminum box with cutouts on sides to allow wire passage Board mounted to enclosure using 4 x 0.118” screws on standoffs

37. 37 Electronics Schedule Issue Completion Date Notes VD PCB component testing.10/9/2007 Measuring ordered components to determine attainable precision. CSA testing.9/31/2007Testing CSA impulse response at STP. VD PCB etching. 9/28/2007 (Submission) To be outsourced to Sunstone. Current quote is ~$400 for two boards with 1 week manufacture time. VD PCB assembly.10/19/2007All soldering in-house. VD testing (non thermovac)10/29/2007 VDs to be run at lower voltages at STP to determine possible voltage drift. Correctors added if required. Integration with main CRIA instrument. 11/5/2007 Electronics testing (thermovac) 11/2007CRIA tested in relevant environment. Put into excel

38. 38 Electronics/CDH Subsystem Lead: Weichao Tu Speakers: Weichao Tu IonizerDetector Analyzer Structures Electronics Design Thermal Electronics/ CDH CSA Layout/ Assembly Testing

39. 39 Electronics: Requirements (key pre-flight ones) RequirementDescription 3.5.PR3 All electronics used in design shall operate in a vacuum environment without failure 3.5.PR2 All electronics shall maintain a voltage accuracy of 0.5% on all the electrodes 3.5.PR1 The voltage ripple on any of the electrodes shall not exceed [0.1%] of the applied voltage 3.5.PR4 The instrument shall be able to detect charge signals on the target and grounded grid for data triggering 4.5.DC2 The voltage divider box shall be located outside of the instrument body 4.5.DC3The CSA box shall be located close to the charge detector

40. 40

41. 41 CSA Subsystem Assembly – CSA: A250F/NF (2) – FET: SK152 (2) – Board: PC250F (2) A250F/NF ConnectionPC250F Layout

42. 42 Functional Test Soldering A250F/NF, FET Function-test with – A pulser Transition time < 20 ns Step: 22 mV – A test capacitor 2 pF – 22 mV step into 2 pF simulates the charge generated in a silicon detector by a particle losing 1MeV – Measure the output Noise Measurement – Test with A post amplifier MCA or RMS Voltmeter Test Circuit

43. 43 Dimensions: 1 X 2 X 3 inches Assemble into CSA Box Updates?

44. 44 Triggering Test Object: To test the combined triggering signals from the target and the grounded grid Test Procedure – Connect one CSA to the target, the other CSA to the grounded grid – CSA Noise Floor Test Connect the output signal to a Post-Amp and MCA/RMS voltmeter Record the change of noise with temperature – Triggering Test Laser-simulated impact To determine whether resulting signals are detectable above the noise floor Record the S/N and its change with temperature

45. 45 IonizerDetector Analyzer Structures Target Heater Design Thermal Electronics/ CDH Heater Locations Thermal Subsystem Lead: Laura Brower Speakers: Laura Brower

46. 46 RequirementDescription 3.6.FR1Power allocation is 20 W 3.6.PR1Target shall be heated to 100 o C 3.6.IR1Target heater shall be electrically insulated from the target 3.6.IR3Target heater shall be thermally insulated from the instrument 4.6.IR1, 4.6.IR2The backside of the target heater shall be covered in a low emissivity material ????Electronics (CSA/VD?) must be maintained between -25 C and 100 C?? Thermal Requirements Updates?

47. 47 Target Heater Configuration The heater is wrapped in a thin Kapton coating An additional layer DuPont Kapton FN (Kapton type: 150FN019) provides the electrical insulation sufficient to shield the heater from the target at 5 kV. Minco Heater 0.5 mm Target Kapton FN (Kapton type: 150FN019) 0.1” Al target substrate Where purchase from/cost?

48. 48 Heater Locations Heater location on electronics has not been analyzed Location 1: underneath target substrate Location 2: on Voltage Divider box

49. 49 Agenda Organization Background System Design & Requirements Subsystem Design Test Plan Project Management Plan

50. 50 Meeting Requirements through Testing TRL 5: test CRIA in a relevant environment Performance reqs Analysis (thermal, ion optics, electronics) Test Plan/ Verification

51. 51 How to Reach TRL 5 Required for TRL 5: Vacuum Testing – Test performance of CRIA (measure m/Δm) using laser ablation of target to simulate dust impacts Thermal Vacuum Testing – Monitor temperature response of structure, detector, voltage divider electronics, etc. during Thermal Balance Test and Thermal Cycle Test UV Testing – Test signal response of detector exposed to UV Additional Testing Vibration Testing – Shake/vibe based on NASA criteria for launch TRL 5: test CRIA in a relevant environment

52. 52 Pre-testing Tasks: Instrument checkout (test resistors, etc.) Vacuum Testing Location: CU campus, Z. Sternovsky’s lab Operating Pressure: 10^-5 Torr Cost: $0 to operate vacuum Schedule: expect 1 week of testing in Oct, budget 1 month of testing Test TypeComponentDescriptionMeasure/ Record FunctionalTarget Heater Heat target to 100C Target substrate temp PerformanceInstrumentSimulate dust w/laser ablation Obtain spectra, monitor voltages Test Matrix Lab Support Equipment: 2 HV Supplies (power detector) Oscilloscope

53. 53 Pre-testing Tasks: Instrument checkout Clean Room practices during assembly RGA, TQCM, possibly BOT Thermal Vacuum Testing Test TypeComponentDescriptionMeasure/ Record FunctionalTarget Heater Heat target to 100C during -50C thermal balance test Target substrate temp Thermal Balance InstrumentSteady state at -50C, +40C Monitor instr temps Thermal Cycle InstrumentCycle between -50C, +40C Monitor instr temps Location: LASP (MOBI or BEMCO) Operating Pressure: <10^-5 Torr Cost: Budgeting $1000 for oper equip / personnel time Schedule: expect 2-3 days of testing in Nov, budget 1 month of testing Test Matrix Lab Support Equipment: Low voltage power supply

54. 54 Test Schedule

55. 55 Agenda Organization Background System Design & Requirements Subsystem Design Test Plan Project Management Plan

56. 56 Cost Budget Insert Details of Big items

57. 57 Risk Assessment ???????

58. 58 Special Thanks: LASP for providing internal Funding and Support CU Aerospace Engineering Sciences Dept. Funding and Support Keegan Amyx Chelsey Bryant Josh Colwell Ginger Drake Paul Graf Vaughn Hoxie Bret Lamprecht Mark Lankton Mike McGrath Matt Rhode Steve Steg The Heidelberg dust group And of course: Xinlin Li, Scott Palo, and Zoltan Sternovsky

59. 59 Questions?

60. 60 Backup Slides

61. 61 Structure: Upcoming Work Complete Finite Elements Structural Analysis – Fundamental mode – Ultimate and Yield Stresses – Fastener pull-out strength Review Design and Produce Mechanical Drawings