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Interferometric Modulator Display Presentation 4: Anatomy of an iMod
Influenza del controllo d'imbardata sul rendimento degli aerogeneratori di piccola taglia Interferometric Modulator Display Presentation 4: Anatomy of an iMod ACCOTO Celso ADHAM Mohamed LARRIEU JeanCharles LE GROS Christophe MAQUEDA LÓPEZ Mariazel OTTONELLO BRIANO Floria PIZZATO Daniel SADRINI Jury Team Members: DIPARTIMENTO DI INGEGNERIA DELL’AUTOMAZIONE E DEI SISTEMI 1
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Introduction Agenda: New Design Simulations Fabrication
Presentation 3: We are designing a new MEMS based Display based on a Fabrey Perot Interferometer (iMod) Previous Problems: - Actuation voltage too high - process: insulating material (PMMA) would have melted… Agenda: New Design Simulations Fabrication
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Improving the Design Last time, we planned to: Changed physical design Modify back electrode of device Materials More compliant materials Thicknesses Thinner back plate (technology issue) Lengths Resolution is a constraint Boost V Low power constraint
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two beams support the reflective plate
New ANSYS Design New single IMOD model: two beams support the reflective plate Former design
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MATBLAB Simulations Why did we simulate our model on MATLAB? it’s difficult to set design parameters on ANSYS to have an idea of the values that we will use on ANSYS for the dynamic simulation Hypothesis: Static simulation: just a look at the final state of the system ▪ No viscosity forces ▪ No switching time analysis 2) Clamped beam modeling of the system 3) Everything is made with poly-Silicon
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Displacement function of the voltage (3 to 6 V)
MATBLAB Results Dimensions: 20 μm plate Displacement function of the voltage (3 to 6 V) Vertical position of beam along its length
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MATBLAB Results New Design: Lenght Voltqge 8 μm 31.1 V 10 μm 22.3 V
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26 % improvement changing the design!
MATBLAB Results: comparison Results: @ 20 μm: from 30 V to 7.8V 26 % improvement changing the design!
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Choice of the design Adv: residual stress just twist the structure. Dis: difficult to design. Adv: beams instead of plate
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ANSYS Design New design: From plate to beam Less stiff system Plate parallel to substrate
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ANSYS Simulation Difficulties…
400 lines code 34 3-D points (102 positions) Problems in the meshing Problems assembling the system
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Process Flow & Mask Design
New process flow: Previous mistakes New design Mask modeling: AutoCAD Eg. of mask ... Still preliminary
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Process Flow Glass substrate Silver deposition: sputtering
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Process Flow Silver deposition: sputtering
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Process Flow Resist deposition
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Process Flow Mask 1
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Process Flow Etching
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Process Flow Dielectric layer
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Process Flow Mask 1 Resist+etch+resist removal
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Process Flow SiO2 layer: PECVD
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Process Flow Mask 2 Resist: DQN
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Process Flow SiO2 etch 80 nm exactly
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Process Flow Mask 3 Resist: DQN
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Process Flow SiO2 etch 50 nm exactly
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Process Flow Remove DQN
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Process Flow Deposition of Al: Reflective layer
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Process Flow Mask 4 Deposition of protective squares
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Process Flow Etch of Al + Removal of protective squares
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Process Flow SiO2 deposition
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Process Flow Mask 5 Etching of SiO2
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Process Flow Mask 6 Etching of SiO2
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Process Flow SiN deposition
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Process Flow Mask 7 Etching of SiO2
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Concept of the system Vhold V+ V- Processor TSP 65131 Battery
Column selection Processor TSP 65131 Vhold V+ V- Row selection “Operating Principles of Mirasol Displays: Interferometric Modulation (IMOD) Drive”, QUALCOMM December 2007
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PSPICE Design “Operating Principles of Mirasol Displays: Interferometric Modulation (IMOD) Drive”, QUALCOMM December 2007
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Conclusions Mask is the 1st approximation of the fabrication process
Final masks for the process are under review Ansys/Matlab: Less stiff beams → lower activation voltage: 8V Vibration analysis and switching time to be checked PSPICE Addressing circuit has been defined Power consumption has been evaluated
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Thank you for your attention!
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