1. TEAM Microscope Engineering Planning Norman Salmon Engineering Program Manager Seung-Kil Son Ph.D. Staff Mechanical Engineer December 12, 2003

2. Areas of Engineering Effort 2004-2007 Concept Engineering FY2004FY2005FY2006FY2007 Design/Engineering Analysis Fabrication Instrumentation and Metrology

3. Thermal Analysis Microscope Geometry Sensors Actuators Controls Materials Building Metrology Electrical Systems Fabrication Mechanical Design Initial Specification Reset Specification Q1 2004 Critical Path for Concept Engineering and Stage Specifications Cooling Systems

4. Additions to the Original Scope of Work TEAM Stage U of Ill - TEAM Stage Cartridge and On Stage Experiments Cooling System Automated Sample Loading With Load Lock Microscope Design Facilities/Building Impact Materials Be/Ceramics 62 Machine Shop

5. Projects and Funding that can help support an expanded scope of work KITECH (300K for FY2004 - ??) Miquel Salmeron - MF Alex Zettle (Shaul) David Dornfeld –Support in Equipment for Building 62 Shop (500K) –Support in Students and Post Docs to strengthen/reduce cost of fabrication support Prospects –Potential Visiting Professor from Korea in PZT and Sensors (March 2004) –Paul Wright /Chris Talbot Applied Materials

6. Proposed Shift in Funding

7. Engineering Effort

8. Engineering Costs Setting up a fabrication account is essential –General and Administrative 46.5% GR1 20.6% Fab Detail budget should be submitted to NCEM January 1, 2004 based on limitations of scope of work

9. TEAM Project Management MS Project Tracking of Resources Resource Conflicts Budgeting Time Lines Unique UC Numbers for Sub-accounts to track specific project areas

10. Current Project List

11. Stage Concept Sketch with Autoloader

12. Specifications Currently Set Drift Specification –Dream #: 1Å / 10 mins – applications Lorentz (single spins – 1000 secs), EFTEM (for 1Å Resolution may need 5 mins exposure) –Minimum acceptable: 0.5 Å / 1 min –Present standard is 2 Å / min, so the existing minimum is almost sufficient, but we’d really prefer to do better –This is for x, y and z Eucentricity –Very desirable to make any point eucentric via software control as opposed to only having only one point in space that is eucentric. –Would represent an incredible improvement for the operator

13. Range –Coarse Travel x & y = 2 mm z = Dream spec 3 mm (if designing for bigger gap microscopes, TEAM II+), minimum z = 0.5 mm for TEAM I Note that this constraint is largely based on present 3 mm disc size – practical reason, not an engineering –Resolution of coarse motion: Generally want 10 times overlap of coarse motion to fine – this dictates about 10 nm –Range over which fine travel is in existence: 10 µm (or better) –Resolution of fine motion: 30-50pm Specifications Currently Set (Continued 1)

14. Repeatability – 5 times worse than resolution – thus, that means 250 pm (0.25 Å) Precision –10 times worse than resolution – that’s then 500 pm (0.5Å) Repeatability between microscopes –It was noted that doing this very successfully would be very beneficial in terms of justifying use of two columns instead of one column. –Kinematic joint for cartridge between microscopes – goal is to be able to analyze the same nanoparticle in both the TEM and STEM columns Repeatability resolution 250 nm coarse motion (maybe better) Want an optical method for fine positioning Needs to be discovered what we can expect for resolution on this, what software exists If better than 10 nm we’re very happy Specifications Currently Set (Continued 2)

15. Specifications Currently Set (Continued 3) Rotations –Specimen stage: ± 20  is minimum, 45  is preferred, 70  is desired –Resolution: 100 µrad – Discussed in terms of requirements for TEAM I & beyond TEAM I. Likely that TEAM I will need only 20  for routine use The additional tilted need for tomography will almost have to come from a special cartridge design Speed –Worth considering, but not a priority but a convenience –Obviously, faster is better –Shoot for 1 rpm

16. Cartridge –Types of samples: 3mm disc, FIB, MEMS –Sample Size: 3 mm disc as standard Reason: if we deviate from the 3mm disc size, users will not be able to do any sample preparation prior to use of the TEAM instrument. This is not desirable. Size: Thickness: 0.5 mm in center, thicker to the sides, x & y will depend on design –Cartridge should be a kinematic fixture Specifications Currently Set (Continued 4)

17. Specifications Currently Set (Continued 5) Materials –Non-magnetic –Conductive –Stiff –Thermally stable –UHV-compatible/bakeable –Be? Cu-Be?

18. Nano/Sub-Nanometer Scale Manipulation ControlMechanical ComponentsEnvironment 1. Actuator -Piezo (No Stiction) 2. Feedback - Laser/Capacitance ~ 10 times better than target accuracy. 3. Control Technique - Coarse/Fine (with compensation) 1. Material - Stability - CTE (Super/Invar, Zerodur) - Residual Stress - Stiffness 2. Kinematics - ABBE error - Cosine error - Axis coupling effect 3. Part Accuracy - Surface Condition - Straightness - Dimensional accuracy 1. Vibration/Acoustic -Vibration isolation -Avoiding Eigen-modes 2. Thermal -Thermal inertia -Heat isolation -Minimize heat generation 3. Electro-magnetic -Shielding & Isolation - Avoid monitors & computers, noisy electric motors 4. Media for Sensors -Humidity, Air pressure, Temperature change

19. CurrentTarget Technical Issues 5 ~ 10nm accuracy0.05nm accuracy Actuator Feedback Control Thermal 5 ~ 10nm accuracyBetter than 0.05nm (0.5 A) 1 nm resolution 0.01 nm (0.1 A) resolution Low CTE materials Low CTE materials and Compensation improvement

20. How to solve the problems Piezo actuation Laser/capacitance readback Coarse/Fine control 5mm PZT 5mm workspace 0.5nm open loop resolution Laser 0.01nm resolution Capacitance 0.01nm resolution Target Electric field fine motion coarse motion Joint bearings (fine-motion) Bearings Stick-slip Error motion Flexures Continuous Small error Small workspace

21. System Design Why do we need Nanometer accuracy for the Macro-scale components? –The guiding system directly effects the system overall accuracy. –The error amount should be within fine motion control region e : Orthogonality : Straightness : ABBE error It’s not easy to get better than 0.1 mrad ABBE error with conventional machining. x-axis y-axis guide surface error amount ( ) < fine motion travel range (1~10 microns) (when e=0.1mrad and r=50mm)

22. 10 -3 10 -4 10 -5 10 -6 [m] meso machining miniature machining silicon µ- machining Critical dimensions Meso-scale machining: 10 µm ~ 1mm

23. Micro Milling, Drilling and Turning Micro Stepper Motor Laminates - Produced Using 100 Micron Diameter Rotary Cutting Tools - Tech Transfer Grant for Empire Magnetics FY2002 100 Micron Diameter Micro Electrodes Produced for Alexander Zholents 2002 AFRD LDRD Holes as small as 40 Microns can be drilled in Stainless Steel - Shown is a 70 Micron Drill compared with a Human Hair

24. 10µm gears in silicon 25µm channel in diamond FIBMilling 17µm cutting tool 20µm channel in graphite 1mm Examples Meso-Machining at LBL Micro Turbine Blades

25. 2-translational axis manipulation for FESEM 1.Technical challenge No-existing manipulation collect light coming from the sample Limited installation space Following the table movement Don’t hinder other instrument inside the chamber 2.Approach Parabola mirror Two axis stage Piezo actuation Step-like actuation for stability Open loop control 3.Installation and Test Results Positioning accuracy: 0.02mm Easy user control with VisualBasic No damage on vacuum grade No X-ray through the stage Installation surface X-axis stage Sensor position 5mm 10mm FESEM Table With 5-DOF Diamond turned mirror surface

26. Installation and test of FESEM Stage 2-axis stage FESEM Monitor Outside view Inside view Mirror engagement Test result Control Panel Hole on the parabola mirror 0.5mm

27. Control panel for FESEM Stage Software : VisualBasic Stage aging time control +/-X axis feedrate control Z-axis control Stage pausing Auto-homing Z-axis voltage level control X-axis voltage level control

28. 2-rotational axis manipulation for TEM 1.Technical challenge Sub m-radian accuracy with with 6.5mm shaft. Two independent rotations Attachment to the existing Goniometer 2.Approach Piezo actuation String type rotating mechanism Jewel bearing Minimization stick-slip 3. Expected results 0.6 mrad accuracy tilting (equivalent with 3micron linear displacement) 0.03 mrad accuracy rotation Smooth operation No-jittering Easy jog control (patent disclosure)

29. Fluid Holder for JEOL 3010 (Mark Williamson)

30. Modular Sample Holder for the JEOL 3010 Ti - 6Al4V Delrin Aluminum

31. Other Ongoing Projects Florescence Holder for the CM-300 LLNL/Morris In-Situ Tensile Test Holder Single Tilt Full Rotation Tomography Holder IC Holder for Daan Hein 1mm Parabolic Mirror for TEM Sample Holder