Presentation is loading. Please wait.

Presentation is loading. Please wait.

Production Readiness Review Production steps and quality control 1.Panel production 2.HV bar gluing 3.Preparation of side material 4.Wiring and gluing.

Similar presentations


Presentation on theme: "Production Readiness Review Production steps and quality control 1.Panel production 2.HV bar gluing 3.Preparation of side material 4.Wiring and gluing."— Presentation transcript:

1 Production Readiness Review Production steps and quality control 1.Panel production 2.HV bar gluing 3.Preparation of side material 4.Wiring and gluing wires 5.Wire soldering 6.Preparation of wire plane 7.Gluing lateral bars 8.Assembly of the chamber 9.Chamber conditioning 10.Mount FEE and Faraday cage 1.Panel thickness, planarity 2.Pad electrical connections 3.HV bar height 4.Measurement of wire pitch 5.Measurement of wire tension 6.HV test of each wired panel 7.Measure of  p (gas leakage) 8.Uniformity test w. source 9.Test with cosmic rays LNF – 4 december 2003 – C. Forti

2 Gold - Gold Pad - Pad Copper - Gold Pad - Pad Gold - Copper Type and number of panels needed Pad - Pad Copper - Gold Gold - Copper Quadrigaps: M3R3 (48 ch)+10% M5R3 (48 ch)+10% Bigaps: M1R3 (48 ch)+10% M1R4 (120 ch)+10% Total = 290 chambers 794 panels with wires Time needed: 10 panels/week  80 weeks ~ 1.8 yrs 6 panels/week  132 weeks ~ 2.9 yrs BAD Bigap M1R3,4 Quadrigap M3,5R3 I will show that 10 panels/week is a reachable production rate

3 Production steps: panels and HV bars PANEL PRODUCTION Measure panel thickness Produce HV bars Mount R, C Conformal coating PREPARATION Visual inspection Check planarity Check pad contacts Clean panel HV BAR GLUING POST-GLUING Visual inspection Measure bar height Solder connectors Clean panel Clean HV bars

4 Description of panels Sandwich panel 4 gaps

5 Description of panels A small quadrigap prototype Cathode pads Closing bar Lateral bar

6 Panel thickness and planarity According to simulations (Riegler), the requirements on the gain: G 0 /1.25 < G < G 0 *1.25 over 95% of the detector area G 0 /1.50 < G < G 0 *1.50 over 5% of the detector area where G 0 is the nominal gain translate into the following requirement: Gap = 5 mm ± 90  m (95% of detector area) ± 180  m (5% of detector area) Since the gap is provided by the 5mm spacers placed between the panels, along their frames, the gap uniformity is related to the uniformity of the panel thickness and to its planarity. The absolute value of the panel thickness is crucial when a panel is wired on both sides, because the distances between the wire planes and the panel surfaces depend on thickness. The requirement is T=9.0 ± 0.2 mm In LNF chambers, where we wire only one side of the panel, the absolute value of the thickness is not crucial, while its uniformity is. At the company the panel thickness is measured with a tooling based on inductive sensors.

7 Device for thickness measurement 7 sensors Device designed and realised by Roma 2 group

8 Status of device The device is well calibrated for Cu-Cu panels. Some more work is needed for precise ABSOLUTE measurement of Gold panels. Anyway, the system is very precise to thickness fluctuations and is sensitive to variation of planarity along panel width (the most important). 10 hrs measurement RMS = 70 nm 8  m Thickness and Temp. vs. Time Down to 1  m jump appreciable Fine structure due to air conditioning cycles All panels measured within specs for thickness absolute value.

9 Comparison Autom. device vs. Micrometer 9.06 9.16 9.14 8.98 Device calibrated 9.07 < t < 9.15 Device not calibrated Device: 8.99 < t < 9.04 Micrometer: 9.06 < t < 9.12 All measurements within ± 40 um

10 Manual check of thickness The more recent production: 50 panels over 130 total has been measured manually with a micrometer. 5500 measurements provide: = 9.1 mm  (T) = 21  m Even at max production rate (~ 20 panels/day with 3 moulds) a relevant fraction of ~10-15% of the panels will be checked with micrometer.

11 Manual check of planarity 50  m A check of panel planarity will be performed at LNF on ALL panels, before gluing the HV bars. planarity < 90  m (95% of detector area) < 180  m (5% of detector area)

12 Layout of HV bar gluing room SHELVES FOR PANELS BEFORE GLUING PREPARE PANEL SHELVES FOR PANELS AFTER GLUING CUPBOARD GLUING SOLDERING PREPARATION Visual inspection Check planarity Check pad contacts Clean panel HV BAR GLUING POST-GLUING Visual inspection Measure bar height Sold connectors Clean panel Clean HV bars GLUING AFTER GLUING

13 HV bar gluing machine Suction cups HV bar with R,C HV bar without R,C

14 Schedule of operations in HV bar gluing room The most pessimistic estimate: production rate=2 panels per day One operator free, any 2 days: can help in final chamber assembly in clean room.

15 Traveler for “Panel Preparation for gluing of HV bars” (I) Traveler for “Panel Preparation for gluing of HV bars” Must come with: Plot of panel thickness Version 2 (4-dec-03)Take panel from shelf: UNPREPARED Panel number :Gold - Gold M1R3 M3R3 Chamber :Gold - Copper M1R4 M5R3 Layer :Pads - Pads VISUAL INSPECTIONOperatorDateTimeOK Hospital List pad # and defects: PANEL PLANARITYOperatorDateTimeOK Hospital Requirements: 95% of area within +- 90 um / 5% of area within +- 180 um Comments:

16 Traveler for “Panel Preparation for gluing of HV bars” (II) PANEL CLEANINGOperatorDateTimeOK Hospital Comments: PAD CONTACTSOperatorDateTimeOK Hospital Comments: Ready for bar gluing ? OperatorDateTimePut panel on shelf: READY FOR GLUING YES NO 100 <p< 140  m

17 DRESSING ROOM Layout of clean room WIRING WIRE GLUING WIRE PITCH SOLDERING PREPARATION LATERAL BARS HV TEST WIRE TENSION ASSEMBLY LEAKAGE TEST SHELVES TABLE CONDITIONING CUPBOARD TABLE

18 Clean room LNF Wiring Wire gluing Pitch control soldering Gluing of lateral bars and HV test

19 Clean room LNF Cut wires, solder connectors Gluing of lateral bars and HV test Chamber assembly Gas leakage test

20 Wiring and wire gluing

21 It is feasible to wire 2 panels/day, corresponding to 2.5 (4-gaps)/week The critical point is the waiting time needed before turning the machine and gluing the 2 nd panel. We will test if a local increase of temperature shortens this time. We measured the wire tension at 2 different temperatures: Temp = 22 degrees  T = 69.08 g Temp = 26 degrees  T = 70.41 g  = 0.33 g/degree  we will increase temperature of ~ 3 degrees

22 Wire pitch control According to simulations (Riegler), the requirements on the gain: G 0 /1.25 < G < G 0 *1.25 over 95% of the detector area G 0 /1.50 < G < G 0 *1.50 over 5% of the detector area where G 0 is the nominal gain translate into the following requirement on the wire pitch: Pitch = 2 mm ± 50  m (95% of wires) ± 100  m (5% of wires) The check is performed with an automatic measuring device, based on 2 cameras scanning the panel, positioned on the same structure supporting the laser heads for wire soldering. The time for the test is ~ 1 h/panel for the largest chambers and requires one operator.

23 Wire pitch control Results are expressed in pixels: 211 pixels correspond to 2 mm. We require: 206 < pitch < 216 for 95% of wires 201 < pitch < 221 for 5% of wires All panels checked up to now satisfy these requirements (except one wire of one panel)

24 Wire soldering The wire soldering is performed with 2 lasers on each wire side and 2 cameras displaying the work of the soldering heads. Here we count on the reliability of the automatic system. The operator can only seldom have a look to the monitors. The time of the soldering procedure is ~ 1 hr/panel for the largest chambers and requires one operator to execute the procedure. Check of soldering and (eventual) retouching is performed on the next table (panel preparation).

25 Panel preparation After soldering, the panel is moved to another table for: 1.Retouching of soldering 2.Cut wire edges 3.Clean bars 4.Turn panel upside down 5.Soldering of HV connectors (for pad-pad panels) 6.Check pad integrity 7.Final cleaning of panel (opposite side respect to wires) Time = 1 hr 30 min with 1 operator (for big pad-pad panels)

26 Wire tension measurement The wire tension has to be verified (in order also to detect early possible anomalies in the wiring machine). The wire elastic limit is ~130 g. For stability requirement, no wire should have a tension less than 50 g (Riegler). Estimated time of the test: approximately 1 hr 30 min per panel for the largest chambers. One operator is needed to place the panel and start the software. The procedure is completely automatic. A data file is provided in output, together with a plot. We measure the wire tension with an automatic device providing an oscillating HV to a reference wire placed just above the measured wire (at ~1 mm). The system detects the resonance corresponding to the maximum oscillation of the relative capacity between the reference and the measured wire. For a given wire length and density (13.6 mg/m for our wire), the frequence of the resonance corresponds to a mechanical tension. Typical value is ~ 330 Hz.

27 Wire tension measurement Wire Tension Meter developed by Roma 1 group

28 Wire tension measurement

29 =68 ± 3 g

30 Traveler for “WTM, gluing of lateral bars and HV test” (I) Traveler for “WTM, lateral bar gluing and HV test” Must come with: Plot of panel thickness Traveler for “Panel preparation…” Traveler for “HV-BAR gluing” Traveler for “Panel wiring” Traveler for “Panel soldering and preparation” Version 2 (20-nov-03)Take panel from WTM machine Panel number :Gold - Gold M1R3 M3R3 Chamber :Gold - Copper M1R4 M5R3 Layer :Pads - Pads WIRE TENSION OperatorDate Time OK Hospital Requirements: NO wire with T 90 g =  (T) = Number of files:

31 Gluing of lateral bars and HV test in air After wire tension measurement, the panel is moved on table for gluing of lateral bars and high voltage test in air. We have chosen to perform these operations together on the same table because they both require a relevant amount of time (the night is used). On this table, 2 panels can be glued and HV-tested at the same time.

32 Gluing of lateral bars and HV test in air HV test: at 2 kV in ~2-3 hours (at 40% rel. humidity) the current usually decreases and reaches less than 100 nA/per plane. Current limitation is set to 200 nA per plane in order to not damage the panel. Gluing of lateral bars: ~ 30 min needed for 2 panels together (1 operator) Estimated time of the test: approximately 12 hrs including both glue drying and HV test. The whole night will be used if the gluing starts in the afternoon. This is compatible with the production schedule of 2 panels/day

33 HV test in air At HV=2 kV, the current reaches ~ 100 nA within ~ 2-3 hrs for most panels. In 1 case over 7, one whole night was needed.

34 Traveler for “WTM, lateral bar gluing and HV test” (II) LATERAL BAR GLUINGOperatorDateTimeOK Hospital Comments: HV TEST IN AIR Requirement: I < 100 nA @ 2 kV after few hours OK Hospital OperatorDateTimeHVI (nA)% Hum. In the future, probably the test will be automatic

35 Final chamber assembly and gas leak test After gluing of lateral bars and HV test, the panels are ready to be assembled in the chamber.On the table of chamber assembly we also glue the gas connectors and perform the gas leakage test. Time: assembly = one full day (2 operators) leakage =1 hr 30 min (1 oper.) 8 9 10 11 12 13 14 15 16 17 18

36 Final chamber assembly glue spacerClosing bar Lateral bar

37 Final chamber assembly Total measured height: 65.2 < h < 65.3 mm Expected:5 panels + 4 gaps = 5*9 + 4*5 = 65 mm

38 Traveler for “Chamber assembly and leak test” ASSEMBLY OperatorDateTimeOK Hospital O O O O O O O O O O Height (mm ) OO

39 Gas leakage test FIT:  p =  p 0 e -  t  p 0 = 4.99 mbar  = -0.29 hr -1 Automatic measurement of  p, p and T vs. time recently set up. Corrections for T and P variations still not included.

40 Conditioning and tests DRESSING ROOM WIRING WIRE GLUING SHELVES CONDITIONING UNIFORMITY TEST PC RACKS COSMIC RAY STAND We have to decide if doing (gas+HV) conditioning in clean room or in the test room. We don’t know exactly how much time is needed for conditioning, however the shelves can allocate 6 chambers (>2 weeks production). Uniformity and cosmic ray tests are described in D.Pinci’s talk MOUNT SPB

41 Preparation/check of side material In the laboratory: Check and preparation of HV bars Visual inspection, check of integrity, cleaning of the HV bars Cleaning of the lateral bars Cleaning of the closing bars Check of wire quality samples (15 min/spool) Visual inspection of wire quality using a microscope (one sample per spool) Cleaning of the spacers and of the plastic rings (used to avoid that glue goes under the spacers) One person can prepare in one work day the material needed for 5 M3R3 chambers, corresponding to ~10 days of wiring (at 2 panels/day rate).

42 Manpower needed 9/10 people is the need to insure a 2 panel/day production rate

43 Conclusions Production and quality control procedures are defined in detail The time needed for each operation is decreasing rapidly during last weeks of intense work  we can reach soon a production rate of 10 wired panels/week Come to visit our clean room: you will find one panel or chamber in each production/(quality control) step. We will be glad to receive your suggestions. LNF – 4 december 2003 – C. Forti

44 Wire quality check At the moment, we only weigh the wire spool to verify the constancy of wire density (13.6 mg/m). In the future we plan to check the wire quality samples (~15 min/spool) Visual inspection of wire quality using a microscope (one sample per spool). The wire in a spool will be ~ 4.2 km, enough for wiring of 10 panels M3R3 (i.e. 2.5 full chambers). This corresponds to 5 days of wiring.

45 Production Schedule in clean room

46 SPARE PANEL PRODUCTION

47 The mould

48 The moulds M3R3 prototypes small prototypes

49 The lower half of the M3R3 mould

50 FR4 foils fixed Both FR4 foils fixed

51 End of injection Injection completed and clamps opened clamps foam vacuum pipes

52 SPARE PANEL THICKNESS

53 The proximity sensor Inductive proximity switch Courtesy Danilo Domenici INFN- ROMA2

54 Calibration ≈ 10  m Sensitivity = 1.23 V/mm linear fit around the flex calibration curve: V out vs distance ≈ 20  m RMS of the residuals for linear approx Max residual for linear approx Courtesy Danilo Domenici INFN- ROMA2

55 Stability and Temperature dependence 3 days stability measure Down to 1  m jump appreciable 40  m 8  m Thermal stresses of mechanics also contribute at this level Fine structure due to air conditioning cycles Courtesy Danilo Domenici INFN- ROMA2

56 Temperature dependence Slope = -7.5  m/ 0 C Clean correlation over 10 hours time 2 celsius degree Courtesy Danilo Domenici INFN- ROMA2

57 Spread of measures Distance vs time corrected for temperature variations Spread of measures RMS(10h) = 70 nm ! Courtesy Danilo Domenici INFN- ROMA2

58 Measurement of panel thickness

59 Measurement of panel thickness (with a micrometer) INDUCTIVE SENSORS PANEL Sensitivity =10  m 118 points measured all over an M3R3 panel (1364x346 mm 2 )

60 40 20507060 20 10 7.826 7.834 7.810 7.8117.804 7.839 7.828 7.811 7.858 7.844 7.823 7.848 7.835 7.816 7.837 7.826 7.804 7.832 7.822 7.814 7.836 7.830 7.820 7.850 7.050 7.840 7.93 7.94 7.957.96 3D machine Alto Coppia Sens. 12-13 3D machine Basso Coppia Sens. 00-01 Micrometro Rosso-Verde misure su vetro Blu misure con nastro Cu  40um Glass for calibration

61 Misure nel tempo di pan26

62 3D view of panel 26

63 Pan_29 Pan_31

64 Curva_tara in funz. Spessore cu

65 SPARE WIRE TENSION

66 Request on the wire tension Since the MWPC wires will be vertical, the gravitational sagitta is not the main issue; The mechanical tension  lower limit is given by the request of mechanical stability due to the wire electrostatic reciprocal repulsion: The upper limit is given by the elastic limit which, for our 30  m diameter wires, is about 120 g. We consider completely safe the request of a  in the range: V: electrical tension  3 kV C: wire capacitance/length = 0.08 pF/cm s: wire spacing = 2 mm l: wire length = 30 cm  > 20 g

67 The wire tension meter The system was developed for the KLOE drift chamber and the principle of operation is explained in details in NIM A (409) 63,64 1998; It is based on the measurement of the capacitance between the chamber wire (with radius a) forced to oscillate at a frequency and a sensor wire (with radius b): The capacitance depends on the distance d: During each oscillation we measure the resonance frequencies (  A and  B ) of an LC circuit having C tot = C 0 + C(d) in the configurations A and B;  =  A -  B is a function of the wire oscillation amplitude; By varying we find the wire resonance frequency 0 which maximizes  AB d

68 The resonance peak The resonance peak is clearly visible and narrow. = wire mass per unit length As the damping effect is negligible:

69 The measurement table The table for the wire tension measurement was designed and built in Roma1. MWPC chamber 16 ch sensor high-precision linear modules:  ball screw drive (5 mm pitch) by “Bosch” with 100  m max certified error after 1.6m.   5  m rms in y. stepping motor with (1.8°  0.09°)/step controlled via serial port by a “RTA MIND” driver We measured the X positioning on the last wire after a complete measurement-run finding an rms of about 10  m. y x wire tension gain uniformity cosmic-ray test


Download ppt "Production Readiness Review Production steps and quality control 1.Panel production 2.HV bar gluing 3.Preparation of side material 4.Wiring and gluing."

Similar presentations


Ads by Google