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Complex study of multilayer Al99.99/AlMg3 laminates prepared by accumulative roll bonding Charles University in Prague, Faculty of Mathematics and Physics, Department of Physics of Materials, Ke Karlovu 5, CZ-121 16 Prague 2, Czech Republic Miroslav Cieslar
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Outline Introduction Material ARB processing Experimental methods Microstructure Mechanical properties Electrical resistivity Microstructure evolution In-situ observations Summary
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Introduction Ultrafine - grained materials (UFG) Most common methods: ECAP (Equal Channel Angular Extrusion or Pressing ), HPT (High Pressure Torsion ) Since 1998 – ARB (accumulative roll-bonding Schematic diagrams of (a) ECAP (b) HPT process Steps during ARB processing
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Material Twin-roll cast AA5754 and AA1199 4 Twin-Roll Casting t = 5 - 9 mm 0.1 -0.006mm Direct-Chill Casting scalping & homogenization cold-rolling break-down mill tandem hot-rolling 600 mm ingot 7 - 9 mm cold-rolling annealing annealing The technology based on TRC is much shorter, i.e., energy and cost effective.
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Processing of large coils AA 1199 - pure aluminium 99.9% MaterialMgMnFeSiCuTiCrAl AA 57542.690.390.310.200.0060.0330.002Balance
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Experimental methods Knoop microhardness KHN = F/A = 10*F/CL 2 Where: F = applied load in N A = the unrecovered projected area of the indentation in mm 2 L = measured length of long diagonal of indentation in mm C = 0.07028 = Constant of indenter relating projected area of the indentation to the square of the length of the long diagonal.
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0.15mm 0.3mm procedure of hardness measurements Knoop microhardness as a function of distance from the surface of the sample after 3 ARB steps
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Electrical resistivity ( ) measurements Standard four-point method in liquid nitrogen during isochronal step-by- step annealing with the step 20K/20min R, resistance in Ω, f, form factor in m, L, the length of the specimen in m, S, the section in m 2 Relative resistivity changes
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Electron microscope JEOL JEM 2000FX with JEOL single-tilt heating stage The light optical microscope NIKON – EPIPHOT 200 Microstructure observations
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Initial microstructure after ARB processing
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TEM
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Coarse particles rich in Fe, Mn, Si
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Resistivity measurements
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Knoop microhardness
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Average Knoop microhardness
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Only moderate changes of resistivity below 350 °C followed by significant resistivity increase Fast drop of microhardness only between 120 and 350 °C
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