1. Network on Chip - Architectures and Design Methodology Natt Thepayasuwan Rohit Pai

2. “By the end of the decade, SOCs using 50-nm transistors operating below one volt, will grow to 4 billion transistors running at 10GHz” -International Technology Roadmap for Semiconductors

3. Synchronization with single clock source and negligible skew will be extremely difficult, if not impossible. Globally asynchronous – Locally synchronous Distributed System on single chip Global control of information traffic is unlikely to succeed. Autonomous data transfers by components Challenges in SOC design

4. Challenges (cont) Electrical noise due to cross-talk, electro-magnetic interference (EMI) and radiation induced charge injection (soft errors) will be likely to produce data upsets. The mere transmission of digital values on wires will be inherently unreliable.

5. Drawbacks of Bus Every unit attached adds additional parasitic Bus timing is difficult in deep sub micron process Bus testability is problematic Bus arbiter delay grows with number of masters Bandwidth is limited and shared

6. The Network-on-Chip The seven layer OSI stack for communication ! Physical Data link Network Transport System Application Micro – Network Stack

7. Physical Layer Lowest level signal voltage, timing, bus widths and pulse shape Power consumption difficult to compute at this stage signal synchronization is a concern

8. Data Link Reliable transfer of data Error detection and correction Arbitration of physical medium MAC protocols – token ring and TDMA Arbitration scheme affects delay, throughput, power consumption

9. Network Layer Provides topology independent view of end to end communication to upper layers Data routes can be persistent / each transaction can be dynamically routed Congestion control may be required if dynamically routed

10. Transport Layer End –to-end connection ! Flow control, packet reassembly, re-ordering Abstraction of network Formal method of communication

11. System- Session & Presentation Session Adds state to end-to-end connections. Synchronous messaging requires sending and receiving components rendezvous as message is passed State maintained by a semaphore used as an indicator System components are CPU, DSP core, memory …. Presentation Byte ordering format conversion

12. Application Layer Highest layer of abstraction eg: Embedded system performs video processing Separation of computation and communication Builds upon functionality of lower level

13. NOC Architectures Platform based design Same architecture for different application –speeds up design process and reduces verification time Issues- Generality / Performance

14. CLIQUE Architecture Chip level Integration of Communicating Heterogeneous Elements

15. Regions & Wrappers Region : Area insulated from the network and has a different internal topology/ communication Allows resources of larger size than atomic mesh Connected to NOC by Wrappers, routes the packets to insulate from external traffic Wrappers convert messages messages to appropriate formats

16. Backbone-Platform-System Encapsulate design into reusable platforms Backbone (Region Type) Topological & communication issues channels, switches & network interface Performance evaluation of topologies Customized (wire-length,timing,physical) topology enables NOC where QoS is optimized in the beginning

17. BPS (cont) Platform (Region scaling) – Requires understanding of the functionality (System level control) Complexity and performance requirements Metrics – utilization,performance, capacity, temporal and spatial effects Communication Structure Processor Hardware Code Configuration

18. BPS (cont) Application Development – (Resource level) control of network functionality of network

19. Switching Networks Circuit Switching Space switching- S (crossbar) Time switching – T : buffer to swap order of time- slices on TDMA links Adv: Formal guarantee of bandwidth Disadv: Lack of reactivity against changing communcation eg: not suited for random traffic b/w CPU and slaves

20. PROPHID (TST) T T S

21. Packet Switching Routers as switching elements Header + Payload = Packet Routing decisions dynamic and distributed Very reactive What about latency?

22. Wormhole Extensive use in in high performance parallel computing Router does not wait for trailer Head Tail

23. SPIN Scalable, Programmable, Integrated Network 32 bit packets – header byte for destination address 256 terminals addressed Trailer has checksum for error detection Payload should be large Deterministic routing Latency independent

24. FAT – Tree

25. Router Design Area optimization (on-chip) Packets queued in FIFO at input leads to max contention Addition output buffers required Contention in the child links than father links Output buffers reduces cascaded contention

26. Beyond NOC Currently used communication architectures on SoC Priority Based Shared Static Bus Time Division Multiplexing Access (TDMA) Shared Bus

27. Static Priority based shared Bus

28. TDMA

30. Problems with both Static Priority Based Shared Bus lack of control over the allocation of communication bandwidth to different system components or data flows TDMA Based Shared Bus significant latencies resulting from variations in the time-profile of the communication requests

31. Lottery Bus

32. Operation The probability that bus is granted to C i The probability that a task with t tickets can access the bus after n lottery drawings:

33. Hardware (static)

34. Hardware (dynamic)

35. Comparing BUS with NOC Bus says:Bus latency is zero once arbiter has granted control Noc says: Internal n/w causes small latency Bus says: Silicon cost of a bus is near zero NOC says: Significant silicon area Bus says: compatible with most Ips NOC says: IPs need smart wrappers NOC says: What do I do now?

36. Comparing NOC with BUS (cont)