1. Stave General Meeting Intro and Status on: BCC, Co-Cure, ASIC req, HSIO Carl Haber 6-May-2011

2. Intro Some time since last mtg due to Oxford workshop, Easter and spring holidays Double trigger studies on serial stave – New bus cable orders await a resolution of this Status of DC-DC stave Module building – biweekly meeting BCC HSIO

3. BCC BCC V3 is out and in use, improved 80 MHz cycle The version is referred to as “2-dot” 100% yield so far on mounted parts – Parts sent to Liverpool and BNL – Loose die sent to KEK for SM program BCC board revised to provide for split termination on BCO, COM, and L1R – Statement to the contrary at Oxford was incorrect!

5. Co-Cure Study of preferred 0-90-0 layup configuration Measure bend on cable cured flat Radius is 5.4 inches Co-cure on the inside surface of a 9.5” ID Al pipe (cheap solution) – Photos are on same fixture – Residual seen at EOS end is due to bare carbon section Cable side

6. ASIC Request In Oxford, and earlier, we discussed the development of a hi-tech hybrid using thin film technologies which were presented at ACES2011 (former IBM process) Such a hybrid could use a bump bonded version of the ABCn-130 and an integrated fan-in pattern. We have been asked by Francis Anghinolfi to spec the bump-bond pad pattern for an ASIC design study Could you create and send us an approximate view of what you believe is the arrangement of bump areas for the frontend part of ABCN130 in case we want a flipchip technology ? Even if not perfect, but for getting an idea about constraints from the hybrid. Need input from the community.

7. 250  m 125  m 47  m 200  m Need to fit 4 tracks in this space Pad and bump based upon IBM CMOS8F design rules (130 nm)

8. ~8 mm ~2.5 mm ~10 mm (128 pads @ 80  m) 32 x 4 32 x 2 I/O power

9. Power Control Protection HV MCC DCS

10. HSIO Systems have been widely distributed None-the-less we have received additional requests Inventory – HSIO ?, at LBNL have 1 C02, 2 C00 boards…. – Interface: 2 available – EOS: 3 at LBL Plans call for 6 stavelet+2 stave sides to come