1. Waclaw Karpinski General meeting 13.06.021 CMS TRACKER SYSTEM TEST Outer Barrel –TOB Inner Barrel –TIB End cap –TEC TIB TOB TEC Different Geometries One Readout Architecture One Powering Schema

2. Waclaw Karpinski General meeting 13.06.022

3. 3 Power supplies oSituated in counting room oImplement a unipolar scheme oPS modules power groups of ~60APV I@2.5V =10A, I@1.25V =4A I@0V =14A oEach PS module equipped with 2 HV channels for detector bias oFloating LV, HV power supplies of each power group, their Return Lines connected inside the detector to the Common Detector Ground Power Cables 140 m long o Voltage drop = 5V o Use of sens wires to compensate the voltage drop oMultipolar cable with low inductance, high capacitance to minimize voltage overshoots due to current variations Power Supplies and Cables

4. Waclaw Karpinski General meeting 13.06.024 Definition of the System Test The tracker has to enter its production phase Need to validate a complete subset of it o Validate designs o Tune design details o Verify/optimize integration of components Focus is not on component characterization, but on overall system performance The subsets: (for TIB/TOB/TEC) A number of final modules (sensors +frontend hybrid) integrated on the final mechanical support structure equipped with: o interconnect boards o optical digital links and electronics for control o optical analogue links for readout o power supplies + 100m MSCable o cooling

5. Waclaw Karpinski General meeting 13.06.025 What is necessary to prove it works Modules o Noise o Physics signals (ß-source, Laser), SNR o APV settings o Detector leakage currents Compare with corresponding measurements taken with individual modules in the “single module setup” (i.e. electrical readout) Analogue readout chain o Optical link gain and bias point o timing alignment of moduls o Noise contributions, Crosstalk, Common mode effects o Operation margin Control chain o Noise immunity ( Grounding, cabling, shielding) o Operation margin o Redundancy Long Term Stability and Temperature stability of the system

6. Waclaw Karpinski General meeting 13.06.026 Interconnect boards, mother boards Signal Integrity o the distribution of the fast control signals: clock, reset and back plane pulses, Power distribution ovoltage drops; uniformity of supply voltage distribution oBehaviour of full loaded system due to sudden variation in current consumption in correlation with: olarge inductance of the long cables o slow reaction time of PSU Protection against over-voltage? What is necessary to prove it works

7. Waclaw Karpinski General meeting 13.06.027 Mechanics omechanical compatibility of the various components with the mechanical support structure omechanical stress of the modules due to their fixation on cooling system and interconnect boards oDeformation upon cooldown due to different CTE´s Ambient parameters otemperatures of the modules otemp. of various elements ohumidity in several spots What is necessary to prove it works

8. Waclaw Karpinski General meeting 13.06.028 Tracker Inner Barrel System Test  Phase 1 (April-July): Readout of 1 to 6 modules with a complete (analog & digital) optical link; test with prototype PSUs with long cables. -Phase 2 (July-December): mechanical and electrical integration and tests of a small part of TIB: - 6 double sided modules on Layer #1 cylinder - 12 single sided modules on Layer #3 cylinder

9. Waclaw Karpinski General meeting 13.06.029 Tracker Inner Barrel System Test

10. Waclaw Karpinski General meeting 13.06.0210 LAB set-up in Florence copper readout : UTRI+FED optical readout: Opto Hybrid + Fiber + Opto Receiver + Diff. Buffer +FED PC with FED, FEC and TSC CCU Detector and Opto Hybrid Interface Board (UTRI ) Tracker Inner Barrel System Test

11. Waclaw Karpinski General meeting 13.06.0211 T(ns) Optical Readout 57 ADC 60 ADC Copper Readout T(ns) AD counts NCh/bin AD counts NCh/bin Optical Readout Noise 1.47 ADC Noise 1.18 ADC

12. Waclaw Karpinski General meeting 13.06.0212 Signal to noise  Signal equivalent to roughly 2 MIPs  Copper readout: S/N =42  Optical readout: S/N =48 Tracker Inner Barrel System Test

13. Waclaw Karpinski General meeting 13.06.0213 The rod components InterConnect Bus InterConnect Cards Module frame Cooling pipe Patch panel Module support blocks 15 cm 110 cm Tracker Outer Barrel System Test

14. Waclaw Karpinski General meeting 13.06.0214 Detailed electrical test of IC bus + IC cards, with 12FE- Hybrids and 8 OptoHybrids (almost full load) o Check of the signal integrity o Optimization of the impedance matching o Measurement of the voltage drop along the bus o Test of I2C communication Tracker Outer Barrel System Test Results The design of IC Bus and IC Cards is correct – signals are very clean A few details have been fixed/optimized Optical link commissioned on a single channel setup Nominal gain of the link verified Optimization of the bias point

15. Waclaw Karpinski General meeting 13.06.0215 Next step: Integrate a rod with electrical components and real modules Build an Alu box, gas tight, with patch panel for pipes (cooling and dry air) and other services (It can house 2 rods) Add external temperature and humidity probes Commission a cooling system with C 6 F 14 Tracker Outer Barrel System Test

16. Waclaw Karpinski General meeting 13.06.0216 Current status: All modules working properly and read out under bias External temperatures probes also read out Cooling running smoothly Grounding scheme similar to the “final” one implemented Now ready to start quantitative measurements Study sensitivity to noise on the power lines / grounding Go to the tracker operating temperature Install 12 detectors in the second rod (DS rod) Add a second rod Further steps Tracker Outer Barrel System Test

17. Waclaw Karpinski General meeting 13.06.0217 28 Si-detectors 28 FE hybrids 28 Optohybrids 2 CCUM 4 IC Boards Tracker Endcap System Test Front petal front petal back petal 3 power groups : 1. Ring #1, #2 48 APVs 24 APVs 2. Ring #3, #4, #6 44 APVs 32 APVs 3. Ring #5, #7 44 APVs 56 APVs A-side B-side

18. Waclaw Karpinski General meeting 13.06.0218 Design verification of petals omechanics, done oelectrical performance of the interconnect board, done odeformation after cooldown tested System test in 4 steps: 1.Test of the 2nd detector group (rings #3, #4, #6) 2.Test of the 3rd detector group (rings #5, #7) Fully equipped but without Si-Sensors, 3.Test of the 1st detector group (rings #1, #2) Fully equipped but without Si-Sensors, Results expected by the end of this year 4.Full System Test for Front and Back petal o fully equipped with Sensors and front end electronics o with final cables and power supplies Final results expected in spring 2003 Tracker Endcap System Test

19. Waclaw Karpinski General meeting 13.06.0219 Tracker Endcap System Test Test of the mechanical compatibility Digital Optical Hybrid Interconnect Board Analogue Optical Hybrid Frontend Hybrid R#1 R#3 R#5 R#7 R#2 R#4 R#6

20. Waclaw Karpinski General meeting 13.06.0220 First optical readout of TEC Module: Lyon

21. Waclaw Karpinski General meeting 13.06.0221 Signal Integrity Reset Pulse Differential Bunch Clock Pulse Tracker Endcap System Test Over-voltage measurements Behaviour of full loaded system due to sudden variation in current consumption (switching off the frontend hybrids)  over-voltage swing due to inductance of the long cables  over-voltage gradient due to slow reaction time of the PSU

22. Waclaw Karpinski General meeting 13.06.0222 Setup for the Measurements of the Over-voltage Tracker Endcap System Test

23. Waclaw Karpinski General meeting 13.06.0223 I 250 = 1.2 A I 125 = 0.52A Over-voltage swing due to cable inductance o Commercial power supplies o Sense wires not connected o Cable Length = 100m o Different dumping capacitances I 250 = 2.75 A I 125 = 0.84 A I 250 = 1.0 A I 125 = 0.52 A Overvoltage measurements C250 = 60 µF, C125 = 40 µF C250 = 330 µF, C125 = 330 µFC250 = 740 µF, C125 = 740 µF V2.50 V1.25 V2.50 V1.25 V2.50 V1.25

24. Waclaw Karpinski General meeting 13.06.0224 Over voltage is a potential problem. o Overvoltage gradient requires :  special power supply design or  radhard voltage limiter located close to detector  could be reduced by proper system architecture o Overvoltage swing could be fixed by:  reasonable damping capacitance on the interconnect boards Over-voltage measurements Overvoltage gradient due to slow regulation time of PSU o senses wires connected o commercial power supply o dumping capacitance 700µF o cable 100m,  U = 0.8V o 4 frontend hybrids toggled;  I = 2A Overvoltage.4 V above the limit

25. Waclaw Karpinski General meeting 13.06.0225 Conclusions and Remarks o System test is underway for TIB/TOB/TEC o The goal is to test an overall performance of a complete subsystem: Si-Modules + FE-electronics / analogue optical links / digital control links /long cables / power supplies /monitoring o It´s intended to be a step by step process All sub-components will be integrated as soon as they are made available o First TOB Rod is integrated, ready to start quantitative measurements o Final results for all detectors are expected by the beginning of 2003