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Infrared Sensor Chip Systems for ESA’s Euclid Mission

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Presentation on theme: "Infrared Sensor Chip Systems for ESA’s Euclid Mission"— Presentation transcript:

1 Infrared Sensor Chip Systems for ESA’s Euclid Mission
Earth and Planetary Science Your Partner for: Space-Based Astronomy Ground-Based Astronomy Infrared Sensor Chip Systems for ESA’s Euclid Mission Selmer W. Anglin, Eric C. Piquette, Mark C. Farris, Scott A. Cabelli, Richard Blank, John M. Edwards, Andre W. Wong, Lalit Bhambhani, James W. Beletic (Teledyne Imaging Sensors, Camarillo, CA); Gerard Luppino, Ryan Bradley, Eric Moore (GL Scientific, Honolulu, Hawaii) Euclid : European Space Agency’s Dark Energy Mission Euclid objectives Euclid plans to achieve the following science goals… Determine dark energy equation of state Distinguish general relativity from modified gravity theories Determine the nature of dark matter By making weak lensing and redshift measurements Minimum survey area of 15,000 deg2 (40% of all) Measure shapes and shears of galaxies Measure galaxy redshifts to determine galaxy clustering NISP instrument (Laboratoire d’Astrophysique de Marseille (LAM), France) – Opto-mechanical assembly with filter wheel assembly, grism wheel assembly, optical assembly and calibration unit Near-Infrared Detection System (NI-DS) made of 16 Sensor Chip Systems (4 × 4 mosaic of SCS subassemblies) Euclid spacecraft (Thales Alenia Space, Italy) Euclid Sensor Chip System (SCS) 2.3 µm cutoff H2RG detector (~100 K) SIDECAR Module focal plane electronics (~145 K) Custom flexible cable (SCA-to-SIDECAR) tailored to the thermal interface requirements of Euclid SCS SIDECAR Module made of CE-9 material provides an excellent CTE match to NISP mounting structure SIDECAR to drive a 6-meter harness interfacing to Euclid warm electronics Custom SIDECAR firmware for enabling all Euclid operating modes Teledyne H2RG Sensor Chip System (SCS) H2RG SCA 2K × 2K × 18 µm MBE mercury cadmium telluride (HgCdTe) detector Flight SCA package with molybdenum pedestal for cryogenic operation Wirebond rigidflex assembly provides electrical interconnection to and from SCA High-density 85-contact AirBorn Nano series connector brings out all capabilities of Teledyne H2RG readout integrated circuit (ROIC) H2RG Sensor Chip Assembly (bottom side) (detector side) SIDECAR Focal Plane Electronics Compact; fits within H2RG footprint to enable modular mosaic focal plane assemblies Designed for cryogenic operation down to ~77 K by selection of appropriately CTE-matched materials For SIDECAR Module performance data, please see Cabelli / Farris poster (SDW2013), “The SIDECAR ASIC Module (SMd) – An Ultra Compact Focal Plane Array Controller Package for Space Flight and Ground-Based Applications” Euclid SCA Performance Demonstrated Seven (7) SCAs delivered in Evaluation Phase meet Euclid Grade 1 performance requirements CDS and Fowler-16 noise performance for SCAs delivered for Euclid. Median dark current performance for SCAs delivered for Euclid. Spectral QE curve obtained by fitting AR coating transmittance curve to QE data points (white circles) measured at discrete LED wavelengths The work reported in this poster was performed for the European Space Agency during the Euclid Evaluation Phase. However, any views expressed herein can in no way be taken to reflect the official opinion of ESA.


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