1. Company Profile XIAMEN G&P ELECTRONICS CO., LTD. Jiayi Industrial Park, Huli District Xiamen, Fujian province, China 361006 TEL:+86-592-6110703 FAX:+86-592-5700318 E-mail: xmfpc@globalsources.com http://www.globalsources.com/xmgp.co

2. Company Information Major Customer MFG Process MFG Capability MFG & Test Equipment Content of Profile Content of Profile

3. Company Information Xiamen G & P Electronics Co. Ltd specializing in the developing, manufacturing and marketing of flexible PCB. With advanced equipments and skilled workers, we produce 30,000 m 2 FPC monthly at our ISO 9001-certificated factory in Xiamen. Each of our products is made of top-grade materials and compliant with the RoHS directives. Some well-known buyers such as Amoi Mobile and AOC source FPC from us because of our competitive price, reliable quality and prompt delivery. Our greatest advantage over our competitors is our engineers. All of them is well trained and experienced. Currently they are focusing on improving technology, reducing cost and defect rate to meet a higher market standard. Just let our professional engineers work on your OEM/ODM orders.

4. Company Information Factory area Employees R & D engineers Capacity ： 5000 Square Meter ： 375 : 20 ： 20,000-30,000 m 2 /month

5. Product Introduction Advantage Small Size Light Weight Flex-for-Installation Dynamic Flexibility Application  Note-Book  Digital Camera  DVD / CD-ROM  HDD  Printer  Scanner  PDA  Cellular Phone  LCD  Auto-Mobile

6. Our Customers LCD OR LCMMobile

7. MFG Process

8. Major Equipment(1) NC Drilling Exposuring Room

9. Major Equipment(2) D.E.S.

10. Major Equipment(3) CVL Lamination Hole-Punching

11. Major Equipment(4) Screen Printing Elec.-test & Visual Inspection

12. Major Equipment(5) Blanking

13. Quality Assurance System  Incoming QC  Strict quality control and inspection are done at each stage of producing  100% of In-process QC and Final inspection  Testing is carried out within three lab: chemical, physical and electric-test  Weekly quality report with statistical information  Prompt responses and feasible solution to customer‘s quality complaint.

14. MFG & Test Equipment(1) 2-D Measuremen System Peel Strength Testing Machine

15. MFG & Test Equipment(2) Swaying Test Machine Micro Scope

16. MFG & Test Equipment(3) Slice up Muller X-ray Thickness Measurement

17. Process Capability  Tolerance  Conductor width: + / - 0.03mm  Hole diameter: + / - 0.05mm  Accumulated pitch: + / - 0.05mm  Outline dimension: + / - 0.05mm  Surface Treatment  Electrolytic Tin ( Lead free) Plating  Hot Air Leveling  Electrolytic Nickel and Gold Plating  Eelectroless Nickel and Immersion Gold Plating  Number of layer: 1-6  Copper Foil: 1/3, 1/2, 1.0, 2.0 oz  Material: Polyimide (Kapton), PET, FR4  Min. conductor width/spacing: 0.075 mm  Min. hold diameter: Drilling:0.20 mm Punching: 0.50 mm  Special Material Available: Halogen Free 2 mil PI  General

18. Honor Certificate Honor Certificate 2002 passedISO9001:2000 RoHS Approval by SGS report 2002 passed UL （ UL ： E230743 ）