1. PCB procurement WG Status report PCB WG status, 25/03/2014Joerg Wotschack

2. PCB specification document  Review of specs by Rui de Oliveira  Update concerning the accuracy on the cutting of the edges  Pressure for glueing can be reduced from 30 kg/cm 2 to 15 kg/cm 2 (tests done at CERN show no problem)  Interconnected lines (shorts)  Interrupted lines (resulting in partly dead strips)  Questions  How many defects of each type can we accept?  Shall we specify limits for these defects in the specs for the PCB producers and, if yes, which? PCB WG status, 25/03/2014Joerg Wotschack

3. PCB + readout strips PCB: -2250mmx 500mm ???? -single side -0.5mm thick +/- 10% -Starting copper foil : 17um thick copper + 17um or 35um copper protection -Final copper thickness 17um -Pattern absolute accuracy: +/-30um referring to the GERBER file in the 50cm side +/-120um referring to the GERBER file in the 2m side -120um minimum line and space, +/-20% general accuracy -NI/Au or Ag plating on connector fingers -Cutting absolute position accuracy : +/-50um referring to the copper pattern on the 50cm side +/-200um referring to the copper pattern on the 2m side -Cutting relative accuracy : (not referred to the pattern) +/-50um in all directions -Drilling absolute position accuracy : +/-50um referring to the copper pattern on the 50cm side +/-200um referring to the copper pattern on the 2m side -drilling relative accuracy : (not referred to the pattern) +/-50um in all directions 3Rev:B ( check-->19 pages document) Base material, when used, shall be flame retardant rated UL 94V-0 laminate glass fiber epoxy and conform to L94 according to IPC-4101/94. Copper shall be type H with pits and dent, class B. When procuring base material the following are required: minimum TG 170°C, minimum TD(5%) 350°C, minimum T-288 35min, maximum Z-axis thermal expansion coefficient above TG 280PPM/°C (alternatively Z-axis thermal expansion coefficient between 50-260°C of 3.5% maximum is acceptable) Fabrication and inspection shall be according to IPC-6011 and IPC-6012, class 2 Acceptance of finished printed boards shall be in accordance with IPC-A-600, class 2

4. How to deal with defects  We have observed some defects in the readout strips (metallic) in a number of boards delivered by ELTOS for the MMSW chambers (as presented by Fabian Kuger, e.g., in the Würzburg Meeting)  Defects are  Interconnected lines (shorts)  Interrupted lines (resulting in partly dead strips)  Questions  How many defects of each type can we accept?  Shall we specify limits for these defects in the specs for the PCB producers and, if yes, which? PCB WG status, 25/03/2014Joerg Wotschack

5. PCB WG status, 25/03/2014 QC on PCBs Besides systematic dimension deviations local defects on the PCBs are a QC issue: Defect: Interconnected strips Repaired lines are straight, width variations are small Damaged strip, huge width variationStrip is broken  dead channel

6. Considerations for the discussion  Tracks from the IP have inclinations between 7 and 35 degrees  Typical cluster sizes (track projection onto readout strips) are 10 – 28 mm or 3(4) to 8(10) strips.  A missing or interconnected strip will lead to a missing or wrong strip signal and thus to a larger position error  Comparable effects are created by the pillars (1% inefficiency)  Proposal: accept defects at a similar level as the inefficiency created by the pillars  ≤10 interconnected lines (shorts) as long as they are distributed; minimum distance between defects: 10 strips  ≤ 10 interrupted lines/PCB (1024 channels) as long as they are distributed; minimum distance between defects: 10 strips  The sum of interconnects and shorts: ≤10/PCB; minimum distance between defects: 10 strips PCB WG status, 25/03/2014Joerg Wotschack

7. What about spares?  How many PCBs of each type do we want to order? Minimum is 64 PCBs of each type  To cope with defects  To allow for selection of PCBs  To allow for accidents during panel construction  Is it cheaper to accept defects and to produce 10–20% more boards?  Option on re-processing after full delivery PCB WG status, 25/03/2014Joerg Wotschack

8. Test glueing status  End of last year we decided to ask industry for tests for Kapton foil glueing and pillar deposition over the (almost) full size PCBs (0.5 x 2.16 m)  Labs agreed to take responsibility for getting these tests done  Saclay deals with ELVIA  Frascati with ELTOS  US with Triangle Lab (tbc)  Goal is to have results by beginning of May PCB WG status, 25/03/2014Joerg Wotschack

9. Next steps  PCB layout version 0 exists (Givi)  Try to get agreement on general features today  Next steps  Integration with mechanics and FE board layout (AZ) and possibly other electronics boards until 15 April  Final checks with PCB lab until end April  Drawings ready for Module-0 ordering by 1 May  Need to order ≈100 PCBs for Module-0s  Order in three industries (ELTOS, ELVIA, Triangle Lab) ? PCB WG status, 25/03/2014Joerg Wotschack