1. NanoFab Simulator Layout Nick Reeder, Dec 16, 2011

2. Proposal: Structure of User Activity User is presented with a starting wafer (which may or may not be blank) and a desired ending wafer. User must perform process(es) in sequence to get from start to finish. Example: Start Finish

3. Proposal: History Tab At any point, user can review the processes he has performed so far and their cumulative effect on the wafer.

4. Decision: “Revert To” Option? If user wants to undo one or more completed processes, does he have the option to revert to a prior stage in the history, or must he start over again?

5. Decision: Processes or Resources? User chooses which process to perform next. User chooses which resources to use next.

6. Decision: How to Represent Various Materials in 2-D Cross Sections? ColorsFill textures

7. Decision: List of Materials That Can Appear in 2-D Cross Sections? Substrate (Is this always silicon?) – Intrinsic – Doped Contaminants – Dust – Residue from chemical rinsing Photoresist (of specified type) – Liquid – Baked Deposited film (of specified type) …Others?

8. Decision: Displaying Dimensions? Dimensions always displayed Dimensions displayed at user’s request Never displayed. User must measure.

9. Decision: Menus or Toolbars? MenusToolbar

10. Decision: Instantaneous or Real-time? When user initiates a process, does it complete immediately, or take a realistic amount of time to complete? How many of the processes require visual monitoring by the user to decide when process is complete? (We discussed having videos of spin coating process that show changing appearance of photoresist as time passes.)

11. Decision: Number of Views? Is cross-section view adequate, or for masking (and perhaps other processes?), do we need to provide a top view as well?

12. Decision: How Many Modes of Operation? Possible modes: – Demo – Single-process – Sequence Are assessment results to be recorded in a database for instructor’s use, or just self- assessment for student?

13. Spin Coating Simulation Nick Reeder, Dec 16, 2011

14. Task Analysis For each process to be simulated, we must perform a detailed task analysis that identifies, for each process: – Equipment and materials required – Input parameters to be set – User actions We must then decide which of these actions and parameters to include in the simulation.

15. Example: Task Analysis for Spin Coating Process 1.Setup (in any order?) – Turn power on. – Place wafer in spin coat machine. – Select type of photochemical and apply to wafer. – Set parameters: Time Revolutions per minute. Acceleration. – Activate vacuum. – Activate nitrogen purge. – Place napkins to absorb excess photochemical. 2.Activate motor and wait until it stops automatically. 3.Wrap-up (in any order?) – Remove wafer. – Remove napkins. – Deactivate vacuum. – Deactivate nitrogen purge. – Turn power off.

16. Questions: Photochemicals AZ 6632 AZnLOF 2070 LOR 3A LOR 10B LOR 30B ma-P 1275-HV MCC Primer PMMA SPR 505 SPR 955 SU8 2015 SU8 2025 SU8 2050 SU8 Thinner Thinner P UVN 30 How many classes of chemicals are we simulating? Photoresist (Positive and negative? Lift-off?) Thinner Primer Which of these chemicals do we want to include?

17. Questions: Governing Equations Curve fitting from AZ 6632 datasheet, where y = film thickness (  m) and x = spin speed (rpm) y = 5.712e -1E-04x for 2000  x  6000 Is it correct to use exponential fit? Can we extrapolate outside the range of x given in the datasheet? How do we model effect of time and acceleration? Is Laurell’s spin-speed calculator reliable? “This calculator is based on the principle that the thickness of a coating generally varies inversely with the square root of a corresponding spin speed.” http://www.laurell.com/support/spin_speed_calc.php http://www.laurell.com/support/spin_speed_calc.php

18. General Question If we spin coat a wafer with an uneven surface (such as one that’s already been etched), do we get a layer of uniform thickness, or of uniform height, or neither?