1. Max-Planck- Institut für Plasmaphysik Device Assembly K.-H. Oelgemöller 2007.10.09 NCSX Engineers in IPP 11.10.2007 – 12.10.2007 Dokumentennummer NCSX Engineers at IPP Department Device Assembly

2. Max-Planck- Institut für Plasmaphysik Device Assembly K.-H. Oelgemöller 2007.10.09 NCSX Engineers in IPP 11.10.2007 – 12.10.2007 Dokumentennummer First I will introduce my self: Name: K-H. Oelgemöller, Dipl.-Ing. Age: 48 Years Position: Head Device Assembly Experience: Planning, Engineering and Assembly Parts of Refinery-, Power- and Steel-Plants In Project W7-X: since June 2004

3. Device Assembly Max-Planck- Institut für Plasmaphysik Unternehmung WENDELSTEIN 7-X K.-H. Oelgemöller NCSX Engineers in IPP, 2007.10.11 3 All projects are limited to the same borderlines: 1. Time 2. Money 3. Quality To ensure the finishing the Project W7-X within the approved limits we have installed the following Structure in “Device Assembly”

4. Max-Planck- Institut für Plasmaphysik Device Assembly K.-H. Oelgemöller 2007.10.09 NCSX Engineers in IPP 11.10.2007 – 12.10.2007 Dokumentennummer 1.Process-/ Work- planning 1.1Every Monday we discuss the up-dated 4-week-time-schedule with all involved people. We present the milestones for the required parts or actions, 4-weeks in future. The responsible officers has to confirm the delivery date of their parts or actions.

5. Max-Planck- Institut für Plasmaphysik Device Assembly K.-H. Oelgemöller 2007.10.09 NCSX Engineers in IPP 11.10.2007 – 12.10.2007 Dokumentennummer 1.2 Out of the confirmed 4-week-time-schedule we generate every Thursday the detailed Week-Planning (Manpower and Equipment) for the next week.

6. Max-Planck- Institut für Plasmaphysik Device Assembly K.-H. Oelgemöller 2007.10.09 NCSX Engineers in IPP 11.10.2007 – 12.10.2007 Dokumentennummer 2.Assembly On base of the Process-/ Work- planning and the “QAAP” ( Quality Assurance Assembly Plan, (detailed work break down structure)) the responsible crew is doing and controlling the work packages.

7. Max-Planck- Institut für Plasmaphysik Device Assembly K.-H. Oelgemöller 2007.10.09 NCSX Engineers in IPP 11.10.2007 – 12.10.2007 Dokumentennummer Process planning, Scheduling Recource planning, Documentation Hübschmann, Pasyutina, Schwarzkopf, Wiegand Storage/Magazine Consumables Bormann*, Steffen* Procurements Pasyutina Metrology Bräuer, Endler, Hillmann*, E. Lorenz, Junge, J. Müller, Poncet*, Radau, Siche Welding Control Holluba*; Lahr Shift Manager Modrow Mounting stand leader Domscheit, Domscheit, Jassmann Management of component preparation Bau*, Günther, Höchel, Ihrke*, Jung, Neuner*, Raatz*, Reinke, Schinkel Service Nankemann Assembly Anders*, Bertram*, Bulgrin*, Goericke*, Jacobs*, Klagge*, Kullok, Kuse*, Langer*, Spreeberg*, Stolpe*, Terkowski, Wulf*, Ziemann* Vacuum Technology Ahmels, Braun, Dutz, Grote, Kuck, Rademann, W. Schneider, Schweitzer, Volzke Further external not named manpower *person assigned from other divisions or External ASSEMBLY L. Wegener Secretary H. Nothnagel ONE-SITE CO- ORDINATION S. Gojdka DEVICE ASSEMBLY K.H. Oelgemöller * PERIPHERY R. Krampitz ASSEMBLY TECHNOLOGY F. Hurd* For your overview this slide shows the Organisation diagram of Assembly with their Sub- divisions. One of them “Device Assembly” with its groups.

8. Device Assembly Max-Planck- Institut für Plasmaphysik Unternehmung WENDELSTEIN 7-X K.-H. Oelgemöller NCSX Engineers in IPP, 2007.10.11 8 In answering the question, “What is my Job in the Assembly Wendelstein W7-X”? Equal a soccer-team: I’m the “trainer”

9. Device Assembly Max-Planck- Institut für Plasmaphysik Unternehmung WENDELSTEIN 7-X K.-H. Oelgemöller NCSX Engineers in IPP, 2007.10.11 9 Thank you!

10. Device Assembly Max-Planck- Institut für Plasmaphysik Unternehmung WENDELSTEIN 7-X K.-H. Oelgemöller NCSX Engineers in IPP, 2007.10.11 10 1.7 Work packages: 1. Component preparation 1.1. Coils, 80 days additional work out of changes and Collisions 1.2 Plasma Vessel, Instrumentation, Cooling- pipe work, Multi-Layer isolation 1.3. Support-Structure, 20 days additional work out of changes and Collisions Instrumentation. 2. Mounting Stand 2.1 MST IA / IB Half-Modul-Assembly 2.2 MST II Modul-Assembly 2.3 MST III-IVa-IV Final Modul Assembly 2.4 MST V Port Assembly In all Mounting Stands will be worked in a 2 shift system (06:00 am to 02:25 pm; 02:00 pm to 10:25 pm). The overlap is to discuss the work packages are done and must be done. Also problems. At the overlap always a member of the Planning department is involved.

11. Device Assembly Max-Planck- Institut für Plasmaphysik Unternehmung WENDELSTEIN 7-X K.-H. Oelgemöller NCSX Engineers in IPP, 2007.10.11 11 Shift organization: Mounting- Stand-leader Crew-leader 5 Mechanic Crew-leader 5 Mechanic Crew-leader 5 Mechanic