1. Innovative technologies
Innovative products
Innovative technologies

2. SEMICON Sp. z o.o. History: 1987 – foundation of SEMICON Sp. z o.o.
1992 – first signed distribution agreement: LEM NORMA
1993 – 1996 – next distribution agreement: Kontakt Chemie, Schurter, Multi- Contact
1997 – SMT assembly line launch
1998 – launch of an electronics store in Warsaw (Wolumen)
2003 – implementation of the ISO 9001:2008 quality system
2009 – starting stencils laser cutting service

3. SEMICON Sp. z o.o. Participation in EU Framework Programmes:
– project: GreenRose (FP6)
– project: Tele-Ekg (FP6)
– project: Radi-Cal (FP7)
– project: ChipCheck (FP7)
– project: µBGA (FP7)

4. SEMICON Sp. z o.o.
Today:
Currently, the company employs over 50 people including headquarter, production and shop.
Starting from 1st January 2013 we are participating in a new national project - Innovative advanced surface mount technology (SMT) printed circuit boards.
Source: STATS ChipPAC
Source: PCB-togo.com
Source: code.google.com

5. Certificates ISO 9001:2008 ISO 14001 AQAP 2110
We only work with companies which have UL certificates
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ;

6. SEMICON Sp. z o.o. - business areas Distribution:
Electronic components
Electronic materials
Measuring equipment and accesories 6

7. SEMICON Sp. z o.o. - business areas Subcontracting:
PCB assembly (THT, SMT)
Laser cut SMT stencils manufacturing
Own production of laser modules

8. THT and SMT assembly More than 15 years experience in electronics
Customer support from design to production
Engineering consultancy
Direct contact to supply chain
ESD control
IPC-A-610 trained employees
Compliance with RoHS
PCB Design possibilities
Component supply possibilities

9. Production capacity - SMT assembly 4 SMT lines
Źródło: JUKI Co.
4 SMT lines
prototypes, small, medium series
PCB size: max. 800 x 510 mm
Components: x 74 mm, PoP
PCB thickness: 0.2 mm - 4.0mm, flex PCB assembly
Pitch: ≥ 0.20 mm
Selective conformal coating possibilities
Glue, solder paste possibilities
AOI inspection, functional tests, test probes, BGA – X-ray measurements
Hot Bar technologies (flex, LCD)

10. Production capacity - THT assembly Manual soldering
Lead wave soldering
PB-free wave soldering in nitrogen
1.2 mln THT components monthly/1 shift

11. Main customers Medical Defence Automotive Energoelectronic Lighting
Telecomm
R&D

12. Stencils laser cutting
High-speed cutting machine LPKF Stencil Laser G6060
Frame or frameless stencils
Accuracy and repeatability: ±2µ
Material: stainless steel, nickel
Thickness: up to 600µm (oxygen cutting)
Engineering, modifications, e.g. glue stencils
Aperture inspection – high resolution scanner
Tension inspection
Źródło: LPKF Laser & Electronics AG

13. Optoelectronic equipment manufacturing
Laser modules
Wavelenghts: nm
Power input: 0,2 – 500mW
Pointers
Line and cross generators
Customization
Laser displacement sensors:
Resolution: up to 10µm
Measurement range: up to 200mm
Measurement distance: up to 50m
System includes: laser module and position detector

14. Laser modules applications
Pointers
Cross-hair pointers
Alarm systems, laser barriers
Sensors
Positioning systems
Textile industry
Wood processing:
Wood cutting
Stone cutting
Metal cutting
Tire industry
Mining industry

15. Miniaturization in electronics
Passive Components
Source: pl.wikipedia.org

16. Miniaturization in electronics - ICs
Source: Amkor Technology, Inc

17. SMT challenges 01005 components – paste screenprinting
QFN, DFN components – lifting effect, voids
Large and fine pitch BGAs – thermal balance, voids, „head in pillow” effect
PoP components – warpage, placing, BGAs errors
Large PCB assembly – bow and twist

18. World trends: higher density PoP
3D package development
First generation: multi-level structures
Second generation: PoPs
Next generation: TMV PoPs, BVA PoPs
Source: Invensas Co
Source: Amkor Technology, Inc.
Source: Amkor Technology, Inc.
World trends: higher density PoP

19. PoP – Package on Package
Why PoP?
Higher speed, lower energy consumption
Memory chips from different vendors
Different types of memory chips: speed, capacity, etc
Separate inspection of processor and memory chips
Lower junction temperatures (at least compared to stacked die)
Source: ElectroIQ

20. PoP – Package on Package
PoP stacking assembly options:
Source: Panasonic Co

21. TMV PoP – Thru Mold Via Package on Package
Source: Amkor Technology, Inc.
Dimension control vias reduces the distance between the system memory and the TMV after their assembly.

22. TMV PoP – Thru Mold Via Package on Package
Why TMV PoP?
Improved warpage control and bottom package thickness.
High density stacked (memory) interface.
Increased die to package size ratio. TMV can provide over a 30% increase in maximum die size.
Improved board level reliability.
Improved fine pitch SMT process window.
Supports Wirebond, flip chip devices (both area array solder and fine pitch CuPillar), stacked die and passive components integration.TMV could also be applied to FlipStack® (combo FC+WB) and FC w/ TSV stacks.
Source: IMAPS.

23. BVA PoP – Bond Via Array Package on Package™
Why BVA PoP?
The increase in the number of connections to the logic circuits from 300 to over 1000.
Reduction of PoP total thickness (lower than TMV PoP).
Source: Invensas Co
Reducing the pitch (up to 0.2mm) of the processor through wire leads increases the number of possible connections in the POP system.

24. BVA PoP – Bond Via Array Package on Package™
Copper wires, height of 400µm pitch of 240µm.
Source: Invensas Co

25. Perspectives for PoP solutions
Source: Gartner, Inc
What next?

26. Thank you for attention!
Piotr Ciszewski