1. US CMS Silicon Tracker Project Regina Demina KSU Florida State University May 11, 2002

2. A bit of history u End of 1999 – CDF and DØ silicon detectors (~10 m 2 of silicon, ~2M channels) out of SiDet to be installed in collision halls u December 1999 – CMS made a decision to go with all silicon tracker = u 68m 2 (inner barrel and disks) + 164m 2 (outer barrel and disks) = 232m 2 u 5.1 M + 5.6 M = 10.7 M channels CDF SVX installation A natural decision for US institutions to join the silicon effort.

3.  Fermilab u B. Flaugher, R. Lipton, P. Rapidis, L. Spiegel, S. Tkaczyk  Kansas State University u T.Bolton,R.Demina,W.Kahl,S.Korjenevski, u W.Reay, R.Sidwell, N.Stanton  Northwestern University u D. Buchholz  Texas Tech University u A. Sill  University of California, Riverside u Gail Hanson  University of California, Santa Barbara u C.Campagnari, D. Hale, J.Incandela  University of Illinois, Chicago u L. Chabalina, C. Gerber  University of Kansas u P. Baringer, A. Bean, L. Christofek, X. Zhao  University of Rochester u R. Eusebi, E. Halkiadakis, A. Hocker, P. Tipton Si Tracker Group Two new groups Will provide important support for the UCSB production line

4. Silicon tracker in Spring 2000 u Single sided, low resistivity silicon sensors as a baseline technology qextensively tested by RD20 – rad hard to >10 Mrad qSeveral vendor qualified (6” production lines) u Working front end chip – APV25, some issues to be resolved with multiplexer chip – MUX PLL u Hybrids – two technologies considered u Mechanics in excellent state – a lot inherited from MSGC’s u Plan to start production in fall 2001

5. Outer Barrel Space Frame Spring 2000

6. Outer Barrel Rods Silicon modules Spring 2000

7. Automated assembly 3 TOB modules/ 30 min Gantry at CERN Spring 2000

8. SiTrkr Organization

9. Schedule Issues Schedule slipped by ~ a year qHybrid schedule is a concern  Decision on technology was made in September 2000  prototyping was semi- successful  might change the technology qFEDs  Initial models for testing of large quantities of FE hybrids and modules expected to be ready in late 2002  Optical models for rod testing will be available 6/03 qOptical hybrids for assembly of modules into Rods will be available in late 2002 Other critical items are performing better qGantries qPC based test stands qProbe stations qSensors

10. FE Hybrid status Industrial hybrid (V0 – unpackaged chips on ceramics) production started with 1 st Producer. 160 Hybrids delivered (yield 65%) They also say that “the feature size” of hybrid is too small for mass production.Industrial hybrid (V0 – unpackaged chips on ceramics) production started with 1 st Producer. 160 Hybrids delivered (yield 65%) They also say that “the feature size” of hybrid is too small for mass production. The 2 nd producer has still problems with shorts.The 2 nd producer has still problems with shorts. Design of the V1 version of the hybrid (packaged chips on ceramic- easier to produce) done. Send order to 1 st producer.Design of the V1 version of the hybrid (packaged chips on ceramic- easier to produce) done. Send order to 1 st producer. 40 substrates hybrids V2 (packaged chips on FR4) received, some 10 populated. Hybrids and substrates distributed for mechanical and electrical tests. They look ok. Likely change in technology choice.40 substrates hybrids V2 (packaged chips on FR4) received, some 10 populated. Hybrids and substrates distributed for mechanical and electrical tests. They look ok. Likely change in technology choice.

11. HIP and pinhole effects on APV25 u Highly Ionizing Particles qproduced in nuclear interactions, a rare phenomenon) qcan saturate entire APV for ~200 ns qResults in inefficiency of ~1.3% u Pinholes qLeakage current directly into APV25 qTypically disconnected from readout qSignal inefficiency of >=2 connected pinholes/APV qRate of new pinhole development <10/(few 100 wafers=1000 APV’s) u Fixes  Change resistor value on hybrid (100   50  ) qAPV inverter off – reduces dynamic range PSI test beam planned at the end of May to further study the effect US to provide modules

12. TOB Module ~20 cm Build 6,000 TOB modules Current plan 2/3:1/3 at FNAL:UCSB 2 sensors bonded together  PA  hybrid (4 APV25 chips)

13. CMS module production u Sensors probed at K-State u Automated module assembly system – Gantry - is fully commissioned at Fermilab u Placement accuracy <5um u 4 (+3) fully functional modules were delivered to CERN for test beam studies at PSI.

14. Module Testing at FNAL ARCS CMS DAQ Two test systems are now in operation at SiDet

15. From R&D to Production R&D CMS Tracker production