1. FCBGA Package Warpage ØII Definition Stage Project Kirk Van Dreel, Plexus HDP User Group Member Meeting Host: Engent Atlanta, Ga. September 9, 2015 © HDP User Group International, Inc.

2. Background  Package/board Warpage increasing trends Driven by thinner package substrates and thinner die  Package/Board contacts getting smaller and closer thereby reducing ability to overcome increased Warpage.  Solder Joint Quality is Impacted by the increasing Package Warpage.  With advent of lead free soldering, the assembly temperatures have increased and the Warpage impact has been exacerbated. © HDP User Group International, Inc. 2

3. 3 Goal © HDP User Group International, Inc. Establish a limit for dynamic package warpage that can be mitigated during board assembly without impacting solder joint quality

4. Project Objectives Phase 1 - Test Method Development This phase will establish a test method which will enable the team to compare and contrast the effects of the mitigation techniques. Phase 2 - Characterization Of Mitigation Methods and Max Package Warp Specifications This phase will leverage phase 1’s output to establish the maximum warp an optimized process can accommodate and characterize the contribution of the mitigation techniques on the process yield. © HDP User Group International, Inc. 4

5. Hot Air Rework Machine Method Basic Concept of Hot Air Rework Equipment and Process  Blowing heated air from the top, down on to the BGA package using a nozzle  The air heats up the package, board and solder joints  Air temperature and flow rate is controlled  Package is lifted up or down with a vacuum cup  Video Camera, can record a few solder joints on the outside row on one side of the package  The basic concept is to lift the component up or down at different temperatures to simulate dynamic warpage characteristics of the package Rework Machine SRT Summit 1800 Video camera © HDP User Group International, Inc. 12

6. Test Vehicle FactorLower PCBA Materials Size 155 X 60 mm Thicness 0.63in Surface Finish ENIG Solder Mask Tayo 4000 Pad Size 0.60mm Solder Mask Opening 0.40mm Substrate Mtrls 370HR Cu Weight 1/2 oz Cu Layer Count 2 Components Size 10.6mm sq I/O Count 28 Thickness 0.063in Solder Alloy SAC305 Surface Finish ENIG Solder Mask Tayo 4000 Substrate Mtrls 370HR Cu Weight 1/2 oz Cu Layer Count 2 Ball size 0.55mm Pad size 0.5 Pitch 1.2 mm

7. Phase II: Test Plan FactorLowerUpper Solder Materials Solder Paste ActivityL0H1 Solder Paste Tackiness30gr50gr Reflow Profile Cooling rates (Delta T) 1 0 C/sec3 0 C/sec Peak temperatures 235 0 C255 0 C Atmosphere PPM Air500 ppm Stencil Stencil Thickness3.5 mil5.0 mil Solder paste volume120% of 3.5mil 70% of 5 mil Factors:

8. Phase II: Test Plan CategoryResponseCriteriaMeasurement Tool Z-axis Displacement to products As Placed+/- 12 um flatnessCamera Pixel Count Pre-Liquidus+ 12 um above pasteCamera Pixel Count Peak Reflow+ 12 um above pasteCamera Pixel Count Failure RateHoP DPMO Defect per solder jointVisual Inspection / Die & Pry, Sample X-ray CT NWO DPMODefect per solder jointVisual Inspection / Die & Pry, Sample X-ray CT Responses: Primary Response: Sample Size: Total Substrates:620 Total Components:620 8

9. Phase II Project Activities Project ActivitiesProvider Finalize ProtocolTeam Provide Laminate for SubstratesPanasonic Fabricate Substrates Sanmina Substrate BumpingNihon-Superior Rework System ProgrammingVJ Technologies* Stencil ProcurementNihon Superior Lease PrinterHDP Assemble Substrates Plexus Die and Pry AnalysisEngent Plexus Sanmina-Huntsville Nihon-Superior VJ Technologies* Cross Section Analysis Plexus Data AnalysisPlexus Report DevelopmentTeam * Non-Member © HDP User Group International, Inc. 9

10. Phase II Proposed Schedule © HDP User Group International, Inc. 10 Project Plan OwnerEst. CompActual Test Vehicle DesignPlexus08/01/201507/16/2015 Finalize ProtocolTEAM10/01/2015 Substrates FabricationSanmina10/30/2015 Lease Screener ($8.6K)HDPUG11/03/2015 Order StencilsNihon-Superior10/23/2015 Rec’v SubstratesVJT 11/02/2015 Rec’v StencilsNihon-Superior10/30/2015 Component BumpingNihon-Sup’r/Micross10/30/2015 Receive ScreenerHDPUG/VJT11/06/2015 Rework System ProgrammingVJT11/02/2015 Complete Test Vehicles ASM VJT12/21/2015 Die and Pry AnalysisPlexus,VJT,Sanmina, Nihon-Sup’r, et al02/19/2016 Complete Data AnalysisPlexus02/19/2016 Sample X-Ray AnalysisPlexus, VJT04/04/2016 Write Report TEAM05/29/2016

11. © HDP User Group International, Inc. 11 Team Members Akrometrix Alcatel-Lucent Arlon Celestica Cisco Curtiss-Wright Engent Ericsson Flextronics Freescale Fujitsu Hitachi-Chemical Huawei IBM Indium Isola Juniper Keysight Kyzen Multek Nihon-Superior NVIDIA Oracle Panasonic Philips Plexus - Team Leader Sanmina TTM Tech Viasystems VJ Technologies (Non-Member)