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CMS Phase I upgrades LHCC September 2009 Meeting LHCC Sep 2009J. Nash - CMS Upgrades1
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Upgrade Scope LHCC Sep 2009J. Nash - CMS Upgrades2 System Phase 1Phase 2 Pixel New Pixel Detector (1 or 2 iterations?) Tracker FEDs?New Tracking System (incl Pixel) HCAL Electronics + PD replacementHF/HE? ECAL TP (Off Detector Electronics) ?EE? Muons ME4/2, ME1/1,RPC endcap, Minicrate spares, some CSC Electronics Electronics replacement Trigger HCAL/RCT/GCT to TCA Complete replacement Agreed at the May 2008 Upgrades Workshop http://indico.cern.ch/conferenceDisplay.py?confId=28746 Agreed at the May 2008 Upgrades Workshop http://indico.cern.ch/conferenceDisplay.py?confId=28746
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Phase I Upgrades issues Meeting at FNAL next month to discuss status of phase I and Phase 2 Upgrades For Phase I Quantify physics improvements as a function of luminosity Verify robustness for both peak and integrated luminosity For Phase 2 Major efforts in two areas which span multiple sub-systems Incorporating the tracking in the Level 1 Trigger Forward Calorimetry at high luminosity Two cross-detector working groups set up Regular meetings ongoing Examine progress and plan work at the FNAL meeting For today: Brief look at status of Phase I work, emphasis on areas near the beampipe LHCC Sep 2009J. Nash - CMS Upgrades3
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Current Pixel System with Supply Tubes / Cylinders 10 0 20 4060 80100 FPIX service cylinder BPIX supply tube DOH & AOH mother board + AOH’s Power board endflange prints Layer 3 & 1+2 15mm 10mm Thickness of Supply Tube inserstion envelope for FPIX LHCC Sep 20094J. Nash - CMS Upgrades
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BPIX & Supply Tube with AOH, DOH, PCBs & Fibres LHCC Sep 20095J. Nash - CMS Upgrades
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Shift Material out of tracking Volume new BPIX modules with long pigtails (~0.95m) ( micro-twisted pairs) 10mm 10 0 20 4060 80100 FPIX service cylinder DOH & AOH mother board + AOH’s power board Move DOH & AOH boards back by 50-60cm 15mm - change in FPIX insertion envelope - increase FPIX radius +5mm - possible due to tilted endposition of BPIX supply tube talk S.Streuli LHCC Sep 20096J. Nash - CMS Upgrades
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All Identical disks (1 st and 2 nd disks in locations to maximize 4-hit eta coverage) 6 disks = (6x68) outer + (6x44) inner = 672 2x8 modules (10752 ROCs) η = 2.1 η = 2.5 291 396 η = 1.3 η = 1.6 2x8s Z loc. TBD suggest 491mm from IP 30 60 161 45 64.8 BPIX / FPIX Envelope Definition for 4 Hit Pixel System Increase by +5mm LHCC Sep 2009 7 J. Nash - CMS Upgrades
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BPIX Upgrade Phase 1 (2013) 1216 modules (1.6 x present BPIX) LHCC Sep 20098J. Nash - CMS Upgrades
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Each half shell has 10 cooling loops Each supply tube feeds 5 cooling loops Angle bend (~3 0 ) during insertion taken by carbon fibre hinge Stainless steel tubes diameter = 1.8mm wall thickness = 100μm Carbon fiber hinge Inertion of BPIX – Supplytube System with new CO2 Cooling New axis of rotation (~3 degrees) during pixel insertion LHCC Sep 2009 9 J. Nash - CMS Upgrades
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Prototype Fabrication Layer 1 100 bar pressure tested Tubes, 50 wall thickness Weight Layer1 42g + 7g CO 2 LHCC Sep 200910J. Nash - CMS Upgrades
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11 The Half Disk (to be completed) Carbon fiber supporting spokes LHCC Sep 2009J. Nash - CMS Upgrades
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12 Checking for clearance as the FPix half-cylinder slides along insertion rails LHCC Sep 2009J. Nash - CMS Upgrades
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Mock-up of CMS interaction region for insertion tolerance tests FPIX rails BPIX rails Beam Pipe suport LHCC Sep 200913J. Nash - CMS Upgrades
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LHCC Sep 2009J. Nash - CMS Upgrades14
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Stainless steel facets used as heater resistors to simulate the power consumption of the sensor modules. Test of long CO2 cooling loop ( as in Layer 1) Cooling loop of layer 1 for CO2 tests at CERN CO2 Teststand ( H.Postema & A. Onnella, CERN) Tests for individual Temp. distribution at Lyon LHCC Sep 200915 J. Nash - CMS Upgrades
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SiPMs in HO 2RBXs (144 channels) are instrumented with SiPMs to confirm suitability for HO Packaged to replace HPD in existing RM Two suppliers: Hamamatsu (400 pix/mm 2 ) Zecotek (15K pix/mm 2 ) Compared in 2009 Test Beam S/B much higher than HPD Insensitive to B-field But gain is temperature-dependent Consider replacement for HPDs in R1/2 in during 2011 shutdown 16 SiPM and interface cards replace HPD Peltier Coolers 18 SiPMs replace HPD pixels CMS Physics Week 2009 Muon signal (not corrected for track path in HO scint.) Pedestal Phase I HCAL Upgrades
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SiPM in B-field CMS Physics Week 200917 Variation is consistent with temperature change: Hamamatsu gain changes 8-10% per deg Zecotek 4-5% per deg Two changes needed: Will want better temp precision (currently 1bit=0.2deg) Also, cross-talk to a specific few channels from control lines - likely an easy board modification LED data: SiPM/pinDiode Hamamatsu Zecotek Preliminary Vladimir Epshteyn
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More Depth Segmentation in HCAL June Upgrade Days18 Current 18-Channel RMs Upgrade 64-Channel HB RMs 48-Channel HE RMs
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Calorimeter signatures Electrons/Photons Spatially confined in a cluster of 2x2 trigger towers Significantly higher ECAL contribution Isolated e/ γ should have low energy deposits in the surrounding area ECAL HCAL Δη x Δφ=0.087x0.087 e/γ ECAL HCAL τ ECAL HCAL jet Taus Confined in 2x3 Clusters 3 prongs/1 prong + π 0 s have wider φ profile Small energy leak in surrounding towers Jets Most of the energy confined in a central core For jets over 20 Gev the energy is included in a 8x8 region η φ η φ η φ Phase I Trigger Upgrades
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Phase I Calorimeter Trigger Simulation Results: Factor of 2 Factor of 2 rate reduction Higher Efficiency Isolated electrons Taus Efficiency QCD Rate (kHz) Isolated electrons Taus Efficiency QCD Rate (kHz) Michalis Bachtis & Kevin Flood SLHC LHC SLHC LHC SLHC LHC SLHC LHC
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Hardware prototype for new trigger architecture LHCC Sep 2009J. Nash - CMS Upgrades21
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LHCC Sep 2009J. Nash - CMS Upgrades22 Phase 1 : Muons ME4/2 upgrade motivation Compare 3/4 vs. 2/3 stations: (Triggering on n out of n stations is inefficient and uncertain) Recent simulation with & without the ME4/2 upgrade: The high-luminosity Level 1 trigger threshold is reduced from 48 18 GeV/c Target Rate 5 kHz Rick Wilkinson, Ingo Bloch Phase I Muon Upgrades
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Five ME+4/2 chambers installed 1 Sep 2009 ME4/2 Residual ME4/2 J. Nash - CMS Upgrades 23 LHCC Sep 2009
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CSC Factory Production Site at CERN Floor plan layout at Bldg 904 (Draft) Based on experience of ME4/2 prototype production the proposed area at 904 of ~ 1000 m2 should be enough to place a factory production and FAST test site. For the completed chambers we need additional storage area of ~ 250m 2. 55m Loadiing area 20m Incoming parts Packing 10m Chamber FAST site & HV tests Gas Panel cleaning/gluing area Strip gluing Winding Assembly & Sealing Panel storage Wire gluing Strip Gluing Clean room 2 Clean room 1 30m 15m Door Automatic & hand soldering Panel storage and kit preparation Panel cleaning Electronics Panel HV test Panel storage LHCC Sep 200924J. Nash - CMS Upgrades
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Conclusions Phase I work progressing well Understanding of the issues surrounding the beampipe is well advanced Major meeting in October to look at how we go forward LHCC Sep 2009J. Nash - CMS Upgrades25
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