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GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 1 GLAST Large Area Telescope: Electronics, Data Acquisition &

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Presentation on theme: "GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 1 GLAST Large Area Telescope: Electronics, Data Acquisition &"— Presentation transcript:

1 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 1 GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software TEM Power Supply Part 3 Gunther Haller Stanford Linear Accelerator Center Manager, Electronics, DAQ & FSW LAT Chief Electronics Engineer haller@slac.stanford.edu (650) 926-4257 Gamma-ray Large Area Space Telescope

2 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 2 Power Allocation (CDR) QuantityColdCurrent Hot Case CaseEstimateAllocation Total286.20313.79318.00359.85 Mech On-Board Power1 38.00 35.0038.00 TEM--Tower Electronics Module 43.20 46.7048.00 54.32 TEM board16 2.70 2.923.00 3.39 Power Supplies 148.50 163.29165.00 186.72 TKR,CAL,TEM16 9.28 10.21 11.67 GASU--Global Tgr ACD, Signal Dist. Unit 19.80 22.3722.00 24.90 EP, AEM, Sig Dist & Supplies1 22.37 Other Boxes 74.7081.4383.0093.92 SIU--Spacecraft Interface Unit1 21.60 23.8924.00 27.16 EPU Total 38.70 42.6043.00 48.66 EPU--Event Processor Unit2 19.35 21.3021.50 24.33 PDU--Power Distribution Unit1 14.40 14.9316.00 18.11

3 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 3 Efficiency, Measured At CDR TEM DAQ 2.5V was generated from TPS 3.3V. Now TPS generates 2.5V and 3.3V for TEM DAQ –Move power allocation from TEM to TPS, allocation of TPS is then about 12W Power dissipated in TPS depends on load current supplied, since it is a percentage (in- efficiency) Preliminary measured values on first TPS (Dave Nelson) –TypeVoltage (V)Delivered Pwr (W) –TEM 2.52.50.8 –TEM 3.33.41.67 –CAL Analog3.40.97 –CAL Digital3.43.2 –TKR 1.51.521.25 –TKR 1.51.451.25 –TKR 2.5d2.491.7 –TKR 2.5d2.51.7 –TKR 2.5a2.490.75 –TKR 2.5a2.50.75 –Total14.1 Watts –Input 27.8 Volts (including HV supplies)24. Watts –Eff. of low voltage58.6% –In allocation assumed 62% –About 14W over CDR allocation for 16 towers –Add margin (about 20W over allocation) Assumes no linear regulators for CAL and TKR voltages

4 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 4 September 03 LAT Power Status (Proposed)

5 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 5 Efficiency Comparison SolutionAmount above 165W CDR LAT TEM PS Allocation Conventional 28V/3.3V DC/DC Converter plus Linear Regulator (assume 65% efficiency at 3.3V at 40% load, no filter losses included, adds about 7W) 126W (theoretical) Synchronous Rectifying 28V/3.3V DC/DC Converter plus Linear Regulator, assume 80% eff., goal is 82%, no filter losses included, adds about 7W) 24W (theoretical) Maxim Solution (no hybrid DC/DC converter or linear regulator, includes filter losses 14W (measured)

6 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 6 SIU/EPU Stackup TEM, TEM-PSU, and SIU/EPU/EMPTY Stack 10x Typical Only show SIU/EPU stack-up as an example in this presentation, results are also available for other LAT cases Top & bottom covers are 0.08 in Al Side walls are 0.15 in 6061 Al Temperatures –TEM = 0.2 O C Rise –PSU = 0.7 O C Rise Thermal resistance for box below -> 0.11K/watt –SIU = 2.0 O C Rise Thermal resistance for box below -> 0.17K/watt –Total temp rise 0.2 + 0.7+(3.4*.11)+2+(11.7*.17) = 5.2 O C Rise SIU 27.2 W/ EPU 24.3W PSU 11.7 W TEM 3.4 W

7 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 7 Thermal TEM 3.4 watts TEM Power Supply (PS)11.7 watts GASU24.9 watts PDU18.1 watts EPU24.3 watts SIU27.2 watts Stackups –TEM, TEM PS, EPU -> 39.4 watts –TEM, TEM PS, SIU -> 42.3 watts –TEM, TEM PS, PDU -> 33.2 watts –TEM, TEM PS, GASU ->27.5 watts Assumptions Thermal boundaries for DAQ –-40C to +55C for Qualification –Uniform thermal connection to X-LAT plates –Only thermal conduction considered –No thermal conduction to calorimeter base plates. –100 O C maximum Si junction temp Thermal Resistances/Conductance's –Al 6061154 W/m-K –Polyimide 0.33 W/m-K –CV2943 adhesive 1.26*W/m-K –Wedge-Lok 0.14 O C/W, 2 each 6” –Actel FPGA 6.2 O C/W J-C –Thermal Via, 12 mil, 2*10 3 O C/W each 3.4 O C/W for an array of 64X8

8 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 8 10mw 0.170 0.032 0.062 0.010 0.062 0.014 0.006 0.043 0.034 0.060 0.034 0.060 0.055 0.006 0.005 TPS PCBA Top side Power dissipation sources

9 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 9 TEM Power Supply Board with Heat Sink

10 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 10 0.064” Al heat sinks bonded to board perimeter with thermally conductive adhesive. TO-225 pkg. DC-DC regulators bonded to AL heatsinks with thermally conductive adhesive. 0.90 0.51 0.70 1.16 0.51 0.11 0.34 0.51 1.34 0.35 0.10 0.037 0.034 0.045 0.036 0.30 SMT components with power dissipations > 20mW indicated in board field. TPS PCBA Bottom side Power dissipation sources

11 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 11 MOUNTING HOLES REGULATORS DIODES HEAT SINK HV SECTIONS

12 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 12 TEM-PS Modal Analysis Displacement of First Mode Due to Random Input at 1 Sigma Level 1 Sigma combined stresses and displacement due to QUAL level random input spectrum. Multiply stresses and displacement by 3 to get 3 Sigma level predictions: Displacement @ 3-Sigma Level:.014 inches (Agrees with predicted displacement in Summary Chart) Von Mises Stress @ 3-Sigma Level: 4654 psi

13 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 13 TEM-PSU-EPU/SIU FEM Model Analysis Approach - Plate, Brick and Beam Elements - Model Weight 28.1 lbs. (12.77 kg) - First Mode Natural Frequency = 238 Hz - Machined Aluminum 6061-T6 * Ultimate Strength 42000 psi - Modal Survey Run Applied QUAL Level Random Vibration Spectrum - Results Show Combined Effects of Random Excitation - 3s Load Levels Used to Account for Peak Excitation. - Damping =.05 (5 %) - Safety Factor of 1.4 x Ultimate Strength - 14.14 Grms Input Level - Ti 6Al-4V Standoffs - Ti 6Al-4V M6x1 Socket Head Cap Screw Mounting Bolts * Ultimate Strength 160ksi STRESS SUMMARY - Maximum Stresses are produced in the Titanium Standoffs - Stress Summary shows Standoff Stresses and Margins

14 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 14 Parts Maxim 726 DC/DC converter (ordered) –Bipolar integrated circuit Latch-up radiation tested by LAT at Legnaro, passed Latch-up radiation tested by GSFC at TAMU, passed Preliminary TID testing (UCSC) up to 300Krad-> no effect –Ordered single lot, to be received Oct 15 –Qualification/screening will take place at GSFC –Need to radiation test flight lot Latch-up in November at TAMU TID in Italy when lot is available

15 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 15 Parts (con’t) MIL461 filter is approved space-qual part (ordered) Caps/inductors/resistors are space-qual parts (not ordered) Poly-Fuse is on the LAT list of components (not ordered) Bipolar NPN (JANS2N2222AUB) as on other LAT boards International Rectifier MOS-FET as on PDU board (ordered) INTERSIL CD4000 series (5962R numbers) waiting for PCB approval, requisition written (no issue) MICROSIM JANS diodes, checking for radiation data

16 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 16 Worst Case Analysis In progress (have not selected final cap and inductor values, need more testing) –Temperatures of all components well below maximum allowable temperatures Max typically 125C, LAT qual box level +55C plus about 20C to junction Max Operating/LAT nominal –International Rectifier ARF461 Current: 3A/1A Voltage: 50V/29V –MAX726 Current: 2A/1A Voltage: 40V/29V –IR FET IRHNJ597034 Current: 22A/1A Voltage: 60V/29V

17 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 17 Reliability Mainly driven by capacitors and diode MAX726 itself is 2x10^-9 failures/hour at 25C, see Maxim reliability report on web MIL-217 including above Maxim numbers result in following reliability for each tower supply at 40C (nominal it will run at about 30C) –TKR6.7x10^-8 failures/hr –CAL5.6x10^-8 failures/hr –TEM5.2x10^-8 failures/hr All at least a factor 2 better than required per System Engineering FEMA presented at CDR

18 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 18 Testplan In process of getting first integrated TPS to function –Efficiency seems ok (pending need for linear regulators) –Noise test in progress (analyzer measurement) Validation with real load electronics –Connected TPS to TEM DAQ (done, is ok) –Then to full calorimeter to check noise performance (this week) –Same for TKR mini-tower –Run CAL/TKR mini-tower with TPS System test with 16 TPS’s on test-bed (next slide) –Interaction of TPS’s and PDU Preliminary Test Procedure LAT-DS-01652 EMI/EMC test to be added

19 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 19 Verification & Test: Testbed TEM DAQ Modules TEM Power Supplies TKR and CAL Electronics Simulators 12 ACD Electronics Cards Full DAQ set with EM2 hardware (each with identical interfaces and functionality as flight) All DAQ modules including 16 TEM’s TKR and CAL front-end electronics for 1 tower, front-end simulator boards for other 15 towers Connect PDU with 16 Tower Power Supplies and TEM DAQ boards February 04 Spectrum Astro SIIS

20 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 20 Fabrication Plan Printer-Circuit Boards –Design: SLAC –Fabrication: qualified vendor –Parts procurements: SLAC –Assembly: qualified vendor Enclosures –Design: SLAC –Fabrication: qualified vendor Module Assembly (PCB’s/cables/enclosure) –Design: SLAC –Assembly: qualified vendor Installation at SLAC

21 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 21 Schedule/Milestones First integrated TPS9/15/03 (done) Connect TPS to Front-end Systems 10/10/03 Modify layout/fab11/1/03 Have multiple copies of TPS for EGSE11/15/03 Qual model of TPS 2/04/04 First Flight Model5/1/04

22 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 22 Budget Discuss at review

23 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 23 Spacecraft Interface and DC Isolation SC-LAT ICD specifies operating range 28V +/- 1V (is ok) LAT power system is not DC isolated from LAT power-feed from spacecraft SC has SC-unregulated-bus to 28V DC/DC converter for LAT regulated power, secondary is tight to LAT structure (LAT ground) SC-LAT ICD specifies max voltage of 42V (left over from unregulated bus solution) –Needs to be lowered for Maxims Max input voltage to avoid damage is 45V (not a driver) Max input voltage for normal operation is 40V Need lower than 34V to get normal operation for 1.5V supplies Short turn-on spike is ok 34V should be ok since DC/DC converter used by SC is well specified

24 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 24 Issues Schedule is tight (need flight models by April 04) Some requirements need modification –TKR and CAL voltages are adjustable from 30V to 150V/100V as opposed to from 0V ICD to spacecraft still specifies max supply of 42V for testing, needs to be changed to lower voltage

25 GLAST LAT ProjectTower Power Supply Review Sept 22, 2003 Gunther HallerPart 3, Version 4 25 To do Testing, testing Supply needs to be connected to full CAL tower and TKR (4 tray version exists) to validate noise performance Adding output voltage limit protection for LV –Zener diodes available not high enough power –Forward biased diode chain seem ok EMI tests Some additioanl thermal analysis –However 1 st order no problem No “high” powered devices on board Good heat-sinking board-heat-sink-enclosure Layout need slight modification –Some crosstalk between HV supplies and TKR 1.5V output from layout (300 KHz contamination) Cancel (or not) Z-series 28V-3.3V vendor converters

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