1. BEE3 Updates June 13 th, 2007 Chuck Thacker, John Davis Microsoft Research Chen Chang UC Berkeley

2. BEE3 Overview 4 Xilinx FPGA: (FF1136) ◦ Virtex-5 LX110T or SX95T 16 DIMMs ◦ 2 DDR2-400/533/667 channels per FPGA ◦ Up to two 4GB DIMMs per channel 8 10GBase-CX4 interfaces 4 PCI-E x8 slots (endpoints) 4 QSH-DP (40 LVDS pairs) daughter card & cable connectors 4 GE RJ45 interfaces 2U chassis ATX12V/EPS2U 500W power supply

3. June 2007 RAMP Tutorial BEE3 Package ATX PWR FPGA PCIe Cards I/O modules

4. BEE3 Package Front View Data I/Os: ◦ 4 PCIe slots ◦ 8 CX4 connectors ◦ 4 RJ45 ◦ 4 FPGA done LEDs ◦ 4 FPGA user LEDs June 2007 RAMP Tutorial Control I/O Panel: ◦ 4 RS232(RJ45) ◦ 4 SD card slots ◦ 1 CF card (SystemACE) ◦ 1 Xilinx USB-JTAG ◦ 2 SMA clock input ◦ 1 Power reset ◦ 1 FPGA soft reset

5. FPGA I/O Interfaces

6. COTS PCI-Express over Cable Solution from One Stop Systems HIB2 x8 Host HIB2 x8 Target PCIe x8 cable Up to 7 meters

7. Peak I/O Bandwidths (per-FPGA) (estimates for XC5VLX110T-1 part) DDR2 Memory ◦ 400 MT/s * 8B/T * 2 channels: 6.4 GB/s Ring ◦ 400 MT/s * 8 B/T * 2 channels: 6.4 GB/s QSH ◦ 400 MT/s * 4 B/T: 1.6 GB/s Ethernet ◦ 125 MB/s CX4 ◦ 1.25 GB/s * full duplex * 2 channels: 5GB/s PCI Express x8 ◦ 2GB/s * full duplex: 4GB/s June 2007 RAMP Tutorial

8. Schedule Generate Specification – Done Schematic Entry – Done Board Layout – Started Thermal modeling, heat sink design – Started Chassis design -- Started Signal Integrity – Imminent Prototypes: Late Summer – Bring-up starts Production: Start early 2008