1. Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems Design Group University of Southampton, UK Nicola Nicolici Electrical and Computer Engineering McMaster University, Canada

2. Overview Low-cost system-on-a-chip test Single vs. multiple scan chains compression Proposed add-on architecture –TAM add-on architecture Core wrapper design Reduce control and area overhead –Design flow integration Experimental results Conclusion

3. Low-cost SOC test Problems –High volume of test data –Increased chip/ATE frequency ratio –Increased chip/ATE pin number ratio –Increased scan-power dissipation High ATE costs and yield loss

4. Low-cost SOC test Solutions –Test data reduction –Reuse existing ATE technology –Exploit chip/ATE frequency ratio –Reduce pin count testing (RPCT) –Scan chain partitioning

5. TAM add-on architecture Core SOC Low-cost solution for core based SOC test TAM add-on

6. Overview Low-cost system-on-a-chip test  Single vs. multiple scan chains compression Proposed add-on architecture –TAM add-on architecture Core wrapper design Reduce control and area overhead –Design flow integration Experimental results Conclusion

7. Single scan chain TDC s i s o Core sync ATE Head decoder 5 FF SISR counter SOC

8. Single scan chain TDC (cont) Exploit test set regularities (e.g., runs of 0s) Based on coding schemes Exploit frequency ratio Synchronization overhead – temporal deserialization [Gonciari, ETW02] –External clock synchronization –FIFO like structures High scan power due to the long scan chain

9. Multiple scan chain TDC SISR scan chain Core WSC XOR Network Core scan chain data in ctrl

10. Multiple scan chain TDC (cont) Exploit care bits sparseness Uses XOR based spreading networks Temporal pattern lockout –Extra control line –Doubles the volume of test data –Influences test application time Structural Pattern lockout –can influence fault coverage High scan power due to driving of all scan chains Extend single scan chain TDC to multiple scan chains

11. Extend single scan chain TDC … Use one decoder and shift register [Chandra, DATE02] decoder shift register scan chain Core

12. Use one decoder and shift register Loosened the ATE timing constraint –Exploitation of frequency ratio Reduce peek scan-power –Shift register buffering Synchronization overhead Decrease in compression ratio –Unbalanced scan chains –Test set rotation

13. Extend single scan chain TDC … (cont) Use one decoder per scan chain [Chandra, TCAD01] [Gonciari, ETW02] ctrl distr dec1 dec2 dec3 scan chain Core

14. Use one decoder per scan chain Loosened the ATE timing constraint –Exploitation of frequency ratio Reduced scan-power –Scan chain partitioning Good compression ratio –No test set rotation Reduced synchronization overhead Increased area and control overhead Large number of scan chains Unbalanced scan chains

15. Low-cost SOC test Solutions –Test data reduction –Reuse existing ATE technology –Exploit chip/ATE frequency ratio –Reduce pin count testing (RPCT) –Scan chain partitioning Use one decoder per scan chain Increased area and control overhead Large number of scan chains Unbalanced scan chains

16. Overview Low-cost system-on-a-chip test Single vs. multiple scan chains compression  Proposed add-on architecture –TAM add-on architecture Core wrapper design Reduce control and area overhead –Design flow integration Experimental results Conclusion

17. TAM add-on architecture Core SOC Low-cost solution for core based SOC test TAM add-on

18. Core wrapper design WSC2 WSC3 WSC1 WSC4 Core tb2 tb3 tb4 tb1 Why core wrapper design ? WSC partitioning [Gonciari, VTS02] –Useless memory reduction –Easy control

19. Reducing control and area overhead ctrl distr dec1 dec2 dec3 WSC Core dec4 WSC Instead of

20. Reducing control and area overhead … WSC Core WSC partitioning –2 partitions –1 control unit per partition –1 decoder per partition Exploit WSC partitioning for area and control reduction

21. Reducing control and area overhead … WSC Control –Length of max scan chain –No of scan chains –Diff of partitions length Easy control per partition diff length no WSCs

22. WSC dec1 Extended decoder (xDec) – input dec scan clk data lengthno WSCs diff

23. Extended decoder (xDec) – output WSC dec no WSCs mux SISR

24. Extended distribution architecture distr xDec1 mux SISR Core WSC xDec2 mux SISR mux xDistr

25. Extended distribution architecture … Core WSC Core WSC Unequal partition size for some cores !!

26. Extended distribution architecture xDec1 mux xDec2 mux add-on-xDistr mux Core WSC Core

27. Multiple TAM SOC test Core 2xSISR add-on Core SOC

28. Design flow integration

29. Overview Low-cost system-on-a-chip test –Test data reduction –Synchronization overhead Single vs. multiple scan chains compression Proposed add-on architecture –TAM add-on architecture Core wrapper design Reduce control and area overhead –Design flow integration  Experimental results Conclusion

30. Minimum VTD vs. equal partitions Test bus = 16 Frequency ratio 2

31. Minimum VTD vs. equal partitions Test bus = 16 Frequency ratio 4

32. add-on-xDistr vs. SSC Core s35932Frequency ratio 2

33. add-on-xDistr vs. SSC Core s35932Frequency ratio 4

34. add-on-xDistr vs. SSC System 1Frequency ratio 2 Test bus 24Reduction 19.29%

35. add-on-xDistr vs. SSC System 2Frequency ratio 2 Test bus 24Reduction 26.88%

36. Conclusion Low-cost solution for core based SOC test TAM add-on architecture Design flow integration Exploited core wrapper design features –Reduced control overhead –Reduced area overhead Reduced scan power through partitioning Small area overhead (3-4%) for System1,2

37. Test data reduction dec DIB SO SOC ATE CUT Head Aims –Volume of test data –Area overhead –Test application time

38. Generic on-chip decoder CI PG ATE scan clk data in ate clk Data out sync Serial decoder –PG and CI can not work independently –Implicit communication between PG and CI Parallel decoder –PG and CI can work independently –Explicit communication between PG and CI

39. Synchronization overhead Extensions to the DIB –Multiple ATE channels –Deserialization units –Latency FIFOs –Clock synchronization

40. Synchronization overhead (cont) dec DIB SOC ATE CUT SO New ATEs Source synchronous buses Require programming

41. Synchronization overhead (cont) dec DIB SOC ATE CUT SO

42. Synchronization overhead (cont) Low-cost test through ATE reuse –Small area overhead increase –Solution for entire chip test –Test application time reduction dec DIB SOC ATE CUT SO

43. Synchronization overhead Old ATEs –Latency FIFO –Clock synchronization 02345671  PG CI STOPCI ATE clk Chip clk PG

44. On-chip SO solution 02345671  PG CI STOPCI ATE clk Chip clk PG

45. On-chip SO solution (cont) Increased VTD and TAT Exploit DUMMY bits and reduce VTD and TAT 02345671  PG CI DUMMYCI ATE clk Chip clk PG

46. On-chip SO solution (cont) Distribution unit –Any number of cores –Self synchronous architecture PG2 02345671  PG1 CI1 CI2CI1 ATE clk Chip clk PG1 distr dec1 dec2

47. XOR-network %tpl

48. S38417: VTD / TAT for w = 32

49. S35932: VTD / TAT for w = 32