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“Ship the Chip” “Ship the Chip” Packaging Design Production Drawing Fairport High School.

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Presentation on theme: "“Ship the Chip” “Ship the Chip” Packaging Design Production Drawing Fairport High School."— Presentation transcript:

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2 “Ship the Chip” “Ship the Chip” Packaging Design Production Drawing Fairport High School

3 Developments & Intersections

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5 Engineering Package Design Meet the needs Shape & Size Safe shipping

6 Developments & Intersections Industrial Designers –shape and form of products –packaging –displays of consumer items commercial systems.

7 Manufacturing Engineers processes for making things from the beginning to the end make products better and at less cost manufacturing means making things manufacturing engineers find out how

8 Manufacturing Engineers work with all aspects of manufacturing: production control materials handling automation The assembly line is the domain of the manufacturing engineer.

9 Machine vision and robotics are some of the more advanced technologies in the manufacturing engineers toolkit.

10 Creating Prototypes The beginning of the manufacturing process: –creating prototypes or models In the past, these prototypes were created from wood or clay (kind of like sculpting).

11 Today rapid prototyping is the state of the art. There are a number of types of rapid prototyping systems currently available, but one of the coolest is called stereolithography.rapid prototypingstereolithography A computer-controlled laser shoots through a pool of liquid plastic and forms a solid plastic part which is literally pulled out of the liquid.

12 Rapid Prototyping (stereolithography) is a process which produces a physical, three dimensional object, a conceptual model or master pattern. A rapid prototyping machine uses a computer controlled laser to cure a photo-sensitive resin, layer by layer, to create the 3D part. Producing a pre-production SLA of a part can greatly enhance the geometric visualization of a product, as well as communication between project team members. For photo-optic stress analysis as well as dynamic vibrational analysis, which further extends engineering design capabilities, a rapid prototyping model can be used.

13 The Process Students will: –Develop a plan –Select materials –Manufacture their package –Test the prototype –Evaluate results –Re-design –Final package Developments & Intersections

14 Activity Students will learn how engineers develop packaging design requirements Work in a team to evaluate the external stresses that engineers must consider when developing a package or product design. Developments & Intersections


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