1. 1 국제 Working Group 활동 보고 (Detector) Brief Report on LCWS05 at SLAC ILC Detector concept Variety of Trackers, Calorimeters, Muons Beam tests and Organization Reported by Il H. Park (Ewha) Based on summary talks of LCWS05 Korean ILC meeting, 건국대학교, 2005 년 4 월 1 일

2. 2 Brief Report from LCWS05 Please refer to our presentations at LCWS05 and summary talks on detector concepts, tracker, and calorimeter/muon (see the program who presented what) Three detector groups are organized: SiD, LDC, GLD Korean Involved Area and technology: Silicon tracker, Silicon Calorimeter, Scintillator Calorimeter Korean activity(R&D on a tracker and calormeters, beam tests of Silicon calorimeter prototype) is now exposed largely to the ILC community, particularly Korean silicon experience draws a serious attention at LCWS05 At this workshop, we agree on joint activity of Korean Silicon Calorimeter with CALICE group and possibly with SiD in parallel as well. Foresee a substantial progress from such collaborative works this year

3. 3 Physics Inclusive Higgs: Z Recoil mass H Branching Ratios Smuon pair-production

4. 4 Performance goal (common to all det. concepts) –Vertex Detector: –Tracking: –Jet energy res.:  Detector optimized for Particle Flow Algorithm (PFA) Basic design concept

5. 5 Tracker Momentum resolution set by recoil mass analysis of reconstruction and long-lived new particles (GMSB SUSY) Multiple scattering effects Forward tracking Measurement of Ecm, differential luminosity and polarization using physics events Recoil Mass (GeV)

6. 6 Calorimeter Separate hadronically decaying W’s from Z’s in reactions where kinematic fits won’t work: Help solve combinatoric problem in reactions with 4 or more jets  E /E = 0.6/E  E /E = 0.3/E

7. 7 SiDLDCGLD Three Detector Concepts

8. 8 Comparison of parameters SiDLDCGLD Solenoid B(T)543 R(m)2.483.03.75 L(m)5.89.2 9.86 E st (GJ)1.42.3 1.8 Main Tracker R min (m)0.20.36 0.4 R max (m)1.251.62 2.0  m  7150 N sample 5200220  1/pt) 3.6e-51.5e-41.2 e-4

9. 9 GDE (Design) (Construction) Technology Choice Acc. 2004200520062007200820092010 CDR TDRStart Global Lab. Det. Detector Outline Documents CDRsLOIs R&D Phase Collaboration Forming Construction Detector R&D Panel Tevatron SLAC B LHC HERA T2K Done! Detector “Window for Detector R&D

10. 10 Review Tracking and Vertexing Jan Timmermans - NIKHEF 32 presentations in total: 12 vertex detector related 10 on SI tracking 10 on TPC R&D

11. 11 Vertex Detector pixels ~ 20 x 20 μm 2 point resolution ~3 μm material <0.1% X 0 1st layer at ~1.5 cm To keep occupancy below 1%: readout ~20 times during bunch train or store signals OR make pixels smaller ( FPCCD 5 x 5 μm 2 ) Many variants: CPCCD, FPCCD, DEPFET, MAPS, FAPS, SoI, ISIS New at LCWS05: (revolver)ISIS Add time stamping (Baltay, Bashindzhagyan)

12. 12 Vertex Detector Options FPCCD –Accumulate hit signals for one train and read out between trains –Keep low pixel occupancy by increasing number of pixels by x20 with respect to “ standard ” pixel detector –As a result, pixel size should be as small as ~5x5  m 2 –Epitaxial layer has to be fully depleted to minimize charge spread by diffusion –Operation at low temperature to keep dark current negligible (r.o. cycle=200ms) Y.Sugimoto - KEK Tracking efficiency under beam background is critical issue; simulation needed.

13. 13 small pixels 20-30µm radiation tolerance (>200krad) low noise thin devices (50µm)  S/N = 40 low power (row-wise operation) fast readout (cold machine), 50MHz line rate zero suppressed data charge collection in fully depleted substrate drain bulk source top gateclear p+ n+ back contact p n+ n internal gate n - n+ p+ - - + + + + - MIP 50 µm - - -- -- DEPFET (M. Trimpl) – Bonn, Mannheim, MPI FET transistor in every pixel (first amplification) Electrons collected at internal gate modulate the transistor current. Signal charge removed via CLEAR No charge transfer Low power consumption: ~5W for full VXD

14. 14 Flexible APS FAPS=Flexible APS –Every pixel has 10 deep pipeline Designed for TESLA proposal. –Quick sampling during bunch train and readout in long period between bunch trains FAPS Column Output Write amplifier RST_W SEL A 1 Memory Cell #0 Memory Cell #1 Memory Cell #9 I bias J. Velthuis – UK MAPS S/N between 14.7 and 17.0

15. 15 Monolithic CMOS Pixel Detectors Big Pixels 50µ x 50µ Small Pixels 5µ x 5µ Two active particle sensitive layers: Big Pixels – High Speed Array – Hit trigger, time of hit Small Pixels – High Resolution Array – Precise x,y position, intensity C. Baltay After selecting hits in same bunch: occupancy ~10 -6

16. 16

17. 17 Principle of SOI monolithic detector Integration of the pixel detector and readout electronics in a wafer- bonded SOI substrate Detector  handle wafer High resistive (> 4 k  cm,FZ) 400  m thick Conventional p + -n Electronics  active layer Low resistive (9-13  cm, CZ) 1.5  m thick Standard CMOS technology Connection between pixel and readout channel A. Bulgheroni - Como

18. 18 Si Tracking T.Nelson

19. 19 Silicon Tracking System with a central gaseous detector The Silicon Envelope concept = ensemble of Si-trackers surrounding the TPC ( LC-DET-2003-013) The Si-FCH: The Si-FCH: TPC to calorimetry TPC to calorimetry(SVX,FTD,(TPC),SiFCH) The FTD: The FTD: Microvertex to SiFCH Microvertex to SiFCH The SIT: The SIT: Microvertex to TPC Microvertex to TPC The SET: The SET: TPC to calorimetry TPC to calorimetry (SVX, SIT, (TPC), SET) TPC Microvertex A. Savoy-Navarro

20. 20 Development of Double-sided Silicon Strip Detector H. Park (BAERI, KNU) On behalf of Korean Silicon Group Introduction Electrical Test Source Test Radiation Damage Test Summary and Future Plan Fabrication “in house” 5” wafers

21. 21 Digital Active Pixel Array Position memory Time memory Position memory Time memory Position memory Time memory Position memory Time memory Position memory Time memory Position memory Time memory DAP Strip 1DAP Strip 2 G.Bashindzhagyan N.Sinev LCWS 2005 G.Bashindzhagyan 25x25 μm 2 pixels

22. 22 TPC R&D Gas amplification: GEM, Micromegas; compare with wires Different gases: Ar-CH4(5%)-CO2(2%) ‘TDR’ Ar-CH4(5%,10%) P5, P10 Ar-iC4H10(5%) Isobutane Ar-CF4(2-10%) CF4 He-iC4H10(20%) Helium Laser studies Field cage optimisation Mapping a large parameter space

23. 23 Aachen MPI/Asia Victoria DESY Cornell/ Purdue

24. 24 Calorimetry and Muons Summary Talk Andy White University of Texas at Arlington LCWS05, SLAC March 22, 2005

25. 25 Physics examples driving calorimeter design -All of these critical physics studies demand:  Efficient jet separation and reconstruction  Excellent jet energy resolution  Excellent jet-jet mass resolution + jet flavor tagging Plus… We need very good forward calorimetry for e.g. SUSY selectron studies, and… ability to find/reconstruct photons from secondary vertices e.g. from long-lived NLSP ->  G

26. 26 Large Detector GLD Detectors with large inner calorimeter radius

27. 27 SiD Compact detector

28. 28 Area of EM CAL (Barrel + Endcap) –SD: ~40 m 2 / layer –TESLA: ~80 m 2 / layer –LD: ~ 100 m 2 / layer –(JLC: ~130 m 2 / layer) How big ?? Very large number of channels for ~0.5x0.5cm 2 cell size!

29. 29 Can we use a “traditional” approach to calorimetry? (using only energy measurements based on the calorimeter systems) 60%/  E 30%/  E H. Videau Target region for jet energy resolution

30. 30 Results from “traditional” calorimeter systems - Equalized EM and HAD responses (“compensation”) - Optimized sampling fractions EXAMPLES: ZEUS - Uranium/Scintillator Single hadrons 35%/  E  1% Electrons 17%/  E  1% Jets 50%/  E D0 – Uranium/Liquid Argon Single hadrons 50%/  E  4% Jets 80%/  E Clearly a significant improvement is needed for LC.

31. 31 Don’t underestimate the complexity!

32. 32 Integrated Detector Design Tracking system EM Cal HAD Cal Muon system/ tail catcher VXD tag b,c jets

33. 33 Integrated Detector Design So now we must consider the detector as a whole. The tracker not only provides excellent momentum resolution (certainly good enough for replacing cluster energies in the calorimeter with track momenta), but also must: - efficiently find all the charged tracks: Any missed charged tracks will result in the corresponding energy clusters in the calorimeter being measured with lower energy resolution and a potentially larger confusion term.

34. 34 Integrated Detector Design - provide excellent two track resolution for correct track/energy cluster association -> tracker outer radius/magnetic field size – implications for e.m. shower separation/Moliere radius in ECal. - Different technologies for the ECal and HCal ?? - do we lose by not having the same technology? - compensation – is the need for this completely overcome by using the energy flow approach?

35. 35 Calorimeter System Design  Identify and measure each jet energy component as well as possible Following charged particles through calorimeter demands high granularity… Two options explored in detail: (1) Analog ECal + Analog HCal - for HCal: cost of system for required granularity? (2) Analog ECal + Digital HCal - high granularity suggests a digital HCal solution - resolution (for residual neutral energy) of a purely digital calorimeter??

36. 36 Calorimeter Technologies Electromagnetic Calorimeter Physics requirements emphasize segmentation/granularity (transverse AND longitudinal) over intrinsic energy resolution. Localization of e.m. showers and e.m./hadron separation -> dense (small X 0 ) ECal with fine segmentation. Moliere radius -> O(1 cm.) Transverse segmentation  Moliere radius Charged/e.m. separation -> fine transverse segmentation (first layers of ECal). Tracking charged particles through ECal -> fine longitudinal segmentation and high MIP efficiency. Excellent photon direction determination (e.g. GMSB) Keep the cost (Si) under control!

37. 37 CALICE – Si/W Electromagnetic Calorimeter Wafers: Russia/MSU and Prague PCB: LAL design, production – Korea/KNU Evolution of FE chip: FLC_PHY3 -> FLC_PHY4 -> FLC_TECH1 New design for ECal active gap -> 40% reduction to 1.75m, R m = 1.4cm

38. 38 ECal work in Asia Rt= a layer / tungsten = 15.0/3.5 = 4.8 (CALICE ~ 2) Eff. Rm = 9mm * (1 + Rt) = 52mm Total 20 layers = 20 X0, 30cm thick 19 layers of shower sampling Si/W ECal prototype from Korea Results from CERN beam tests 2004: 29%/  E (vs. 18%/  E for GEANT4) S/N = 5.2 Fit curve of 29%/√E

39. 39 ECal work in Asia (Japan-Korea-Russia) Fine granularity Pb-Scintillator with strips/small tiles and SiPM New GLD ECal design Previous Pb/Scint module with MAPMT readout Study covering Laser hitting area (9 pixels) ECal test at DESY in 2006? YAG - 2  m precision

40. 40 Scintillator/W – U. Colorado Half-cell tile offset geometry Electronics development is being pursued with industry

41. 41 Hybrid Ecal – Scintillator/W with Si layers – LC-CAL (INFN) The LCcal prototype has been built and fully tested. Energy and position resolution as expected:  E /E ~11.-11.5% /  E,  pos ~2 mm (@ 30 GeV) Light uniformity acceptable. e/  rejection very good ( <10 -3 ) 45 layers 25 × 25 × 0.3 cm 3 Pb 25 × 25 × 0.3 cm 3 Scint.: 25 cells 5 × 5 cm 2 3 planes: 252.9 ×.9 cm 2 Si Pads at: 2, 6, 12 X 0 11.1%  E Low energy data (BTF) confirmed at high energy !!! e -  =2.16 mm  =2.45 mm  =3.27 mm Si L1 Si L2 Si L3

42. 42 Hadron Calorimeter – CALICE/analog Minical – results from electron test beam Full 1m 3 prototype stack – with SiPM readout. Goal is for Fermilab test beam exposure in Spring 2006 APD chips from Silicon Sensor used AD 1100-8, Ø 1.1 mm, U bias ~ 160 V SiPM APD

43. 43 Hadron Calorimeter – CALICE/digital (1) Gas Electron Multiplier (GEM) – based DHCAL 500 channel/5- layer test mid -’05 30x30cm 2 foils Recent results: efficiency measurements confirm simulation results, 95% for 40mV threshold. Multiplicity 1.27 for 95% efficiency. Next: 1m x 30cm foil production in preparation for 1m 3 stack assembly. Joint development of ASIC with RPC

44. 44 Muon Detector Technologies Scintillator-based muon system development Extruded scintillator strips with wavelength shifting fibers. Readout: Multi-anode PMTs GOAL: 2.5m x 1.25m planes for Fermilab test beam U.S. Collaboration

45. 45 Muon Detector Technologies European – CaPiRe Collaboration TB @ Frascati

46. 46 Tail Catcher / Muon Tracker – CALICE/NIU Goal: Test Beam Fermilab/2005 SiPM location Extrusion Cassette

47. 47 Timescales for LC Calorimeter and Muon development W e have maybe 3-5 years to build, test*, and understand, calorimeter and muon technologies for the Linear Collider. By “understand” I mean that the cycle of testing, data analysis, re-testing etc. should have converged to the point at which we can reliably design calorimeter and muon systems from a secure knowledge base. For the calorimeter, this means having trusted Monte Carlo simulations of technologies at unprecedented small distance scales (~1cm), well-understood energy cut-offs, and demonstrated, efficient, complete energy flow algorithms. Since the first modules are only now being built, 3-5 years is not an over-estimate to accomplish these tasks! * See talk by Jae Yu for Test Beam details

48. 48 CalorimeterTechnologyGroups Electromagnetic Silicon-TungstenBNL, Oregon, SLAC Silicon-TungstenUK, Czech, France, Korea, Russia Silicon-TungstenKorea Scintillator/Silicon-LeadItaly Scintillator/Silicon-TungstenKansas, Kansas State Scintillator-LeadJapan, Russia Scintillator-TungstenJapan, Korea, Russia Scintillator-TungstenColorado CalorimeterTechnologyGroups Hadronic (analog) Scintillator-SteelCzech, Germany, Russia, NIU Scintillator-LeadJapan Hadronic (digital) GEM-SteelFNAL, UTA RPC-SteelRussia RPC-SteelANL, Boston, Chicago, FNAL Scintillator – Steel Northern Illinois/ NICADD Scintillator – Lead/Steel Japan, Korea, Russia Tail catcher Scintillator-SteelFNAL, Northern Illinois RPC-SteelItaly From K.Kawagoe @ ACFA 07

49. 49 ILC Test Beam *On behalf of the HEP group at UTA. Introduction What has been happening? Beam Test Timeline World-wide TB Organization Conclusions LCWS2005 at Stanford March 18 – 22, 2005 Jae Yu University of Texas at Arlington

50. 50 What has been happening? Tremendous activities –Calorimeter related CALICE ECAL electronics run at DESY together with Asian drift chambers Korean SiW ECAL at CERN –Tracker TB ’ s –MDI and beam instrumentation related activities –Etc.. A lot of groups are preparing for TB in the next couple of years

51. 51 Structure 1.4 (1.4mm of W plates) Structure 2.8 (2×1.4mm of W plates) Structure 4.6 (3×1.4mm of W plates) ACTIVE ZONE (18×18 cm 2 ) Multi-layer (30) W-Si Prototype : 3 independent C-W alveolar structures according to the thickness of tungsten plates (1.4, 2.8 and 4.2 mm) 30 detector slabs which are slid into central and bottom cells of each structure Active zone : 3  3 wafers  30 layers 270 Wafers Si with 6×6 pads (10×10 mm 2 ) Design and Prod : LLR Integration : LLR Prod : 150 MSU (Russia) 150 IOP (Czech republic)  3 structures W-CFi ( 1,2,3 x1.4mm)  30 « detteur slabs »  Dimension 200x360x360 mm  9720 channels in the proto. CALICE ECAL Test Beam at DESY G. Geycken

52. 52 50 GeV Electron 50 GeV pion 150 GeV Muon Total ADC of an event / 640 Beam Direction Layers of Si sensors and Tungstens Frontend readout boards Digital and Control Boards Korean SiW ECAL TB at CERN PEDs

53. 53 Rt= a layer / tungsten = 15.0/3.5 = 4.8 (CALICE ~ 2) Eff. Rm = 9mm * (1 + Rt) = 52mm Total 20 layers = 20 X0, 30cm thick 19 layers of shower sampling CERN Beam Test of Si/W ECal prototype from Korea Results from CERN beam tests 2004: 29%/  E (vs. 18%/  E for GEANT4) S/N = 5.2 Fit curve of 29%/√E

54. 54 Hybrid Ecal – Scintillator/W with Si layers – LC-CAL (INFN) The LCcal prototype has been built and fully tested. Energy and position resolution as expected:  E /E ~11.-11.5% /  E,  pos ~2 mm (@ 30 GeV) Light uniformity acceptable. e/  rejection very good ( <10 -3 ) 45 layers 25 × 25 × 0.3 cm 3 Pb 25 × 25 × 0.3 cm 3 Scint.: 25 cells 5 × 5 cm 2 3 planes: 252.9 ×.9 cm 2 Si Pads at: 2, 6, 12 X 0 11.1%  E Low energy data (BTF) confirmed at high energy !!! e -  =2.16 mm  =2.45 mm  =3.27 mm Si L1 Si L2 Si L3

55. 55 Hadron Calorimeter – CALICE/analog Minical – results from electron test beam Full 1m 3 prototype stack – with SiPM readout. Goal is for Fermilab test beam exposure in Spring 2006 APD chips from Silicon Sensor used AD 1100-8, Ø 1.1 mm, U bias ~ 160 V SiPM APD

56. 56