1. Feature-level Compensation & Control F LCC Overview April 5, 2006 A UC Discovery Project

2. FLCC 04/05/2006 FLCC - Overview 2 The Industry Team 17 Supporters 2 Contributors 2 Former

3. FLCC 04/05/2006 FLCC - Overview 3 Meeting Objectives and Agenda Objectives –Get re-acquainted Real Technologist & Real Student interactions => collaboration –Results to date on Year 3 Faculty overview presentations and student poster discussions Feedback on Year 3 and guidance on Year 4 and beyond Agenda –Faculty Overview Presentations (1:10-2:10; 2:25-3:05) –Questions and Answers (3:05-3:15) –Student Poster Discussion (3:30-4:45) –Steering Committee Meeting (4:45-5:45) –Feedback (5:45-6:15)

4. FLCC 04/05/2006 FLCC - Overview 4 Feature Level Compensation and Control: Industry/University collaboration through the U.C. Discovery Program Test Structures Sensors Physical Models Statistical Models Processes Metrology System FLCC Starting Year 3 Scoping Year 4 Four year research vision for compensating and controlling variability at the feature level Lithography CMP Plasma Tech Device/Diff/Int Sensors & Ctrl Novel Vehicles Collaborative Experiments Novel Apparatus

5. FLCC 04/05/2006 FLCC - Overview 5 Thanks to Our Participating Companies and the U.C. Discovery Program Very fortunate to have continuity in industry support from 17 companies with UC Discovery matching for 17 students at a time of cut-backs in university research. Support for Our University Research is only sustainable long term if it adds value to the Bottom Line of each of our Participating Companies. Mutual value starts with dialog between Working Technologists and Our Future Technologists. Looking for Guidance on High-Risk Opportunities where University Talent can do Pioneering Research.

6. FLCC 04/05/2006 FLCC - Overview 6 FLCC Assets for High-Risk Research Academic Knowledge and Skills on Broad Fronts –Physical Mechanisms, Process, Device, CAD, Circuits Flexible Apparatus, Platforms and Software –Scientific Apparatus and Instrumented Process Apparatus –Source Code for Rapid Prototyping Working Structure of FLCC –Novel Test Vehicle: ‘Zero Foot-Print Metrology’ –Multi-Student Test Masks Collaboration with FLCC Companies –Phase-Shifting Test Masks –Vanilla CMOS Wafer Fabrication

7. FLCC 04/05/2006 FLCC - Overview 7 Scientific Apparatus: Leverage Univ. Legacy with minor investment (4%) Sample and sample carrier Slurry film Polishing pad Rotating platen Slurry delivery pressure Potentiostat sample 2 Ref. electrode sample 1 Polisher Atomic Layer Deposition Source (Verify Molecular Dynamics Simulation of Clusters in FC) Annealing Furnace (diffusion Studies) LEO SEM and Hitachi CD-SEM (PC and PCI bus upgrades) CMP Wet-Bench

8. FLCC 04/05/2006 FLCC - Overview 8 Process Apparatus: Industry Contribution AMAT Centura (Y1, Y3), laser for 248 nm AMSL (Y2) AMAT Centura Oxide Si Trench Al Zero Foot-Print End Point Sensors (NC) Etch Modeling Plasma (JC, DG) Test Structures Lith (AN) Emission Species Probe ii Future Metals Device (TK) Compatible Gates for high-K MEMS Corrosion CMP(FD) Passivation alternatives

9. FLCC 04/05/2006 FLCC - Overview 9 Aerial Image Sensor Novel Vehicle: Zero Foot-Print Metrology ii Interdisciplinary Development Heterogeneous Assembly Metrology and Control Interface Modeling Monitoring Applications Plasma Etch: End- Point Detection CMP: End-Point Detection Lithography: Image Monitor Metrology wafer Detection Window CMP Plasma Etching

10. FLCC 04/05/2006 FLCC - Overview 10 Multi-Student Process-EDA Test Mask 4 Phase Alt-PSM: High-NA, Pol Fall 04; Fab: Photronics Tested: AMD, Nikon, => UCB Att-PSM: Short Loop NMOS Mar 05; Fab: DuPont Fab: Cypress 4 Phase Pin-Hole Alt-PSM: High-NA, Pol; Spring 05; Fab: Benchmark & DuPont Test Plan: Nikon, AMD 193 nm phases + binary 248 2006 Mar Att-PSM for Enhanced NMOS, Apr 4 Phase Att-PSM for PI

11. FLCC 04/05/2006 FLCC - Overview 11 2006 Vanilla CMOS Wafer Fab at Cypress

12. FLCC 04/05/2006 FLCC - Overview 12 FLCC Seminars and Tutorials (2:10-3PM M) 9/8/03Kickoff meetingAll 2/7/05Seminar on LithographyVideoNeureuther 2/14/05Metrology SPIE PreviewsVideoSpanos 3/7/05Modeling of CMPVideoDornfeld 3/28/05Fluid Modeling of PlasmasVideoGraves 4/18/05DiffusionVideoHaller 5/2/05Tutorial on Wireless Wafer TechnologyVideoSpanos 9/19/05LithographyVideoNeureuther 11/14/05Process IntegrationVideoKing 10/17/05CMP SlurryVideoDoyle 10/31/05LithographyVideoNeureuther 11/14/05Plasma EtchingVideoChang 11/28/05Kalman FilteringVideoPoolla 1/23/06Kickoff Year IIIVideoAll 2/6/06Test MasksVideoNeureuther 3/6/06CMP Colloidal EffectsVideoTalbot 3/20/06Advanced Substrates for CMOSVideoCheung 32 talks (19 video) April 17 May 1

13. FLCC 04/05/2006 FLCC - Overview 13 Jason Cain PhD, Tanuja Gopal PhD, Edward Hwang PhD, Mark Nierode M.S., Garth Robins, PhD, Hugh Silvestri PhD, Ling Wang, PhD and 2 UG Joe Chien and Hideaki Oshima The Student Team CAMPUSSTUDENTAREAADVISOR BerkeleyAlex De FeoCMPDornfeld BerkeleySunghoon LeeCMPDornfeld BerkeleySangkee Min (Post Doc)CMPDornfeld BerkeleyShantanu TripathiCMPDoyle San DiegoRobin IhnfeldtCMPTalbot BerkeleyZheng Xin (Eric) LiuProcess IntegrationCheung BerkeleyChristopher LiaoProcess IntegrationCheung BerkeleyPankaj KalraProcess IntegrationKing BerkeleyEric ChinLithographyNeureuther BerkeleyJuliet HolwillLithographyNeureuther BerkeleyGregory McIntyreLithographyNeureuther BerkeleyWojtek PoppeLithographyNeureuther BerkeleyPaul FriedbergSensors & ControlSpanos BerkeleyVorrada LoryuenyongSensors & ControlCheung BerkeleyKurt MoenSensors & ControlSpanos BerkeleyJing XueSensors & ControlSpanos BerkeleyQiaolin ZhangSensors & ControlSpanos and Poolla Los AngelesJohn HoangPlasma TechnologyChang BerkeleyCheng-Che HsuPlasma TechnologyGraves BerkeleyJ.T. GudmundssonPlasma TechnologyLieberman BerkeleyEmi KawamuraPlasma TechnologyLieberman BerkeleySungjin KimPlasma TechnologyLieberman BerkeleyAlan WuPlasma TechnologyLieberman

14. FLCC 04/05/2006 FLCC - Overview 14 The Faculty Team Jane Chang ChEUCLA Plasma mechanisms and feature modeling Cheung, NathanEECSUCBPlasma modeling, diagnostics, surface interactions Dornfeld, DavidMEUCBChemical-Mechanical Planarization Doyle, FionaMatSciUCBChemical-Mechanical Planarization Graves, DavidChEUCBPlasma modeling, diagnostics, surface interactions Haller, EugeneMatSciUCBDopant and Self-Diffusion in Si and SiGe Alloys King, Tsu-JaeEECSUCBNovel Electron Devices Lieberman, Michael EECSUCBRF sources and E&M plasma modeling Neureuther, AndrewEECSUCBPattern Transfer Modeling/Simulation Poolla, KameshwarMEUCBAEC/APC and Metrology Spanos, CostasEECSUCBIC Process Metrology, Diagnosis and Control Talbot, JanCEUCSDChemical-Mechanical Planarization

15. FLCC 04/05/2006 FLCC - Overview 15 The Staff Team http://flcc.berkeley.edu Access restricted by password Principal Investigator Andrew Neureuther 510 Cory Hall, ERL phone: (510) 642-4590 fax: (510) 642-2739 neureuth@eecs.berkeley.edu System Support Changrui Yin 550 Cory Hall, phone: (510) 643-7542 fax: (510) 642-2739 changrui@eecs.berkeley.edu Contract Management Ellen Lenzi 558 Cory Hall, ERL phone: (510) 643-9665 fax: (510) 642-2739 lenzi@eecs.berkeley.edu Administrative Support Charlotte Jones 558 Cory Hall, ERL phone: (510) 642-1818 fax: (510) 642-2739 cmjones@eecs.berkeley.edu Teleconference 1-888-446-3559 code: 510-643-2834