1. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 Daniel Dobos University Dortmund 13.08.03 – E4 ATLAS-/Si-Meeting Pixel Testbeam July 2003

2. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 Testbeam setup testbeam setup moved some meters upstream to the NA45 area since may testbeam new pixel telescope (Genova telescope) inserted for high intensity runs in may testbeam and is now used together with the Bonn Telescope for particle tracking diode in the Genova Telescope generates additional trigger signal to the scintillator and Bonn Telescope trigger and increases particle scattering testing of modules requires cooling them in the testbeam box – testing single chips uncooled at room temperature new nitrogen flooded anti frost box prevents condensation on the turning mechanics of the testbeam box

3. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 new copper plates for modules made each module plate is cooled directly with chiller liquid running through a copper tube tried use Lauda RC20 and Julabo FP50 with 2 modules each but Lauda chiller is to weak – FP50 used for all 4 modules better cooling of the nitrogen with conducting it through a first heat exchanger placed directly in the tank of RC20 and through a second heat exchanger in a paper box isolated with polyurethane foam and cooled with the F32 chiller new routing of the nitrogen flow: nitrogen is blown directly to each module and is helping to cool the modules carbon-carbon plates are glued on the FE's side of each module for better heat conduction with additional use of Dow Corning 340 silicone heat sink compound moving of the box and turning of the box can be remote controlled from CR DCS is monitoring the temperatures of the copper plate in two points, the carbon-carbon plate & the module NTC for each module and the air temp. and humidity of the box additionally modules can be tested at about -6°C, needs improvement to reach ATLAS conditions about -10°C Cooling of the modules

4. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 Data flow and power supply each module is connected with a type0 cable with the PP0 replacement card same regulator board used as in Systemtest in Wuppertal in June to power the modules – same problem: VDDA & VDD are oscillating if the cables to the power supplies are to short or the regulator of the power supplies work to fast => high noise first used modularity two (one power supply for two regulator channels) but because of the above mentioned problems changed later to modularity one new PP0 replacement card is used to read out the four modules with a TPCC for each module and can handle up to seven modules DAQ has to handle now 5 TPLLs (one for each module and one for the Genova Telescope) and the BlueBoard Interface for the Bonn Telescope => problem of scalability, DAQ very unstable since last testbeam: doesn't recognises trigger events, hangs during and during stopping runs, hangs when modules are to noisy, sometimes doesn't read out the Genova Telescope => we're losing much time restarting the DAQ, sometimes after every run => needs improvement DCS is working stable – still some little bugs in the DCS software – no problems with controlling the ISEG since new iseg.dll is used documentation is still a problem – more easy problems could be solved by shifters without an expert – but is getting better (DCS and DAQ documentation started) – maybe a website with all important information like schematics of used components and user guides should be set up

5. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 new testbeam setup in NA45 area

6. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 modules mounted in the testbeam box

7. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 PP0 replacement card

8. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 first week: irradiated modules Ge18 (Tesla) and Bn12 (CiS) at -6/-7°C 0 deg: all chips at 600 V, for chip D scan in voltage: 700, 600, 550, 500, 450, 400, 350, 300, 250, 200 10 deg: for chips 1, 6, B, C, scan in voltage: 700, 600, 550, 500, 450, 400, 350, 300, 250, 200 20 deg: for chips 1, 6, B, C, scan in voltage: 700, 600, 550, 500, 400, 450, 350, 300, 250, 200 30 deg: for chip 1 scan in voltage: 700, 600, 550, 500, 400, 350, 300, 250, 200 for chips 6, B, scan in voltage: 600, 550, 500, 450, 400, 350, 300, 250, 200 for chip C, scan in voltage: 600, 500, 400, 300 Irradiated modules: second week: irradiated modules Bn12, Ge18 and Ge14 at -6/-7°C Chip C and chip D: 0 deg: 600 Volt 5 deg: 600 V 10 deg: 600 V 15 deg: 600 V 20 deg: 600 V 30 deg: Voltage scan (300, 400, 500, 600, 700) Corner between 4 chips (C32D): Angular scan and Voltage scan Chip 9: 30 deg, Voltage scan Single chips: FEI2_SCC5, FEI2_SCC2, FEI2_IZM_2D at room temperature angular scan with beam centered on each chip (0 deg, 10 deg, 20 deg, 30 deg) high event run 700k at 0 deg for time walk measurements taken

9. 1 Daniel Dobos University Dortmund13.08.03 Pixel Testbeam July 2003 to be analysed...