1. Memory and Register

2. Memory terminology read/write operation volotile/non volatile determine the capacity from input and output timing requirements of ROM and EEPROM and Flash memory RAM and its organization Memory combinding

3. Memory layout in computer high-speed memory for internal low speed for external storage

4. Terminology Cell : electrical circuit used to store a single bit data such as flip-flop circuit Word: compound of bits Byte: 8 bits word Nibble: 4 bits word, half a byte Capacity: describe how many bits can store in a memory module often show in (number of word x word size) form 1K of cell = 2 10 = 1024 cells 1M or cell = 2 20 1G or cell = 2 30 Volatile memory type or memory that always require electrical power unless data will lost.

5. General memory signal and diagram address lines corporate with address bus data line corporate with data bus control lines for memory operation type R/-W read write operation, active low ME : memory enable, active low to enable the memory module other name /CS chip select /CE chip enable /OE : Output Enable : used to enable the RAM data to Data BUS

7. ROM – Read Only Memory designed : holding permanent data / not change frequently Data may enter during manufacturing process Store microcomputer program because it is not volatile also programmed and data such as calculator, appliances, security system etc.

8. ROM block diagram

9. ROM architecture 4 basic part row decoder column decoder register array output buffer

10. Type of ROM Mask-Programmed ROM Programmable ROM (PROM) Erasable Programmable ROM (EPROM) Electrically Erasable PROM (EEPROM) Flash Memory

11. Mask-Programmed ROM program are written by manufacturer for custom specification use photographic negative as mask to control electrically interconnection mask is expensive thus need large quantity for economical cost Cannot be reprogrammed example use: ROM character generator for CRT

13. PROM fusible-link MROM custom programmed by user OTP (One Time Programmable) properties: Once programmed, it cannot be erase.

14. Erasable Programmable ROM (EPROM) When Program need special voltage (typically 10-25V) used amount time (typically 50 msec) Erasable: by Ultraviolet (UV) light examples 2732 : 4K x 8 NMOS EPROM 2764 : 8K x 8

16. Electrically Erasable PROM (EEPROM) Erase by Electrically (high voltage) eg. 21v generated from 5v Write faster than PROM (5usec) During Write, internal circuitry automatically erases the cell Former from Intel ex. 2816, 2864

17. EEPROM symbol

18. Flash memory high density than EEPROM Faster erase and write time than EEPROM 2 mode of erase bulk erase: erase all cell sector erase: specified part of cell to erase e.g. 512 bytes typical 10 usec write time example 28F256A

19. Flash memory example

20. ROM applications Firmware data and program code while power up Data table constant data for look-up eg. store trigonometric tables data converter input one type output with another eg. input BCD code output with 7-segment code

21. ROM application-data converter

22. Auxiliary Storage Because of competitively cost some note book use as a small secondary storage eg. thumb drive

23. RAM-Random Access Memory Read/Write able memory Volatile thus used as temporary storage or as registers 2 kinds when divided by technology Static RAM – Semiconductor RAM Dynamic RAM – Capacitor RAM size step from bytes, 1K, 2K, 4K…

24. RAM architecture

25. RAM operation step Set the address code at address bus Activate /CS (Chip Select) When Write set Data to Data bus R/-Wset low When Read R/-w set high Data comes out to data bus /OE

26. Static RAM timing Read cycle Write cycle

27. Dynamic RAM structure visualized as an array of single-bit cell

28. Each cell representation data often referred the capacity to 1 cell e.g. 4096K x 1 for 1 bit word size, equals to 1024Kx4 (1Meg x 4) for 4 bit word size.

29. Address Multiplexing Owing to its capacity is high, the require a lot of address lines Multiplexing circuit is used to decrease number of address lines add more control signal lines CAS : Column Address Strobe RAS : Row Address Strobe

32. Refreshing Each memory cell has to be refresh periodically (typically 4 ms) or the data will be lost Refresh performs when Read operation By activate the ROW signal address, thus need more external or built in circuit 2 refreshing mode burst mode: normal operation is suspended, refresh contiguous row distributed mode intersperse with normal operation

33. when refresh RAS is activate CAS and R/-W are high

34. word size expanding add more equal in size RAM module

35. Capacity expanding need address select signal often use the high+1 address line

36. Combining chips need decoder, use the higher addresses line as decode signals