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1. Introduction of Photonics 21 2. IMEC: Electronics ICT report Chee Wee Liu, Department of EE, NTU
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Photonics21 Work Groups Photoncis21 is a European Technology Platform found in2005. The members of Photonics21 are representative of European photonics industry, research institutions and colleges. With 1400 members in 49 countries. 7 Work Groups (WGs): 4WGs are application-oriented, 3WGs focus on cross-disciplinary issues. WG1 Information & Communication WG2 Industrial Manufacturing and Quality WG3 Life Science & Health WG4 Lighting & Display WG6 Novel Optical Components & Systems WG7 Research, Education & Training WG5 Security, Metrology &Sensors Application Cross Section Issue
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Energy-Efficient Lighting Toward Low-Carbon Economy -High efficient White LED (>180lm/W). -Low cost LED manufacturing. -Standardised LED light engines. Main application -Illumination and Displays. LED lighting Sodium lamps
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Renewable Energy Generation Demand - 12% market share of EU electricity demand for photovoltaics in 2020. (EPIA) - 20% reduction in carbon dioxide emissions by 2020. Expected Efficiency in 2020 - Improve solar cell efficiency by 30%. - Achieve costs < €0.1per kWh for electricity. Using Laser systems to improve the solar cell’s quality and performance. EPIA: EUROPEAN PHOTOVOLTAIC INDUSTRY ASSOCIATION
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Information & Communication Demand - Network bit rates will be as high as 40Gbps and total transmission capacity per carrier will be in the 100 Tbps range by 2015. (from OIDA’s report) Large optical network system - Faster data communication (broad bandwidth access). On-chip optical interconnect - Si-based optical interconnect is a promising solution for a faster on-chip interconnect. - A novel technology used to replace old Cu metal contact. - Short-term application: inter-chip communication. - Long-term application: large optical integrated circuits (including optical logic devices). Intel‘s optical interconnect OIDA: Optoelectronics Industry Development Association
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Life Science & Health Cancer -Laser surgery (Less invasive). -A faster and reliable cancer detection method (CARS, SRS). Eye cure -Cellular resolution image from within the retina (OCT). Preclinical research -High speed detection (real time 3D image). -High resolution image (angstrom-scale). -High precision. Under White light Under Fluorescent light Optical tomography CARS: Coherent anti-Stokes Raman Scattering microscopy SRS: Stimulated Raman Scattering OCT: optical coherence tomography
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IMEC Research Programs CMOS Scaling ─ focus on (sub-)22nm technology nodes – Lithography, 3D integration, Emerging devices, Logic DRAM devices, Flash memories, Interconnects CMOS-based heterogeneous integration (CMORE) – SiGe MEMS, GaN power electronics and LEDs, Silicon photonics, Power devices, and mixed-signal technologies Human++ ─ healthcare domain – Wearable and implantable body area networks, with low-power components, radios and sensors, life sciences Energy ― Photovoltaics and GaN power electronics Smart Systems – Power-efficient green radios, large-area electronics, wireless autonomous transducer systems, innovative visualization systems
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Lithography ― Water based ArF immersion lithography with double patterning ― Extreme ultra-violet (EUV) lithography (13.5nm wavelength). Logic/DRAM Devices ― High-mobility channel devices (Ge & III/V) ― Logic and dynamic RAM ― Scaling to 22 and 15nm nodes for bulk planar and MuG FETs ― Gate-first/gate-last HKMG (EOT scaling, single or dual dielectric) 22nm Interconnect technology (Cu/low-K) ― Scaling of the dielectric constant & Pitch ― Advanced barrier, seed, copper resistivity and copper contacts ― Barrier and dielectric reliability 3D integration ― through-silicon vias (TSV) Flesh ― floating-gate and nitride-based technology Emerging devices ― Resistive RAM (RRAM), Floating-body RAM (FBRAM) IMEC COMS Scaling TSV
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Power devices and mixed-signal technologies ― High voltage Si-based power devices ― High-speed SiGe:C BiCMOS SiGe MEMS technology platform and design platform ― MEMS packaging ― Testing and Reliability of MEMS Silicon photonics GaN ― GaN epitaxial layer growth ― GaN for RF power amplification and high power conversion ― GaN light-emitting diodes Vision systems ― Hybrid backside illuminated imagers ― Hyperspectral imaging CMOS-based heterogeneous integration (CMORE) More-than-Moore R&D A platform to turn novel concepts into products SOI waveguide
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Wearable and implantable body area networks ― Wireless Sensors and actuators ― Ultralow-power analog interfaces ― Ultralow-power radio ― Micropower generation and storage ― Integration technology for wearable and implantable applications ― Integrated wearable systems Life sciences ― Functional nanosystems ― In-vitro bioelectronic systems ― In-vivo bioelectronic systems ― Biosensors ― Micro total analysis systems Human++ wireless autonomous sensor system
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Photovoltaics (Solar+) ― Crystalline Si solar cells ― High-efficiency PV stacks for terrestrial concentrators (III-V cells) ― Thermovoltaic (TPV) systems for electricity co-generation (Low-bandgap cells) ― Organic photovoltaics GaN ― GaN epitaxial layer growth ― GaN for RF power amplification and high power conversion ― GaN light-emitting diodes Energy high-efficiency photovoltaic stack
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Power efficient green radio ― Cognitive radio: opening new horizons in wireless communication ― 60GHz wireless communication: boosting high-data-rate short-range connectivity ― Ultralow power wireless: getting mega-performance from micro-Watts Vision systems ― Hyperspectral imaging ― Adaptive resilient embedded systems (ARES) ― MultiView Large-area electronics and systems-in-foil ― Organic light-emitting devices ― Organic photovoltaics ― Organic and oxide electronics Smart Systems Wafer with organic RFID
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