1. Status report on the development of a readout system based on the SALTRO-16 chip Leif Jönsson Lund University LCTPC Collaboration Meeting 1.6.2013

2. The SALTRO-16 readout system The SALTRO16 readout system is a highly advanced system with several subsystems including new technology The Large Prototype TPC Detector control

3. The challenges The challenge is not only to bring down the size of the present FEC (17x19cm 2 ) to one that is compatible with the pad size per channel, but in addition to solve the following tasks: Set up a test socket and develop a test socket board for tests of the SALTRO-chips mounted on the carrier boards. Develop an MCM prototype board for functionality tests. Develop the final MCM-board and program the CPLD (Complex Programmable Logic Device) (Yifan Yang, Brussels). Develop a Low Voltage (LV) prototype board for functionality tests. Develop the final LV-board for 8 different voltages per MCM-board i.e. each voltage board has 40 voltage regulators, and transfer a total current of  80 A which gives a power of  110 W. Develop a Detector Control System (DCS) for control and montoring of the MCM- and LV-boards. This includes a master board and slave (5to1) boards. Setup of a serial redout system (SRU). We need help with modification of the firmware. Setup of a monitor system, DOOCS (Oliver Schäfer, Rostock) Constuct the mechanics to integrate the readout electronics, the cooling of the electronics and the HV supply for the gas amplification system (Volker Prahl, DESY).

4. Status of the SALTRO-development in Lund 1) Carrier board 610 SALTRO16 chips have been obtained from CERN (die size; 8.7 x 6.2 mm 2 ). Size of carrier board 12.0 x 8.9 mm 2 Design ready since some time. Specification document ready and sent to the company. Contract with company for mounting components has been signed. Production of PCB:s followed by mounting of components soon. 2) Test socket for testing SALTRO-chips on carrier boards Contact with manufacturer in US established. Will be ordered as soon as we get the exact final dimensions of the carrier board.

5. 3) Test socket board The design is ongoing This board will be an interface between the test socket and the CERN SALTRO test board below

6. 4) The Multi Chip Module (MCM-board) a)The prototype board Design ready PCB will be ordered shortly. This board is a stand alone board which contains one SALTRO-chip in a QFP package and the necessary voltage regulators. There are a several test points and connectors for connecting to a logic analyzer to probe the functionality. With this system we can also develop and test the serial readout. b) The final MCM-board The main components on this board are: 8 carrier boards, connectors to the pad plane, a CPLD, connectors for data transfer and LV-support. The circuit design is ready but we are waiting for the test results from the prototype board before the design is finally fixed

7. Top side Below side 4 mCM-boards on a credit card The final MCM-board

8. Side view of the board assembly Since it was necessary to add two layers (8 instead of 6) the carrier board has become 0.2 mm thicker. It means that the available space for cooling pipes between the MCM and the pad plane is 1.6 mm. Organization of the MCM-boards within a module 3200 channels corresponds to a pad size of 1 x 8.5 mm 2 if the whole area of the module is covered. 1.6 mm

9. 5) The Low Voltage Board a) The final LV-board This board provides low voltage for five MCM-boards on a row on the pad module. There are five rows i.e. five LV-boards per module. The board contains I/O registers to switch on/off the voltage regulators, ADC:s to monitor voltages and currents respectively, and it also contains a temperature sensor. b) The prototype board The PCB is ready and temperature sensor mounted.. RJ45 connectors for serial readout Towards MCM-board LV connection LV connection

10. LV-boards on a pad module The LV-boards also have to be cooled.

11. 6) The Detector ControlSystem a)The master board PCB ready and mounted, contains one microprocessor to communicate with the five 5to1 boards. b)The 5to1 boards PCB:s ready and one complete board mounted, contains one microprocessor per LV-board. The board muonted have been tested and are working

12. The boards are presently under test The test setup

13. Some pictures (taken last week) Master board5to1 board LV-prototype board

14. 8) Serial readout One SRU (Serial Readout System) with power box has been purchased from CERN but is still waiting to be transported to Lund until we know who can help us with the modification of the firmware. Any volonteer from LCTPC??? 7) The monitor system DOOCS We will monitor around 700 parameters from the MCM- and LV-boards per padmodule. For this we propose to use DOOCS, which has been developed at DESY for FLASH and is in use by the DESY LCTPC-group with good experience. We have been promised to get help from Oliver Schäfer to install our system into DOOCS 9) Mechanics First scetch made by Volker Prahl. Further discussions next week

15. Open questions: Requirements on Trigger/data rate. Should we use ALICE DDL or Ethernet for the DAQ? Can we reuse parts of the TPC DAQ/Monitor? Data format? Who can write the SRU firmware and the protocol between the MCM:s and SRU? Should we prepare for running with other detectors, common DAQ? How will we implement the trigger system and power pulsing? Are there more problems to be solved? Everything depends on each other.