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Field Effect Transistors
Unit 2 Field Effect Transistors
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Objectives: BJT v/s FET JFET MOSFET JFET v/s MOSFET
Handling and biasing MOSFETs FET applications CMOS IGBT
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5.1BJT v/s FET: Current controlled – voltage controlled
Bipolar devices – unipolar devices Zi < 1 MΩ - Zi very high (100s MΩ) Less temp. stable – more temp. stable Small size – smaller size More gain – less gain
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5.2 JFET (junction FET): Intro.: JFET simpler device among family
3 – terminal device; 1 controls current through 2 Types – p - channel n - channel
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Construction
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Characteristic:
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Characteristic:
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Transfer characteristics:
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The drain resistance (rd) in saturation region is given by:
(1-VGS / VP)2 Where rd is drain resistance at VGS = 0 & rD is drain resistance at particular VGS
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Relationship between output drain current & input gate-to-source voltage:
VGS ID = IDSS VP
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Effect of temperature:
Carrier mobility ↓ ID ↓ Thus in above steps: T ↑ ID ↓ Negative temperature coefficient Better thermal stability ? JFET temperature ↑ Depletion region width ↓ & Increase channel width ↑ ID ↑ Thus in above steps: T ↑ ID ↑ Positive temperature coefficient
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5.3 Metal oxide FET (MOSFET):
What exactly metal oxide? -MOSFET is insulated from the semiconductor channel by very thin oxide (SiO2) layer These are also known as insulated gate (IG) FET MOSFET types / modes: Depletion MOSFET (De-MOSFET) Enhancement MOSFET (E-MOSFET)
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DE-MOSFET: There is no p-type gate
There is no direct electrical connection between gate & channel Capacitive effect exists between gate & channel
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Symbols:
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Circuit connection: Do not copy
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Characteristics: Enhancement mode / region,
+ve charge carriers from p-substrate contribute Depletion mode / region, Normal operation as MOSFET
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Transfer characteristics:
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Notice that the channel is not fabricated,
E-MOSFET: ha Notice that the channel is not fabricated, It will be generated
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Symbols:
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Working: Capacitive effect induces electrons from p-substrate
Creating a n-channel
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Characteristics:
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E-MOSFET Transfer characteristics:
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Differences between JFET & MOSFET:
Operational modes: JFET -depletion mode DE-MOSFET -depletion / enhancement modes E-MOSFET -enhancement mode MOSFET – input resistance high compared to JFET JFETs have higher drain resistance rd than MOSFETs Leakage current in MOSFET is less compared to JFET MOSFETs are easier to construct & widely used than JFETs
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Handling MOSFETs: SiO2 layer is thin & prone to damage
Due to static charges, potential difference between SiO2 can result in breakdown & establish conduction through it Precautions: Person handling ground himself properly Connect zener diodes, back-to-back as shown
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Biasing MOSFETs: Biasing DE-MOSFETs: Same as JFETs
Example: Fixed bias (page 183)
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Biasing E-MOSFETs: Feedback biasing configuration:
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KVL at input VDD –IG RG - ID RD - VGS = 0 VGS = VDD – ID RD (1) KVL at output VDS = VDD – ID RD (2)
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Voltage divider bias: Assignment #1:
Numerical examples 5.9 & 5.10 on pages 196 & 197
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FET applications: Amplifier Analog switch Multiplexer Current limiter
Voltage variable resistors Oscillators
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Analog switch:
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Multiplexer:
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5.10 Testing FETs: Damaged: Between any two: 0 short circuit
∞ open circuit
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5.13 CMOS devices: CMOS Inverter
Operation: Vin=0 Q2 ON & Q1 OFF Vout=1 Vin=1 Q1 ON & Q2 OFF Vout=0
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Insulated Gate Bipolar (IGBT):
Have positive attributes of BJT & MOSFET Faster switching like MOSFET Lower ON – state voltage like BJT Application / Usage area: SMPS Motor control – as high voltage handling capacity Induction heating control
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Questions: Explain JFET construction, biasing and characteristics, transfer characteristics How better stability is achieved in JFET? Explain DE-MOSFET (construction diagram, symbol, output & transfer characteristics, working) Explain E-MOSFET ( --”--) Difference between JFET & MOSFET Explain biasing methods of De- & E-MOSFETs
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Example 5.8, page 193 Example 5.9, page 196 Explain Applications of FET Explain CMOS inverter -----o0o-----
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