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Facility meeting Oct. 2013 Gopal. Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system.

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Presentation on theme: "Facility meeting Oct. 2013 Gopal. Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system."— Presentation transcript:

1 Facility meeting Oct. 2013 Gopal. Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

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4 Other Issues: PO released for EVG and E-line AMC Resists/chemicals processed depending on the priority Bonder quartz plate received, will be fabricated in CENTUM MJB4 training going on. E-line is down(27 th Oct.)- Colum-Chamber valve not opening Heidelberg Laser Writer to be delivered on 27 th Feb.2014 !

5 Trend chart Oct. 2013 : E-line

6 Trend chart. Oct.2013 : Pioneer

7 Trend chart: Oct.2013: Reisit: AZnLoF Spin coated at 3000rpm for 40 sec. Thickness: 2um Soft bake 1 min at 110C Exposure for 8 seconds in MJB4 Post exposure bake for 1 min at 110C Development for 25 secs (AZ726MIF)

8 Trend chart : Oct.2013 Resist: S1813 Spin coated at 6000rpm for 40 secs Thickness: 1 um Soft bake 1 min at 110C Exposure 50 mJ/cm2 in EVG620 Development for 18 secs (AZ351B 1:4)

9 Resist: S1813 Spin coated at 4000rpm for 40 secs Thickness: 1.3 um Soft bake 1 min at 110C Dose: Lens-5, Filter-3%, Gain-12, D-step-2, Pos speed -1 Development for 38 secs (AZ351B 1:4) Trend chart : Oct.2013

10 Thanks


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