1. Big Science Projects Finnish approach on in-kind packages and future co-operation with GSI/FAIR Antti Heikkilä, Finpro GSI/FAIR, 20 th April 2007 firstname.surname@finpro.fi +41 76 48 74 825 firstname.surname@finpro.fi

2. Common approach for Big Science National coordination

3. Focus on joint R&D Knowledge transfer, learning National and international networking Market pull Idea/need at GSI/FAIR Project Industry Funding Finpro Big Science framework

4. R&D funding in FIN - Tekes Funding for R&D and development projects Feasibility studies for launching, finding opportunities and utilising the results of R&D projects Starting a new technology-based business Tekes Funding alternatives Tekes R&D -funding Funding for product or technology R&D with market potential, 15 – 50% of project budget TULI -funding For defining the business idea, 10k€ VARA -funding For preparing the project, partnering, business and R&D plans, 15k€ TUPAS -funding Funding makes it easier for SME’s to purchase research services, 15k€

5. Detector development co-operation? Silicon strip detectors Double sided Rad hard Thinned  low mass Might be a fruitfull project to pursue for!

6. Industry Patria Aerostructures Advanced composite structures kimmo.myllyoja@patria.fi Exel composite structures to CMS tracker Pentti.paajanen@exel.fi Modulight Transmitter lasers for optical communication 1310 nm, 1490 nm, 1550 nm Petteri.uusimaa@modulight.com VTI Technologies High performance acceleration, inclination and pressure measurement based on MEMS technology, 3-axis measurement Heikki.timonen@vti.fi

7. Detectors and Sensors Oxford Instruments Analytical X-ray fluorescence analyzers Si and GaAs x-ray detectors for space Heikki.sipila@oxinst.fi Detection Technology Detector solutions and subsystems to Medical Imaging and Security and Safety Imaging Mikko.juntunen@deetee.com Aboa Space Research (ASRO) Particle instruments – ESA’s BepiColombo Energetic particle measurements in space and data analysis Eino.valtonen@asro-space.com More companies: http://www.avaruus.info/dyn/file.php?file=26 http://www.avaruus.info/dyn/file.php?file=26 VTT Detectors on 6” wafers, rad hard, thinned detectors, bump bonding of pixel detectors (e.g. Medipix) Ilkka.suni@vtt.fi

8. Conclusions In-kind packages not yet decided Preferably not just HW deliveries – R&D component must be found Industry involved a long time at CERN - the experience can be transfered to GSI/FAIR Finland is very interested in GSI/FAIR R&D projects even outside in-kind packages

9. Thanks! Please contact me if you think the project of yours might need externalfunding and industry! Antti Heikkila Firstname.Surname@cern.ch +41 76 48 74 825