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By: Joaquin Gabriels November 24 th, 2008.  Overview of CMOS  CMOS Fabrication Process Overview  CMOS Fabrication Process  Problems with Current CMOS.

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Presentation on theme: "By: Joaquin Gabriels November 24 th, 2008.  Overview of CMOS  CMOS Fabrication Process Overview  CMOS Fabrication Process  Problems with Current CMOS."— Presentation transcript:

1 By: Joaquin Gabriels November 24 th, 2008

2  Overview of CMOS  CMOS Fabrication Process Overview  CMOS Fabrication Process  Problems with Current CMOS Fabrication  Future Changes in CMOS Fabrication

3  Complementary metal–oxide–semiconductor ( CMOS )  Has many different uses:  Integrated Circuits  Data converters  Integrated transceivers  Image sensors  Logic circuits http:// en.wikipedia.org/wiki/CMOS

4 NAND Circuit

5 http:// lsmwww.epfl.ch/Education/former/2002- 2003/VLSIDesign/ch02/ch02.html

6 1. Create a pattern. 2. Oxidize small layer, about 1µm thick. 3. Place photoresist on top of SiO 2 4. Place mask(pattern) above photoresist and expose it to UV light.

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9 1. Etch away SiO 2 using HF acid or plasma. 2. Remove remaining photoresist with acids.

10  To create a n well:  Diffusion  Heat wafer in Arsenic gas chamber until diffusion occurs.  Ion Implantation  Arsenic or phosphorous are implanted in window.

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12  A thin layer of oxide is deposited.  A thin layer of polysilicon is deposited using Chemical Vapor Deposition (CVD).

13 http://en.wikipedia.org/wiki/Chemical_vapor_deposition

14  Remove oxide layer using acid.  Dope open area using Ion implantation or diffusion.

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17  Optical lithography is limited by the light frequency.  Material limitations  Yield limitations  Space limitations

18  Material changes like using high-k materials.  Design changes  SOI(Silicon On Insulator)  Double Gate (Finfet)  Twin-Tub Process

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23 http://www.fujitsu.com/downloads/MAG/vol39-1/paper02.pdf

24  CMOS Digital Integrated Circuit Design - Analysis and Design by S.M. Kang and Y. Leblebici  http://www.fujitsu.com/downloads/MAG/vol39-1/paper02.pdf  “Introduction to VLSI Circuits and Systems,” John Wiley and Sons, 2002  http://lsmwww.epfl.ch/Education/former/2002- 2003/VLSIDesign/ch02/ch02.html  http://en.wikipedia.org/wiki/Chemical_vapor_deposition  users.ece.utexas.edu/~adnan/ vlsi -05/lec0Fab.ppt  http://en.wikipedia.org/wiki/CMOS  www.usna.edu/EE/ee452/LectureNotes/02- _ CMOS _Process_Steps/08_Simple_ CMOS _Fab.ppt  http://en.wikipedia.org/wiki/Silicon_on_insulator  access.ee.ntu.edu.tw/course/VLSI_design_90second/data/Chapter%203%20Part 2%2003-20-2002.doc

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