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Technology Outlook and Market Transitions for Thin Film Disks Presented by Michael A. Russak, Ph.D., President and CTO Komag, Inc at The IDEMA Financial.

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Presentation on theme: "Technology Outlook and Market Transitions for Thin Film Disks Presented by Michael A. Russak, Ph.D., President and CTO Komag, Inc at The IDEMA Financial."— Presentation transcript:

1 Technology Outlook and Market Transitions for Thin Film Disks Presented by Michael A. Russak, Ph.D., President and CTO Komag, Inc at The IDEMA Financial Conference Westin Hotel, Santa Clara, CA November 4, 2004

2 Ever Shrinking Bit Size Consequences of Shrinking Bit Size –Loss of Signal SNR must improve –Less grains/bitSNR must improve –More sensitive to defects –Thermal stability problems 60 Gb/in 2 2800 x 380 Å 170 (80 Å) 90 Gb/in 2 2000 x 365 Å 150 (70 Å) 120 Gb/in 2 1540 x 350 Å 128 (65 Å) Areal DensityBit size# Grains (size)

3 Perpendicular Areal Density & Capacity vs. Time Year Areal Density (Gb/in 2 ) Conventional SAF Patterned HAMR Long. AD Demo 135 Gb/in 2 853 kbpi, 158 ktpi Perp. AD Demo 111Gb/in 2 850 kbpi, 131 ktpi

4 Current Longitudinal Media Structure Comparison Ru Mag. 1 Mag. 2 Stabilizing Layer SAF Longitudinal Media Design Synthetic Anti-Ferromagnetic Underlayer 1 Underlayer 2 Mag 1 Mag. 2 Conventional Conventional Longitudinal Media Design Underlayer 1 Underlayer 2 Nucleation Layer Carbon Film Carbon Film\

5 Challenges of SAF Media Manufacturing Some capital expense to upgrade existing sputter equipment Addition of more sputter chambers and/cathodes for additional layer deposition Rebalance sputter throughputs Very evolutionary process

6 Areal Density Trend 100 % 20 GB 30 GB 40 GB 60 GB 80 GB 100 GB 120 GB 30 % 160 GB 240 GB

7 Magnetic Spacing Budget GMR Head

8 A New Tribology Environment Design implications:  Head-disk clearance improvement  A more particle tolerant interface  Magnetic design point must be selected to reduce Iw requirement

9 CoCrPt-Oxide Perpendicular Media Structure Inter-layers Substrate (AlMg or Glass) Overcoat CoCrPtO Hard Magnetic Layer (~15 nm) Seed Layer Ru (10 – 40 nm) Ru layer (AFC – coupled) Soft Magnetic Layer (100 – 200 nm)

10 Challenges for Perpendicular Media Manufacturing More difficult than SAF evolution Disparate film thickness, (SUL and multilayer magnetic structures), present throughput challenges Approaches under consideration –Process development to accommodate existing equipment –Buy new equipment –Two tool strategy

11 Discrete Track Recording (DTR) Technology 250nm 550nm 60nm Land-groove cross-section

12 Cross-sectional TEM: Close-up 75 nm Magnetic layers NiP Carbon Longitudinal – Oriented Media

13 BF TEM Image of DTR Disk Perpendicular Media

14 Source: TrendFOCUS 2004 Rigid Disk Media Information System Total Media Market Forecast (000) by Size

15 Disk Form Factor Migrations Desktop and Consumer Electronics (CE) –95 mm Diameter is the mainstay of desktop computer and large capacity CE applications –Exclusively AlMg media with micro-actuators for heads and/or increased thickness to deal with TMR issues

16 Disk Form Factor Migrations Portable PC Applications –65 mm Diameter; Mainstay of portable PC applications –Exclusively glass based media AlMg may be lurking –48 mm based HDD gaining some traction in mini-portable PC applications

17 Disk Form Factor Migrations 48 mm: I-pod & Mini Portable PCs –Exclusively glass based media AlMg may be lurking 27 mm: Mini-I-pod, Cameras, etc. –Exclusively glass based media 21 mm: Cell phones and smaller consumer application –Exclusively glass based media

18 Summary & Conclusions While Areal Density Growth Rate has slowed, technology remains extendable and viable –The physics of recording remains the same –Extend longitudinal recording –Enable perpendicular recording –Discreet track and/or patterned media Mechanical tolerances and requirements have become much more demanding.


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