1. Presentation Topic Darfon Green Plan Implement Schedule  1 st class restricted or banned material SubstanceChinese NameDarfon content Asbestos and its Compounds 石棉及其化合物 No Cadmium and its Compounds 鎘及其化合物 No Chlorofluorocarbons (CFC’s) 氯氟碳化合物 No Chloroparaffins, short-chained (10 – 13 Carbon Chain) 短鏈之氯化石蠟 (10-13 碳鏈 ) No Chromium VI and its Compounds (Packaging Only) 六價鉻及其化合物 ( 僅限包裝 ) No Hydrochlorofluorocarbons (HCFC’s) 氫氯氟碳化合物 (HCFC's) No Lead and its Compounds (Paints or Packaging Only) 鉛及其化合物 ( 僅限油漆或包裝 ) No Mercury (Display Lamps not included) 汞 ( 不含顯示器燈管 ) No Polybrominated Biphenyls (PBBs) and their Ethers/ Oxides(PBDE’s,PBBE’s) 多溴聯苯及其醚類 / 氧化物 No Polychlorinated Biphenyls (PCB’s) and Terphenyls (PCT’s) 多氯聯苯及三聯苯 No Polyvinyl chloride (PVC) (Mechanical Parts over 25 grams Only) 聚氯乙烯 No

2. Presentation Topic Darfon Green Plan Implement Schedule  2 nd class restricted or banned material (Suggest) SubstanceChinese Name Target Date Darfon content Remark Antimony and its Compounds 銻及其合物 No Arsenic and its Compounds 砷及其化合物 No Beryllium and its Compounds 鈹及其化合物 No Chromium VI and its Compounds 六價鉻及其化合物 No Ethylene Glycol Ethers 乙二醇醚類 No Lead and its Compounds 鉛及其化合物 Mar-2004NoTermination N/AYesDielectric powder Nickel and its Compounds 鎳及其化合物 N/AYesBME inner electrode Organophosphorous Compounds 有機磷化物 No Phthalates 鄰苯二甲酸酯或鹽 類 No PVC 聚氯乙烯 No Tetrabromobisphenol A (TBBA) 四溴化二苯酚 No

3. Presentation Topic Darfon Green Plan Implement Schedule  ROHS COMPLIANCE DECLARATION ROHS directive requires that from 1 July 2006 new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). Allowed exemptions are Lead in glass of electronic components. Lead as an alloying element in steel containing up to 0,35 % lead by weight,aluminum containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight. Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead), Lead in electronic ceramic parts (e.g. piezoelectronic devices).

4. Presentation Topic Darfon Green Plan Implement Schedule  Darfon Green Plan Improvement Schedule Darfon MLCC/MLCI chips without contained the 1 st class restricted or banned materials. Darfon MLCC/MLCI chips termination started to apply Lead free plating process from 1998 and met the requirement of Lead free plan. Darfon MLCC/NPO chips still contained Lead material due to NPO chips used low temperature sintering powder. But the content of Lead in dielectric powder is acceptable in Sony standard SS-00259 (ver.2.0). Darfon MLCC/NPO chips will evaluate the Lead free powder with vendor and plan to change before the Q2 of 2004.

5. Presentation Topic Darfon Green Plan Implement Schedule  Darfon MLCC Inspection Report Attched files are the inspection report of Darfon chips by SGS. The inspection items included Pb, Cd, Hg. NPO Series X7R Series Y5V Series