1. 2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned prototypes 2.Radiation damage study 3.Full size prototype sensors 4.Technology choice: Epi vs Oxygen FZ 5.Production (???) 3.ToPix architecture 4.Hybridisation 1.Bump bonding 2.Sensor thinning 1.First thinned prototypes 2.Thinning study 3.FE wafer thinning 5.Readout prototypes 6.Single chip assembly prototype (with ToPix 3???) 7.Module 8.Bus CCEp test

2. 4 Integration Done and to be written Written! Under way To be done 1.Optical data transmission 1.Gbit 2.Optoboards 2.Off-Detector Electronics 1.Counting Room Electronics 2.Integration with Compute-Node 3.Power supply system 1.Powering concept 2.Request for strips and pixel integration 3.Design 1.Power distribution 2.Grounding/Shielding 4.LV Power supplies 5.HV Power supplies 6.Power regulators 1.Design 4.Cables 1.Requirements 2.Signal cable 1.Al/prototype/Results 3.Power cable/selection 4.Routing scheme

3. 4 Integration Done and to be written Written! Under way To be done Mechanical Structures 1.Pixel part 2.Strip part 3.Global Support Cooling system 1.Cooling Plant 2.Cooling Distribution DCS Pixel Mounting 1.Stave assembly 2.Disk assembly 3.Barrel Mounting 4.Disk Mounting Strip Mounting 1.Stave assembly 2.Disk assembly 3.Barrel Mounting 4.Disk Mounting

4. 4 Integration Done and to be written Written! Under way To be done MVD Integration MVD assembly with the tracker MVD installation