1. February, 2007Vaclav Vrba, Prague FVTX Strip Sensor Design General features:  Strip pitch = 75 µm  # chip channels = 128;  chip width = 128 x 75 µm = 9600 µm  Forward disk radial coverage (cca) = 17.0 – 4.5 cm = 12.5 cm  # of chips = 12.5 cm/0.960 cm = 13 chips  azimuthal coverage is by 48 wedges; each wedge covers angle of 7.5 º + 2 x 0.5 mm overlap  each wedge consists of two symmetric parts (each covering 3. 75º) + 2 x 0.5 mm overlap  to place on 4” wafer: 2 types of wedges are needed: inner and outer (next page)  the inner wedge is 7 chips long in the radial direction, the outer wedge is 6 chips long

2. February, 2007Vaclav Vrba, Prague Narrow and wide wedges Four inner wedges on a waferThree outer wedges on a wafer

3. February, 2007Vaclav Vrba, Prague Inner and outer wedges inner outer

4. February, 2007Vaclav Vrba, Prague Wedge layout Zoom in … one chip testing pads (both staged) bonding pads Guard ring Cutting edge

5. February, 2007Vaclav Vrba, Prague 4 chips prototype Zoom in … one chip Cutting edge a) b)

6. February, 2007Vaclav Vrba, Prague 6 inches wafer – 3 wedges

7. February, 2007Vaclav Vrba, Prague 6 inches wafer – 4 wedges

8. February, 2007Vaclav Vrba, Prague Conclusions ccc