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Published byJanis Gilbert Modified over 9 years ago
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Strasbourg, France, 17 December, 2004, seminairGrzegorz DEPTUCH - 1 - MAPS technology decoupled charge sensing and signal transfer (improved radiation tolerance, random access, etc.), small pitch (high tracking precision), low amount of material, fast readout, moderate price, SoC, etc. advantages:
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Strasbourg, France, 17 December, 2004, seminairGrzegorz DEPTUCH - 2 - MIMOSA V 1×10 6 pixel device 0.6 µm CMOS process with 14 µm epitaxial layer, 4 matrices of 512 × 512 pixels read-out in parallel; pixel: 17 × 17 µm 2, diodes: P1 - 9.6 pm 2, P2 - 24.0 pm 2, control logic and all pads aligned along one side, results: Noise mean ENC: 20.74 e - detection efficiency MIPs ( ): 99.3% spatial resolution MIPs ( ): 1.7 µm pixel-pixel gain nonuiformity ~3% MIMOSA V Chip-Detector design MIMOSA = Minimum Ionising Particle MOS APS 3T design Chip design not optimised for any particular application, aimed at relativistic charged particle detection - DESIGNED in joined IReS- LEPSI effort in 2001
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Strasbourg, France, 17 December, 2004, seminairGrzegorz DEPTUCH - 3 - Architecture of the prototype Matrix of sequentially addressed pixels, multiplexed on single output buffer. MIMOSA V 1×10 6 pixel device
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Strasbourg, France, 17 December, 2004, seminairGrzegorz DEPTUCH - 4 - MIMOSA V 1×10 6 pixel device Default Readout Method Readout time = Integration time ~8 ms @ 40 MHz f clk.
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Strasbourg, France, 17 December, 2004, seminairGrzegorz DEPTUCH - 5 - back-side illuminated MIMOSAV – fabrication
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Strasbourg, France, 17 December, 2004, seminairGrzegorz DEPTUCH - 6 - back-side illuminated MIMOSA V - mounting Back-side illuminated thinned M5 device – a test vehicle for demonstration of 20 keV E - detection capability for Beam Monitoring system and other affined applications Bonding pads 85×85 µm 2 inside 10 µm deep wells positive response from microbonding sa - idea of use Au ball-bonding technique – not successful because of pad cratering finally 17 µm Al wedge bonding with special deep wedge was used
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