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A thermo-mechanical petal Sergio Díez Cornell Petal discussion, 24 Oct 2014.

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Presentation on theme: "A thermo-mechanical petal Sergio Díez Cornell Petal discussion, 24 Oct 2014."— Presentation transcript:

1 A thermo-mechanical petal Sergio Díez Cornell Petal discussion, 24 Oct 2014

2 A thermo-mechanical petal  At the Itk it was proposed to build a fully “instrumented” thermo-mechanical petal  Tooling and building experience  Thermal studies  Mechanical studies  QA  …  That will also enable us to produce the first full length petal cores  DESY Hamburg will produce the cores and possibly load them with dummy electronics, but will need some help from many of the petal institutes (more on next slides)  The cores will follow the current petal model 8 Sept 2014Mechanical petal 2

3 Current model 8 Sept 2014Mechanical petal 3

4 Components (I)  Bus tapes  First version of bus tapes produced by Pepe Ber nabeu Follows the standard barrel layout, 200um thickness  Includes just power rails and a few data lines  Vlado Cindro already submitted it to Elgoline With luck we will have tapes in 2-3 weeks  Covers the whole surface  Will be co-cured along with the facings  Facings  45 gsm, 0-90-0 CF orientation, 150 um thick + bus tape (same as staves)  Tim Jones (Liverpool) agreed to co-cure them for us for the first prototypes  Anne-Luise Poley (DESY) will be at Liverpool, she can help with this  Firs skins should be ready before the end of the year, would strongly depend on bus tape manufacture 8 Sept 2014Mechanical petal 4

5 Components (II)  Honeycomb  DESY has in hand both vented CF and N636 honeycomb  First core will be produced with CF, second one with N636  Total thickness = 5.2 mm, will need to be milled on either case  DESY doesn’t have grinding capabilities as of today First cores will be milled, even though we are already working on obtaining a grinding tool and looking for options in industry (such as it was done for the petalets)  High thermal conductivity foam (Allcomp)  Order of K9 allcomp foam, 0.23 g/cc purchased recently, enough for ~10 petals  Will be in hand in ~2 weeks  DESY has equipment for the cutting of the parts and milling (again, not grinding) of the 2.275 mm grooves  Also experience with Pocofoam from petalets 8 Sept 2014Mechanical petal 5

6 Components (III)  Cooling pipes  Ti, 2.275 mm OD, total length required for a petal is 1205 mm  DESY has a few pipes of that diameter, 3m long (2 petals per pipe)  DESY also has Ti pipe bending experience from petalet  E break  Not clear if parts will be in hand in the near future  Possibly 3D-print or manufacture PEEK dummies and glue them to the pipes 8 Sept 2014Mechanical petal 6

7 Components (IV)  Top and bottom closeouts  Will be manufactured in PEEK at DESY workshop  Will accommodate E breaks on the top part  Lateral closeouts (C-channels)  Can be also manufactured in PEEK, but it would probably be more realistic to have them in CF  Will investigate this option in the following days  Locking points  PEEK? Need some input from David here  Adhesive  20-30 % BN-loaded Hysol everywhere in the core (foam to pipe, foam to facing, HC to facing, closeouts, …)  BN load enhances T conductivity and allows a good control of glue viscosity 8 Sept 2014Mechanical petal 7

8 Components: electrical  Sensors  Si dummies from 6” wafers, cut to size at IMB-CNM?  Very little processing (just guides for cut and perhaps marks at hybrid corner locations)  Brass could be used as a backup  Hybrids  FR4 dummy hybrids or real hybrids extremely simplified?  Manufacture once hybrids design is fixed Freiburg, DESY Zeuthen?  ASICs  Glass dummies with heaters from IMB-CNM, or maybe real ASICs?  DC-DC converters  Real size dummy PCB with resistors acting as heaters  EoP boards  Real size dummy PCB with resistors acting as heaters (~ 3 Watts power dissipation)  Glue  SE445, epolite, UV glue (not TRA-DUCT)  No WBs or HCCs 8 Sept 2014Mechanical petal 8

9 Core Tooling  The aim should be producing similar tooling as the barrel community (see Stephanie Yang’s talk at Itk week: https://indico.cern.ch/event/306927/session/0/contribution/20/material/slides/1.pdf https://indico.cern.ch/event/306927/session/0/contribution/20/material/slides/1.pdf  Not really feasible for the first round of petal cores  Most of the operations will be performed in a “manual” way following our expertise with the petalets  T. Jones also produced a preliminary design, that may be a good starting point  Some tools are already being designed (i.e., vacuum jig for facings)  Sensor, hybrid, and ASIC positioning either “by hand” or with very simplified tools  Perhaps the module construction sites could help with this? 8 Sept 2014Mechanical petal 9

10 Flavors  The first TM prototype will follow the “Bear” approach electrically  Kambiz’s 130 hybrids 2 barrel-like hybrids on R0  Different cores  Baseline for this round of cores: CF honeycomb Bus tape covering all surface David Santoyo’s locking points and closeouts  Other alternatives that will come after the first core N636 honeycomb Parylene coating for HV isolation and two bus tapes per facing Alternative locking points Will need quite some help from other institutes if we want to try all this 8 Sept 2014Mechanical petal 10

11 Numbers  DESY would aim for just 1 TM for now, but the idea is to produce several cores  TM tests  Comparison between N636 and CF  QA  How many cores are needed in the near future (~6 months) and for what purpose?  More TMs?  Mechanical “destructive” tests?  Practice insertion?  Schedule is the next topic of the meeting, but we have to come with a plan from now until TDR (2016) for the AUW (see Dave Lynn’s email) 8 Sept 2014Mechanical petal 11


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