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ECE 2799 Electrical and Computer Engineering Design “Prototyping Techniques” Prof. Bitar
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Prototyping Techniques Solderless Breadboards Solderless Breadboards w/ Jumper Wires (Temporary) Non-Copper Clad “Perf-Boards” Non-Copper Clad “Perf-Boards” w/ Pins and Point-to-Point Wiring, Soldering and/or Wire-Wrapping Prototyping Boards (w/ Copper Patterns) Prototyping Boards (w/ Copper Patterns) Point-to-Point Wiring, Soldering and/or Wire-Wrapping Custom Printed Circuit Boards Custom Printed Circuit Boards w/ Copper Traces, Copper Pads and Soldering
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Solderless Breadboards by 3M, RSR Electronics, & Global Specialties
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Solderless Breadboards Pro’s Pro’s Convenient Convenient Quick Quick Easy to Change Easy to Change Con’s Con’s Not Very Permanent Contact Wear Out I MAX ≈ 100-200mA f MAX ≈ 1-10MHz Through-Hole Components Only* * May Use “Surfboards” for SMT Devices * May Use “Surfboards” for SMT Devices
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Solderless Breadboards Good Technique Good Technique Components laid out in a logical fashion Components laid out in a logical fashion Leads cut to avoid short circuits Leads cut to avoid short circuits Jumpers run either horizontally or vertically Jumpers run either horizontally or vertically Correct length wire used Correct length wire used On-board bypass capacitors across power connections and ground On-board bypass capacitors across power connections and ground Bad Technique Bad Technique Components laid out haphazardly Component leads overstressed Leads not cut, risking short circuits Leads cut too short, not making board contact Random length jumpers used Bypass capacitors missing
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Your boards look like this, RIGHT ?
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NON-Copper Clad PERF-orated Boards Vector Electronics, Twin Industries, and Keystone Electronics FR4 Glass Epoxy Phenolic FR4 Glass Epoxy Phenolic Typical Specifications (in) Typical Specifications (in) 0.062 Board Thickness 0.062 Board Thickness 0.042 Hole Diameter 0.042 Hole Diameter 0.1 x 0.1 Hole Pattern 0.1 x 0.1 Hole Pattern Various Sizes Various Sizes $0.25 / in 2 (based on 10”x10” size board)* $0.25 / in 2 (based on 10”x10” size board)* * Increases considerably for copper patterned boards.
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Prototyping Boards w/ Copper Patterns by Vector Electronics www.vectorelect.com/Pattern.htm
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Prototyping Boards w/ Copper Patterns by Vector Electronics www.vectorelect.com/Pattern.htm
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Prototyping Boards w/ Copper Patterns by Vector Electronics www.vectorelect.com/Pattern.htm
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Special Prototyping Boards by RadioShack and RSR Electronics www.radioshack.com/product/index.jsp?productId=2102846
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Special Prototyping Boards by Futurlec www.futurlec.com/ProtoBoards.shtml
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“Surfboards” by Capital Advanced Technologies www.capitaladvanced.com
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DIP Sockets for Soldering by Mill-Max www.mill-max.com
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DIP Sockets for Wire-Wrapping by Mill-Max www.mill-max.com
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SIP and DIP Headers for Interconnection by Mill-Max www.mill-max.com
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Component Header / Component Carrier by Mill-Max www.mill-max.com
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Component Header / Component Carrier by Aires Electronics www.arieselec.com/products/products.htm
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Modules & Development Boards http://www.sparkfun.com/ http://www.sparkfun.com/ http://www.sparkfun.com/ http://www.sparkfun.com/categories/20 http://www.sparkfun.com/categories/20 http://www.sparkfun.com/categories/20 http://www.sparkfun.com/products/8482 http://www.sparkfun.com/products/8482 http://www.sparkfun.com/products/8482
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