1. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Dr. Joseph A. Morgan, P.E. 979-575-0128 ENTC 419 Engineering Technology Capstone I

2. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Web folders are being set up Master page will point to index.html User Names Passwords Need to be changed as per Emma Email to me Team logo Team/Project description See current web pages – capstone.tamu.edu CoB, Week 4 Questions

3. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today All projects include hardware and software design and development Team can be adding value now to meet these critical project elements IP Ownership – Memo

4. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Single point of information for stakeholders Built over time – iterative process Maintained in ONLINE notebook – available at all meetings Elements Problem Statement Concept of Operation Functional Requirements Conceptual Block Diagram Performance Specifications Technology Survey Detailed Functional Block Diagram Sensor Characterization Communications Interfaces/Protocols Deliverables Milestones Gantt Chart Costing Test Matrix Technical Merit

5. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today High-level statement of system need Example: NASA requires control and monitoring of its DC power distribution and utilization system for deep space exploration. Include background information in this section to provide understanding and context

6. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today How will product / system be used ? Describe environment in which the product / system will operate What are the factors that will impact successful demonstration ? Other factors impacting design / development ? This is not a description of the solution – rather how your delivered system will be used by the customer Basis for decisions dealing with requirements, specifications, deliverables, etc

7. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Non-quantitative prototype elements Mandatory aspects of prototype Organized in subsystems Must be complete and cover all aspects of prototype Developed through interactions with sponsor/advisor based on team’s expertise and research EXAMPLE – NASA Wireless Smart Plug

8. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Provide function for multiple DC voltage levels Monitor power system currents at the plug level Set and control power consumption Near real-time monitoring/control Computer-based GUI for human interaction Non-wired communications for configuration, control, monitoring and reporting Small form factor Low power consumption Safely operate with multiple failure modes Deliver multiple NWSP units for evaluation

9. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Depicts requirements in pictorial diagram format Supports interaction, discussion and development of performance specifications Include all elements of system May require multiple diagrams Generally “.jpg” centric Examples

10. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Nivis VersaRouter 900 Master Control 1 sample/second ISA100.11a IEEE 802.15.4 NASA Wireless Smart Plug DSHNetworkDSHNetwork Typical Device Windows OS LabVIEW GUI 120V-DC and/or 28V-DC 120V-DC or 28V-DC

11. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

12. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

13. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

14. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

15. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Quantitative/detailed values for each subsystem to be developed Expands on each of the Functional Requirements Used to transition from Conceptual to Functional Block Diagram Examples

16. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Monitor and switch voltage 28 V DC 120 V DC Monitor power Up to 5 A Accurate to within ± 3% of full scale Set and control power 0 to 5 A 0.1 A increments Trips if greater than set point

17. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Near real-time monitoring/control 1 sample / second Trip within 3 seconds of over-current Graphical User Interface LabView standalone executable (with source code) Operate on Windows 7 based master control computer Non-wired communications Communicate directly with Nivis VersaRouter 900 onboard the DSH Nivis VersaNode 210

18. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Size of AC to DC adapter No larger than 3” x 3” x 3” Low power consumption TI MSP430F5438 Disconnect power from load upon device failure Fuse is blown Processor dies Not connected to master control Deliver and install 5 NWSP units

19. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Potential solution – minimum of three for each major functional requirement Pros and cons – related to performance specifications Selection – indicate and provide justification Example: Determine position GPS Inertial Navigation StarVision Module GPS chosen based on accuracy, cost and ease of integration

20. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Depicts chosen technology solutions with Part numbers, Pin numbers Interfaces Power requirements Etc. Ready to order parts Requesting samples Use to generate schematic Support software development/system testing GUI Mock Ups should also be in this section Examples – See SiV’s SDP

21. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

22. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

23. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

24. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

25. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

26. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today I would highly recommend doing what Dr. Morgan says and learn how to use Altium as soon as possible. The tutorials and online videos help and are a good start; but the quickest and most effective way to learn is having someone familiar with the program being there to answer questions. I wish I would have asked more questions and figured out more of Altiums tricks from the previous 420 students before they graduated.

27. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

28. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

29. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

30. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Originals only – no copies Letterhead MEMORANDUM Headings (correct order and use) Each initial/signature, as appropriate One topic per memo Signatures if required – IP Ownership No signature block at bottom

31. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

32. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today For each sensor: Input/output transfer function Manufacturer data Empirical data collection Explanation of how signal will be processed Hardware (filtering, amplification, etc) Software (multiple samples, conversion, etc) Factors impacting prototype performance Noise, calibration, etc

33. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

34. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today For each CONVERSATION Define the interface to be used Type/Specification (I2C, SPI, parallel, etc) Signals, directions, data rates, etc. Define the protocol to be used in transferring information Explain the communications process Describe the formatting of data/information to be transferred to include packet format, checksum, etc. How is error determined, corrected, accounted for Example conversation

35. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Example Use Bluetooth to communicate from Android phone to Krisys robot Explain how the two devices communicate Diagram the information transfer Indicate how errors will be detected/corrected/retransmitted/etc.

36. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Something of “Value” to the customer Delivered throughout project Alpha, Beta, Final Description Detailed Timeline Graphic of due dates for each deliverable and status updated weekly Example: Schematics will be created and submitted for the remote monitor, expansion module, power inverter, and peripheral interface board. They will be created with the schematic capture program in Multisim. Schematics will be printed on 8.5 x 11 inch sheets of paper and may employ subcircuits to achieve this format. Subcircuits will have input and output labels as well as a meaningful subcircuit title. All symbols created while developing the circuit will be submitted via the Multisim user database in the softcopy format of the schematic. Additionally, symbols from OI Analytical’s current library may be used to aid schematic development. This deliverable will be submitted in both softcopy (design file format and pdf) and hardcopy. Hardcopy printouts will be printed in landscape orientation.

37. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

38. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Due DateDeliverable Member 1/21/11Preliminary Test Plan Laura 1/21/11LabVIEW Launchpad GUI Laura 1/28/11LabVIEW Demo GUIs Bart 2/4/11Hierarchy Chart Bart 2/4/11Rev 0 Schematic Tyler 2/11/11Flowchart Bart 2/18/11Rev 0 Layout Tyler 2/25/11Pseudocode Bart 3/4/11Final Test Plan Laura 3/11/11Rev A Schematic Tyler 3/14/11CDR Document Peggy 3/18/11Rev A Layout Tyler 3/25/11Microcontroller C Code Bart 3/25/11Rev B Schematic Tyler 4/1/11Production Test Program Laura 4/1/11Rev B Layout Tyler 4/8/11Bill of Materials Laura 4/12/11Fully Functional Prototype Peggy 4/22/11Test Report Laura 4/25/11Quick Start Guide Peggy 4/25/11Users Guide Peggy 4/29/11Final Presentation PowerPoint Peggy 4/29/11Wiki Page Bart 4/29/11Final Documentation Peggy Not StartedBehind Today AcceptedIn Progress

39. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today 39 Deliverables Timeline

40. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today An “Event” that indicates significant progress Description Detailed Timeline Graphic of due dates for each milestone and status updated weekly Example: The first milestone is the approval of the completed test plan. The test plan will define the pass/fail parameters for all hardware and software. It will also define the methods/procedures for collecting test data. Extensive testing will guarantee that the prototype meets all requirements and will ensure the project’s success. This milestone will be completed by September 7, 2009. “Demonstrations, Acceptance, Completion”

41. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

42. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today 42 Milestones Timeline

43. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Due DateMilestone 1/21/11Test Plan Created 1/28/11LabVIEW GUI Designed 2/4/11Order Parts 2/11/11Successful SCI Communication 2/18/11Order Rev 0 Board 2/25/11Software Design Complete 3/4/11Populate Rev 0 Board 3/11/11Critical Design Review 3/18/11USB Stack Implementation 3/18/11Order Rev A Board 3/25/11Ethernet Stack Implementation 4/1/11Order Rev B Board 4/8/11Code Complete 4/15/11Final Prototype 4/22/11System Testing Complete 4/29/11Final Demonstration 4/29/11Final Presentation Not Started BehindCompleted In Progress Today

44. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Graphic representing actual calendar dates for the execution of each task Created at the end of the planning process Used by TAT members to assess task accomplishment by individual team members Example

45. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

46. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Direct Costs Indirect Costs Profit Other All costs need to be included Reasonable factors must be applied Only include those costs that are part of the project, not part of the planning process

47. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Table that relates functional/performance requirements to tests that will be performed Each test must satisfy one or more requirements All requirements must be tested

48. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today

49. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Present technical merit factors Indicate current project assessment value Provide justification of each item used in project technical merit Must be detailed and specific to what the project requires and the team will be delivering Poor description/justification translates to reduced technical merit

50. ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGY TEXAS A&M UNIVERSITY Innovating tomorrow’s products and systems today Dr. Morgan: Today I spent all day in a mandatory project management training course at work. I knew everything already because I took ENTC 419. We went over Gantt charts, scope triangle, risk, earned value, etc. Just thought I would let you know that what you taught me carries directly over to the real world. Let your students know that nothing changes. I know you know, but they might not. Steven Lopez