1. 1 The STAR Pixel Upgrade H. Wieman Heavy Quark Workshop LBNL 1-Nov-2007

2. 2 topics  Pixel silicon  Readout uSTAR telescope tests  Mechanical Integration in STAR  Pixel mechanical

3. 3 Some pixel features Pointing resolution(13  12GeV/p  c)  m LayersLayer 1 at 2.5 cm radius Layer 2 at 8 cm radius Pixel size30  m X 30  m Hit resolution8.7  m Position stability10  m Radiation thickness per layer X/X0 = 0.28% Beam pipe radiation thickness X/X0 = 0.14% Number of pixels164 M Integration time (affects pileup) 0.2 ms Rapid installation and replacement Reproducible positioning

4. 4 Silicon program IReS/LEPSI  IPHC (Strasburg) M. Winter C. Hu C. Colledani W. Dulinski A. Himmi A. Shabetai M. Szelezniak I. Valin

5. 5

6. 6 Grzegorz Deptuch MIMOSTAR 2/3 technology

7. 7 IPHC Functional Sensor Development Data Processing in RDO and on chip by generation of sensor. The RDO system design evolves with the sensor generation. 30 x 30 µm pixels CMOS technology Full Reticule = 640 x 640 pixel array Mimostar 2 => full functionality 1/25 reticule, 1.7 µs integration time (1 frame@50 MHz clk), analog output. (in hand and tested) All sensor families: Phase-1 and Ultimate sensors => digital output (in development) Leo Greiner

8. 8 Phase 1 / Ultimate technology (MIMOSA8/16/22) forward bias diode Discriminator

9. 9 IHCP Marc Winter et al

10. 10 IHCP Marc Winter et al

11. 11 IHCP Marc Winter et al

12. 12 IHCP Marc Winter et al

13. 13 Silicon summary, development of STAR pixels  Understand MIMOSTAR 3 yield issues  Fab Phase 1 based on MIMOSA16/22 technology (digital output, no zero suppression)  Fab Ulitimate based on MIMOSA16/22 and SUZE technology (digital with zero suppression)  Issues  Dead center MIMOSTAR 3 uPursue large area gate oxide hypotheses, change layout  Radiation hardness (bulk damage) uReduce temperature uInvestigate silicon improvements

14. 14 Readout program LBNL Leo Greiner Xiangming Sun Michal Szelezniak Thorsten Stezelberger Chinh Vu Howard Matis

15. 15 Prototype 3 Sensor Telescope Our goal was to test functionality of a prototype MIMOSTAR2 detector in the environment at STAR in the 2006-2007 run at STAR. We obtained information on:  Charged particle environment near the interaction region in STAR.  Performance of our cluster finding algorithm.  Performance of the MIMOSTAR2 sensors.  Functionality of our tested interfaces to the other STAR subsystems.  Performance of our hardware / firmware as a system.  The noise environment in the area in which we expect to put the final PIXEL detector. Stack of 3 MIMOSTAR2 pixel chips, Chip dimension: 4 mm X 4mm, 128 X 128 pixels

16. 16 Telescope Infrastructure at STAR Magnet Pole Tip Insertion tube Electronics Box Beam Pipe

17. 17 On the fly cluster finding first used with MIMOSTAR analog chips

18. 18 Telescope DAQ

19. 19 Distribution of track angles in Mimostar2 telescope Xiangming Sun Michal Szelezniak

20. 20 RDO Board(s) New motherboard Two board System – Virtex-5 Development board mated to a new HFT motherboard Xilinx Virtex-5 Development Board Digital I/O LVDS Drivers 4 X >80 MHz ADCs PMC connectors for SIU Cypress USB chipset SODIMM Memory slot Serial interface Trigger / Control input FF1760 Package 800 – 1200 I/O pins 4.6 – 10.4 Mb block RAM 550 MHz internal clock Note – This board is designed for development and testing. Not all features will be loaded for production. Leo Greiner

21. 21 1 m – Low mass twisted pair 3 m - twisted pair System Design – Physical Layout Sensors, Ladders, Carriers (interaction point) LU Protected Regulators, Mass cable termination RDO Boards DAQ PCs Magnet Pole Face (Low Rad Area ?) DAQ Room Power Supplies Platform 30 m 100 m - Fiber optic cables Leo Greiner

22. 22 Data Rates - Parameters  Rates as per Jim Thomas, L = 3 x 10 27 for Phase-1, L = 8 x 10 27 for Ultimate.  2.5 hits / cluster.  1 kHz average event rate.  10 inner ladders, 30 outer ladders.  Factor of 1.6 for event format overhead (can be lowered).  No run length encoding. 61.56.0 157.015.0 R = 2.5 R = 8.0 200 us 640 us Hits / Sensor at L = 8 x 10 27. Integration Time Radius Leo Greiner

23. 23 Data Rates  Ultimate => 49.7 MB / s raw addresses. => 79.5 MB / s data rate.  Phase–1 => 59.6 MB / s raw addresses => 95.4 MB / s data rate. The dead-time is primarily limited by the number of externally allocated readout buffers! Leo Greiner

24. 24 Mechanical Program  Eric Anderssen, LBNL engineer working on ATLAS pixels is phasing into our pixel program – full time in January 2008 (carbon composite expert)  Contracted ARES company for analysis on cooling, precision mount design and refinement of ladder stability. uPhone meetings weekly uFirst results –  we will need a sub ambient cooling system  simplified precision mount uFirst stage report due in January  Addressing two items: uCylinder modifications for integration of GEMS, IST and Pixels uPixel mechanical design

25. 25 Cut Apart Current Cones August 2009  Old East Cone and most of Beams to be reused to support New West Cone  Old West cone refurbished into New East Cone in Berkeley  Cut Carbon Elliptical Beams avoiding Al Insert 25 Send to BerkeleyKeep at Brookhaven Eric Anderssen

26. 26 Modified East Cone and Install with New West Cylinder  View as Temporary Fix—Should be ACAP (as cheap as possible) uSupports end of New West Cone/FGT uReplicates Old Beam Pipe Interfaces uIncludes SSD if required uOnly for summer ’09 to ‘10  Wholly Machined/Bonded Solution uTooling to locate Buck Plate while bonding is required… Buck Plate aimed for Easy Swap of replacement Some Tooling Required… ~1.5m Eric Anderssen

27. 27 Goal—Swap-in Replacement and Install pixels – summer 2010 Should Be Same Length New East Cone with Cylindrical Shell made from Old West Cone Swap in by matching Bolted Interface to New West Cone… Modification Will Take Up Length… Include SSD interface On Shell Eric Anderssen

28. 28 ISC fits inside and is supported by the cone ISC supports IST on outside ISC ISC supports pixel and beam pipe inside Inner Support Cylinder (ISC)

29. 29 Pixel support structure – changes and progress 2.5 cm radius 8 cm radius Inner layer Outer layer End view ALICE style carbon support beams (green)

30. 30 cable bundle connection typenumber of pairsallocated pair diameter Analog power16mm Digital power16mm signal40.64mm sync1.64mm clk1.64mm marker1.64mm Jtage (5 conductors)3.64mm

31. 31 Conceptual mechanical design

32. 32 Pixel placement concept  Detector assembly slides in on rails  Parallelogram hinges support the two detector halves while sliding  Cam and follower controls the opening of the hinges during insertion and extraction  Detector support transfers to kinematic dock when positioned at the operating location pixel support hinges spring loaded cam followers and linear cam slide rails sliding carriage

33. 33 Hinge analysis

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36. 36 Two sector patch installation – summer 2010

37. 37 Final installation, complete cylinders Aug 2011 End

38. 38 yearly dose numbers  Au + Au  RHIC II luminosity: 7X10 27 1/(cm 2 sec)  Weeks per year operation: 25  Fraction of up time: 60%  radius: 2.5 cm upion dose: 73 kRad uUPC electron dose: 82 kRad uTotal dose: 155 kRad uTLD measured projection: 300 kRad  radius: 8 cm upion dose: 7 kRad uUPC electron dose: 2 kRad uTotal dose: 9 kRad uTLD measured projection: 29 kRad

39. 39 Grzegorz Deptuch

40. 40 MIMOSA8, Yavuz Degerli et al IRes/LEPSI DAPNIA/SEDI