1. Albumin Analysis by Potentiometric Method

2. Results

3. WE: Cu (sputter)

4. WE: graphite (sputter)

5. WE:graphite + polymer film(DMAEMMC/TEGDMA:1/19, adhesive:epoxy resin, initiator:benzoin)

6. WE: 氧化鋁板 +polymer film(DMAEMMC/TEGDMA:1/25,adhesive:TEGDMA, initiator:benzoin)

7. WE: 氧化鋁板 +polymer film(DMAEMMC/TEGDMA:1/12, adhesive:epoxy resin, initiator:CHP ＋ TMEDA)

8. WE: 氧化鋁板 + polymer film(DMAEMMC/TEGDMA:1/12, adhesive:epoxy resin, initiator:CHP ＋ TMEDA)

9. WE: 氧化鋁板 +polymer film(DMAEMMC/TEGDMA:1/35, adhesive:epoxy resin, initiator:CHP ＋ TMEDA)

10. WE: 氧化鋁板 + polymer film(DMAEMMC/TEGDMA:1/35, adhesive:epoxy resin, initiator:CHP ＋ TMEDA)

11. WE: 氧化鋁板 + polymer film(DMAEMMC/TEGDMA:1/25, adhesive:epoxy resin, initiator:CHP ＋ TMEDA)

12. WE: 氧化鋁板 + polymer film(DMAEMMC/TEGDMA:1/25, adhesive:epoxy resin, initiator:CHP ＋ TMEDA)

13. Adhesion Testing

14. WE: 氧化鋁板 + polymer film(DMAEMMC/TEGDMA: 1/35, adhesive:epoxy resin, initiator:CHP ＋ TMEDA)

15. WE: 氧化鋁板 + polymer film(DMAEMMC/TEGDMA:1/35, adhesive:epoxy resin, initiator:CHP ＋ TMEDA)

17. Conclusions

18. 1. 就 crosslinker 而言, 親油性的 (TEGDMA) 優於親水 性 (PEG400DMA). 2. 白蛋白的濃度改變與電位變化之間具有線性關係. 3. Epoxy resin 所得實驗結果優於 TEGDMA. 4. Polymer film 與氧化鋁板間會有局部膨脹與脫落現 象, 影響實驗結果.

19. END