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TRANSIENT CONDUCTION Lumped Thermal Capacitance Method Analytical Method: Separation of Variables Semi-Infinite Solid: Similarity Solution Numerical Method:

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Presentation on theme: "TRANSIENT CONDUCTION Lumped Thermal Capacitance Method Analytical Method: Separation of Variables Semi-Infinite Solid: Similarity Solution Numerical Method:"— Presentation transcript:

1 TRANSIENT CONDUCTION Lumped Thermal Capacitance Method Analytical Method: Separation of Variables Semi-Infinite Solid: Similarity Solution Numerical Method: Finite Difference Method

2 Lumped Thermal Capacitance Method negligible spatial effect volume V surface area A s

3 excess temperature: initial condition:

4 thermal time constant : convection resistance : lumped thermal capacitance Thermocouple?

5 Transient temperature response of lumped capacitance solids for different thermal time constant  t

6 Seebeck effect and Peltier effect AB T2T2 T1T1 V + - Seebeck effect (1821) AB ↑ I Peltier effect (1834) T2T2 T1T1

7 volume V surface area A s total energy transfer in time t

8 Validation of Lumped Capacitance Method Bi : Biot number

9 Transient temperature distributions for different Biot numbers in a plane wall symmetrically cooled by convection

10 When spatial effect is negligible. L c : characteristic length Fo : Fourier number(dimensionless time)

11 Find: Total time t t required for the two-step process Assumption: Thermal resistance of epoxy is negligible. Example 5.3 Step 1: HeatingStep 2: Cooling t = 0 T i,o = 25°C t = t c t = t e t = t t 300 s T c = 150°C T e = ?°C T t = 37°C heating cooling curing aluminum T(0) = T i,o = 25°C T(t t ) = 37°C epoxy  = 0.8 2L = 3 mm

12 Epoxy Biot numbers for the heating and cooling processes Aluminum: Thus, lumped capacitance approximation can be applied. q conv q rad T(t)T(t)

13 Heating process Curing process Cooling process t c = 124 s T e = 175°C t t = 989 s t = 0 T i,o = 25°C t = t c t = t e t = t t 300 s T c = 150°C T e = ?°C T t = 37°C heating cooling curing Numerical solutions

14 Total time for the two-step process : Intermediate times :

15 Plane wall with convection Separation of Variables LL x i.c. b.c. Analytical Method

16 Dimensional analysis dimensionless variables Fo : Fourier number, Bi : Biot number L: m [L]

17 Equation in dimensionless form

18 initial condition boundary conditions

19 Drop out * for convenience afterwards

20 boundary conditions

21 b.c.

22 initial condition

23 Approximate solution at x = 0, Bi = 1.0 Fo = 0.1Fo = 1  1 1.03930.5339  2 -0.0469-1.22 10 -5  3 0.00074.7 10 -20 When

24 See Table 5.1 Approximate solution When

25

26 total energy transfer (net out-going) maximum amount of energy transfer

27 Radial systems with convection i.c. b.c. r or roro

28 dimensionless variables Drop out * for convenience afterwards i.c. b.c. or

29

30

31 Since

32 initial condition

33 Approximate solution Total energy transfer (net out-going) Since V =  L, dV = 2  rdrL

34 Assumption: Pipe wall can be approximated as plane wall, since L << D. Example 5.4 oil insulation Steel, AISI 1010 Find: 1) Biot and Fourier numbers after 8 min 2) Temperature of exterior pipe surface after 8 min, T(0, 8 min) 3) Heat flux to the wall at 8 min, (8 min) 4) Energy transferred to pipe per unit length after 8 min,

35 oil

36 1) Bi and Fo at t = 8 min With Bi = 0.313, the lumped capacitance method is inappropriate. However, since Fo > 0.2, approximate solution can be applicable. 2) T(0, 8 min) AISI 1010: from Table 5.1

37 4) The energy transfer to the pipe wall over the 8-min interval 3)

38 i.c. b.c. TiTi x TsTs similarity solution similarity variable 1 1 x 1 =  (t 1 )x 2 =  (t 2 ) Semi-Infinite Solid: Similarity Solution

39 Scaling analysis TsTs TiTi x x =  (t) Let

40

41

42 merge into one i.c. b.c. TsTs TiTi x x =  (t)

43 Similarity solution integrating factor or

44 erfc : complimentary error function error function:

45 TsTs TiTi x 1 =  (t 1 ) x 2 =  (t 2 ) x


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