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MALVINO Electronic PRINCIPLES SIXTH EDITION
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MOSFETs Chapter 14
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Depletion-mode MOSFET
Metal oxide insulator n Source Gate Drain VDD VGG p Drain n VDD Gate p VGG Source (depletion mode) (enhancement mode) Since the gate is insulated, this device can also be operated in the enhancement mode.
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MOSFETs Current flows through a narrow channel between the gate and substrate. SiO2 insulates the gate from the channel. Depletion mode forces the carriers from the channel. Enhancement mode attracts carriers into the channel. E-MOSFETs are normally-off devices.
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n-channel E-MOSFET Drain n D VDD Gate p G n S VGG Source
Gate bias enhances the channel and turns the device on.
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n-channel E-MOSFET The p-substrate extends all the way to the silicon dioxide. No n-channel exists between the source and drain. This transistor is normally off when the gate voltage is zero. A positive gate voltage attracts electrons into the p-region to create an n-type inversion layer and turns the device on.
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p-channel E-MOSFET Drain p D VDD Gate n G p S VGG Source
Gate bias enhances the channel and turns the device on.
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p-channel E-MOSFET The n-substrate extends all the way to the silicon dioxide. No p-channel exists between the source and drain. This transistor is normally off when the gate voltage is zero. A negative gate voltage attracts holes into the n-region to create an p-type inversion layer and turns the device on.
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n-channel E-MOSFET drain curves
Ohmic region Constant current region ID +10 V +5 V VGS(th) VDS
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n-channel E-MOSFET transconductance curve
ID Ohmic ID(sat) Active VGS VGS(th) VGS(on)
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Gate breakdown The SiO2 insulating layer is very thin.
It is easily destroyed by excessive gate-source voltage. VGS(max) ratings are typically in tens of volts. Circuit transients and static discharges can cause damage. Some devices have built-in gate protection.
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Drain-source on resistance
VGS = VGS(on) Qtest ID(on) VDS(on) ID(on) RDS(on) = VDS(on)
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Biasing in the ohmic region
VGS = VGS(on) +VDD Qtest ID(on) ID(sat) RD Q VGS VDD ID(sat) < ID(on) when VGS = VGS(on) ensures saturation
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Passive and active loads
+VDD +VDD RD Q1 vout vout Q2 vin vin Passive load Active load (for Q1, VGS = VDS)
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VGS = VDS produces a two-terminal curve
ID VGS +5 V 5 V 10 V 15 V VDS
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Active loading in a digital inverter
+VDD VDS(active) ID(active) RDQ1 = Q1 0 V +VDD vout 0 V +VDD Q2 vin It’s desirable that RDSQ2(on) << RDQ1. (The ideal output swings from 0 volts to +VDD.)
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Complementary MOS (CMOS) inverter
+VDD Q1 (p-channel) 0 V +VDD 0 V +VDD vin vout Q2 (n-channel) PD(static) @ 0
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CMOS inverter input-output graph
vout VDD VDD 2 Crossover point PD(dynamic) > 0 vin VDD 2 VDD
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High-power EMOS Use different channel geometries to extend ratings
Brand names such as VMOS, TMOS and hexFET No thermal runaway Can operate in parallel without current hogging Faster switching due to no minority carriers
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dc-to-ac converter vac Power FET +VGS(on) 0 V
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dc-to-dc converter vdc Power FET +VGS(on) 0 V
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