1. ITC-irst Researchers 217 Post docs 13 PhD students20 250 MM area FCS – Physics & Chemistry of Surfaces and Interfaces MIS – Microsystems IT area SRA – Automated Reasoning Sytems SSI – Interactive Sensory Systems TCC – Cognitive and Communication Technologies

2. MIS Microsystems Head of Department: Mario Zen The department designs and realises silicon microsystems, especially: silicon particle detectors; sensors for bio-medical and environmental applications; micro-electro-mechanic systems (MEMS) for industrial and consumer applications; electro-optic microsystems for vision and non- destructive measurements.

3. Low temperature Wafer Bonding MEMS Technological fabrication modules Silicon anisotropic etching with TMAH solution Composite suspended membranes Lithography with thick film of photoresist Gold Electrodeposition

4. Clean Room Fabrication: the Lab. covers an area of 500 sqm (250 of which are in class 10) Furnaces 11 horizontal furnaces (diffusion,LPCVD depositions, Si3N4, Polysilicon, TEOS, BPSG and LTO) Implanter “Varian E 220 medium current” Lithographic Sector : Mask Aligner A “Karl Suss MA 150 BSA” and Resist processing systems “SVG 8600” and “EVG 150”. Etching Sector: Wet etching and Dry etching (Aluminium, Silicon dioxide Silicon nitride, Polysilicon etching) Metalization: Varian 3180 sputtering and Ulvac EBX-16C evaporator Dicing Disco DAD 2H-6T Testing HP 4062UX + EG2001CX - custom modified for double-side wafer Karl Suess PM8 - custom modified for double-side wafer testing

5. Lithographic Sector Mask Aligner A “Karl Suss MA 150 BSA” Resist processing systems “SVG 8600” and “EVG 150”.

6. Etching Sector Dry etching Aluminium, SiO 2, Si 3 N 4 and Poly Wet etching

7. Metalization Varian 3180 sputtering Ulvac EBX-16C evaporator

8. Furnaces Furnaces 11 horizontal furnaces diffusion,LPCVD depositions, Si3N4, Polysilicon, TEOS, BPSG and LTO

9. Ion Implanter Varian E 220 medium current

10. Inspection Sector Olympus MX50 microscope Leitz MPV-SP Interferometer for thickness control. 4 point Napson RT8-8 for resistivity control. Plasmos SD 2300 Ellipsometer for refraction index control

11. Packaging Sector Ultrasonic Gold Ball Bonder (K&S 4124). Disco DAD 2H-6T

12. testing Automatic wafer-level tester cassette-to-cassette, double-side testing, automatic sorting & inking, HP 4062UX + EG2001CX - custom modified for double- side wafer testing Manual Probe Station Karl Suess PM8 Electro-optical test system

13. New Equipments Now in clean room PECVD STS for nitride and oxide deposition Tegal 6510 dry etch system for metal and poly&nitride Plan for the next tree years Stepper wafer bonder dry etch system for metal deep RIE Boron deposition from solid source