1. Technology Road Map Imaging And Etching Trace / Space Outers * Current
* Half Ounce Copper
Trace / Space Outers *
Current
12 Months
24 Months
Production
Engineering
0.0040” / ”
0.0015” / ”
0.0035” / ”
0.0012” / ”
0.0030” / ”
0.0010” / ”
Trace / Space Inners *
Current
12 Months
24 Months
Production
Engineering
0.0035” / ”
0.0015” / ”
0.0030” / ”
0.0012” / ”
0.0025” / ”
0.0010” / ”
Trace Width Tol. Inners*
Current
12 Months
24 Months
Production
Engineering
+/ ”
+/ ”
+/ ”
+/ ”
+/ ”
+/ ”
Controlled Impedance Tolerance *
Current
12 Months
24 Months
Production
Engineering
+/- 10%
+/- 2%
+/- 7%
+/- 2%
+/- 5%
+/- 2%
3/21/06

2. Technology Road Map Imaging And Mechanical Layer-to-Layer Registration
Current
12 Months
24 Months
Production
Engineering
+/ ”
+/ ”
+/ ”
+/ ”
+/ ”
+/ ”
Signal Pad Annular Ring Inners
Current
12 Months
24 Months
Production
Engineering
0.0040”
0.0030”
0.0035”
0.0025”
0.0030”
0.0020”
Plane Clearance Inners
Current
12 Months
24 Months
Production
Engineering
0.016”
0.011”
0.014”
0.010”
0.012”
0.008”
Copper Feature to Board Edge
Current
12 Months
24 Months
Production
Engineering
0.0050”
0.0030”
0.0045”
0.0025”
0.0040”
0.0020”
3/21/06

3. Technology Road Map Laser Drilled Microvias
Minimum Hole to Capture Pad
Current
12 Months
24 Months
Production
Engineering
0.006” / 0.010”
0.003” / 0.006”
0.005” / 0.009”
0.002” / 0.006”
0.004” / 0.008”
0.002” / 0.005”
Aspect Ratio of Blind Microvia
Current
12 Months
24 Months
Production
Engineering
0.5:1
0.7:1
0.6:1
0.8:1
0.7:1
1:1
Copper Filled Microvias
Current
12 Months
24 Months
Production
Engineering No
Evaluation No
Yes
Yes
Multi-Level Microvias (Stacked)
Current
12 Months
24 Months
Production
Engineering No
Yes No
Yes
Yes
3/21/06

4. Technology Road Map Mechanical Number of Layers Current 12 Months
*.0.062” thick board
** thick board
Number of Layers
Current
12 Months
24 Months
Production
Engineering 26 52 28 56 32 60
Smallest Mechanical Drilled Holes*
Current
12 Months
24 Months
Production
Engineering
0.0060”
0.0040”
0.0060”
0.0040”
0.0050”
0.0030”
3/21/06

5. Technology Road Map Soldermask And Screening Minimum Soldermask Web
Current
12 Months
24 Months
Production
Engineering
0.0030”
0.0030”
0.0025”
0.0030”
0.0025”
Minimum Soldermask Clearance
Current
12 Months
24 Months
Production
Engineering
0.0030”
0.0025”
0.0025”
0.0020”
0.0025”
0.0020”
Legend Min Height / Line Width
Current
12 Months
24 Months
Production
Engineering
0.050” / 0.006”
0.040” / 0.005”
0.030” / 0.006”
0.035” / 0.005”
0.035” / 0.005”
0.030” / 0.004”
3/21/06

6. Technology Road Map Plating Aspect Ratio Current 12 Months 24 Months
Production
Engineering
9:1
12:1
10:1
13:1
11:1
14:1
PTH Tolerance (finished hole size)
Current
12 Months
24 Months
Production
Engineering
+/ ”
+/ ”
+/ ”
+/ ”
+/ ”
+/ ”
3/21/06

7. Challenging Technologies
Laser Drilled Blind Micro-vias
3/21/06

8. Extreme Technologies Copper Filled Micro-vias
Via-in-pad Provides Flat Pad Surface for BGA Attach
Flat Surface Optimal For Stacked Micro-vias
Need For Special Plating Chemistry
Need For Special Plating Equipment
Enables Pin Escaping High Pin Count .5 mm Pitch BGAs
Technology Under Development at Several US Shops
3/21/06

9. Extreme Technologies Copper Filled Micro-vias
Current Plating Technology
3/21/06

10. Extreme Technologies Copper Filled Micro-vias Compunetics Test Results
Test Boards Have Been Received From (2) Chemistry Manufacturers
The Smaller The Hole, The More Flat the Plating
Plating of Close to 1:1 on Blind Microvias
Both Manufacturers to Receive Stacked Microvia Tests
Stress Testing In Progress
3/21/06

11. Extreme Technologies Copper Filled Micro-vias Stacked Micro-vias
3/21/06

12. Extreme Technologies Copper Filled Micro-vias Stepped Micro-vias
3/21/06

13. Extreme Technologies High Aspect Ratio Blind Micro-via Plating
Some Designs Require More Dielectric Between Layers 1-2 and Still Require Blind Micro-vias
Current Technology at approx. 0.7:1 Aspect Ratio
Industry Looking for Aspect Ratios of Greater Than 1.25:1
Copper Filled Micro-via Chemistry and Equipment May Help Increase Achievable Aspect Ratios
3/21/06

14. New Equipment Horizontal Plate Through Line
Plate Through Line Designed To Electroless Plate High Aspect Ratio Holes And Blind Laser Drilled Micro Vias
Increased Through Put And Easier Control Of Chemistry
Less Start Up Time For Chemistry
3/21/06